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NL17SZ14DFT2G-L22038

Onsemi

NL17SZ14DFT2G-L22038 by Onsemi

NL17SZ14DFT2G-L22038 by Onsemi is a CMOS Logic Gate with 7.5ns Propagation Delay, 3.3V Nominal Voltage, and 32A Max I (ol). Ideal for applications requiring fast signal processing in small electronic devices due to its compact SMALL OUTLINE package and Schmitt Trigger technology.

Median Price

$0.050

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,997 parts In-Stock

1+ parts

$0.340

100+ parts

$0.131

1k+ parts

$0.067

10k+ parts

-

1,997

$0.340

$0.131

$0.067

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Avnet

USA . 132,000 parts In-Stock

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132,000

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Chip1Stop

Japan . 48,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 33,000 parts In-Stock

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Arrow

USA . 21,000 parts In-Stock

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Verical

USA . 21,000 parts In-Stock

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$0.050

EBV Elektronik

Germany . 9,000 parts In-Stock

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Mouser Electronics

USA . 2,306 parts In-Stock

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$0.044

2,306

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$0.044

Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.071

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900

$0.071

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Digiode

USA . 1,999 parts In-Stock

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$0.323

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Flip Electronics

USA . 34,100 parts In-Stock

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Vyrian

USA . 23,260 parts In-Stock

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IBS Electronics

USA . 9,000 parts In-Stock

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$0.045

9,000

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$0.045

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

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$0.054

6,000

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$0.054

Bristol Electronics

USA . 360 parts In-Stock

1+ parts

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$0.113

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360

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$0.113

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Microfarads

USA . 340 parts In-Stock

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340

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Cyclops Electronics Ltd

UK . 292 parts In-Stock

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292

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19,720 parts In-Stock

1+ parts

$0.032

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19,720

$0.032

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Semicontronic

India . 18,723 parts In-Stock

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$0.032

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$0.031

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$0.031

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18,723

$0.032

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$0.031

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Corohmni

South Africa . 481 parts In-Stock

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$0.038

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481

$0.038

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Aranea Global

USA . 100 parts In-Stock

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$0.070

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$0.067

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100

$0.070

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Continental Prestige Electronics

USA . 6,699 parts In-Stock

1+ parts

$0.071

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$0.069

6,699

$0.071

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$0.069

Argo Parts USA

USA . 2,589 parts In-Stock

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$0.071

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$0.069

2,589

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Corphita

USA . 1,919 parts In-Stock

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$0.306

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$0.306

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Aztec Data Supply Inc.

USA . 3,698 parts In-Stock

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$30.430

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3,698

$30.430

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$34.702

100+ parts

$32.967

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$32.967

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3,000

$34.702

$32.967

$32.967

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Problanco Electronics

Mexico . 7,783 parts In-Stock

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SupplyDigital Components

Austria . 3,897 parts In-Stock

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Kulean Microsystems

USA . 3,162 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,851 parts In-Stock

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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Microchip USA

USA . 495 parts In-Stock

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495

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Overview

Discover the cutting-edge NL17SZ14DFT2G-L22038 by Onsemi, a top-quality logic gate that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry known for their innovative technology and superior craftsmanship, this logic gate is the perfect solution for a wide range of applications. With a fast propagation delay and low power consumption, this product provides exceptional value, efficiency, and precision. Upgrade your electronic projects with the NL17SZ14DFT2G-L22038 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product durable and cost-effective.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast response times.

Surface Mount: YES

Allows for easy installation and saves space on the PCB.

Package Shape: RECTANGULAR

Standard shape for easy integration into existing designs.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages used in electronics.

Load Capacitance (CL): 50 pF

Suitable for driving typical loads in digital circuits.

No. of Terminals: 5

Compact design with a minimal number of terminals for simplified connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Space-saving design ideal for compact applications.

Maximum I (ol): 32 Amp

Can handle high output currents for robust performance.

Propagation Delay (tpd): 15.6 ns

Provides a balance between speed and power consumption.

Maximum Operating Temperature: 125 °C

Can operate in a wide range of temperature environments.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme cold conditions.

Terminal Finish: MATTE TIN

Ensures good conductivity and solderability.

Terminal Position: DUAL

Offers flexibility in PCB layout and routing.

Maximum Seated Height: 1.1 mm

Low profile for space-constrained applications.

Width: 1.25 mm

Compact size for fitting into tight spaces on the PCB.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage for energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Length: 2 mm

Compact length for efficient use of PCB real estate.

Schmitt Trigger: YES

Provides hysteresis to improve noise immunity in digital signals.

Technology: CMOS

Low power consumption and compatibility with a wide range of systems.

Terminal Form: GULL WING

Ideal for surface mounting on PCBs.

Packing Method: TR

Secure packaging for safe transportation and storage.

Terminal Pitch: 0.65 mm

Fine pitch for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Can tolerate high supply voltages for versatility in applications.

Maximum Power Supply Current (ICC): 50 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Logic Gates NL17SZ14DFT2G-L22038 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SZ14DFT2G-L22038 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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