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NL17SZ07XV5T2G

Onsemi

NL17SZ07XV5T2G by Onsemi

NL17SZ07XV5T2G by Onsemi is a CMOS Logic Gate with 1.8V nominal voltage, 12ns propagation delay, and 32A max I (ol). Ideal for military-grade applications, it features a small outline package with dual terminals and operates in temperatures ranging from -55 to 125°C.

Median Price

$0.040

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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DigiKey

USA . 1,195 parts In-Stock

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$0.100

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$0.046

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$0.037

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$0.033

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$0.100

$0.046

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$0.033

Mouser Electronics

USA . 3,142 parts In-Stock

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$0.140

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$0.059

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$0.045

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$0.037

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Chip1Stop

Japan . 16,000 parts In-Stock

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Arrow

USA . 12,000 parts In-Stock

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Verical

USA . 12,000 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

USA . 969 parts In-Stock

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NAC Semi

USA . 24,000 parts In-Stock

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Chip Stock

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Sensible Micro Corp

USA . 16,000 parts In-Stock

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Vyrian

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Diverse Electronics

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Microfarads

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Bristol Electronics

USA . 110 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,804 parts In-Stock

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$0.016

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$0.016

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Semicontronic

India . 9,699 parts In-Stock

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$0.016

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Corohmni

South Africa . 472 parts In-Stock

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Continental Prestige Electronics

USA . 6,207 parts In-Stock

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$0.132

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Argo Parts USA

USA . 2,726 parts In-Stock

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$0.132

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$0.128

2,726

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Netroflash

USA . 100 parts In-Stock

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$0.132

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Corphita

USA . 682 parts In-Stock

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$0.252

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Aztec Data Supply Inc.

USA . 3,403 parts In-Stock

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$24.450

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Perfect Parts

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Kepictronics

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GreenTree Electronics

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QUARKTWIN TECHNOLOGY LTD

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Futuretech Components

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Component Stockers USA

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Kulean Microsystems

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SupplyDigital Components

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Lixinc

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Problanco Electronics

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Metaverse IC Inc.

Canada . 3,816 parts In-Stock

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S.R.D Solutions

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Assy Fe

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TANS Electronics

Latvia . 1,476 parts In-Stock

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Vigor

Singapore . 521 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Overview

Enhance your electronic projects with the NL17SZ07XV5T2G by Onsemi, a high-quality logic gate that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this compact and versatile component is perfect for a wide range of applications. With a nominal supply voltage of 1.8V and maximum operating temperature of 125°C, this logic gate provides efficient and accurate signal processing. Experience the value and benefits of using this product, from its small outline and thin profile package style to its open-drain output characteristics. Upgrade your designs with the NL17SZ07XV5T2G and see the difference it makes in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and simpler integration onto circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement of 1.8V makes it energy efficient.

Propagation Delay (tpd): 12 ns

The low propagation delay of 12 ns ensures fast signal processing.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55 to 125°C makes it suitable for various environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Logic Gates NL17SZ07XV5T2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

NL17SZ07XV5T2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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