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SN74LVC1G04DCKR

Texas Instruments

SN74LVC1G04DCKR by Texas Instruments

SN74LVC1G04DCKR by Texas Instruments is a logic gate with 4.2 ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with 5 terminals and operates b/w -40 to 125 °C, making it ideal for high-temperature environments. With a load capacitance of 50 pF and low power supply current of 0.01 mA, this CMOS technology device offers reliable performance in compact designs.

Median Price

$0.096

Lifecycle Status

Suppliers In-Stock

63

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 472,972 parts In-Stock

1+ parts

$0.077

100+ parts

$0.053

1k+ parts

$0.027

10k+ parts

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472,972

$0.077

$0.053

$0.027

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DigiKey

USA . 18,501 parts In-Stock

1+ parts

$0.100

100+ parts

$0.036

1k+ parts

$0.029

10k+ parts

$0.025

18,501

$0.100

$0.036

$0.029

$0.025

Arrow

USA . 2,749 parts In-Stock

1+ parts

$0.209

100+ parts

$0.094

1k+ parts

$0.047

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2,749

$0.209

$0.094

$0.047

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RS (Exports)

UK . 52,000 parts In-Stock

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$0.096

10k+ parts

$0.088

52,000

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$0.096

$0.088

Farnell

UK . 10,846 parts In-Stock

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$0.044

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$0.035

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$0.029

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$0.044

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$0.029

Element14

Singapore . 9,060 parts In-Stock

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$0.107

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$0.061

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$0.051

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$0.107

$0.061

$0.051

Verical

USA . 1,332 parts In-Stock

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$0.062

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$0.050

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$0.044

1,332

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$0.062

$0.050

$0.044

Rochester

USA . 800 parts In-Stock

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$0.041

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$0.034

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$0.030

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$0.041

$0.034

$0.030

Chip1Stop

Japan . 65 parts In-Stock

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$0.158

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Digiode

USA . 2,572 parts In-Stock

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$0.031

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Ozdisan Elektronik

Türkiye . 28,830 parts In-Stock

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EXC GmbH

Germany . 1,600 parts In-Stock

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$0.038

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$0.038

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Maritex

Poland . 1 parts In-Stock

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$0.079

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$0.039

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$0.035

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$0.031

1

$0.079

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$0.031

Nova Conductors

Japan . 750 parts In-Stock

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$0.086

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Mobius Materials

USA . 23,979 parts In-Stock

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$0.120

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TME

Poland . 797 parts In-Stock

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$0.120

$0.053

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$0.042

Bristol Electronics

USA . 5,777 parts In-Stock

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$0.225

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Voyager Components

USA . 1,004 parts In-Stock

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$1.672

Component Electronics Inc.

Canada . 2,692 parts In-Stock

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Sensible Micro Corp

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PC Components Company LLC

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NAC Semi

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Atlantic Semiconductor

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Connector Distribution Corp

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Right Parts Inc.

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Micros

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Partservice

France . 2,965 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 2,965 parts In-Stock

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Semtec, LLC

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QIE Inc.

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Speed Components Ltd

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North Shore Components

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Electronic Treasures

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Quantum Digital Technology

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Sea View Technologies

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First Choice Components Inc.

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Contempo Components LLC

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Microfarads

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EPE Components Inc.

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ACDS - Activité Composants Distribution Service

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IBS Electronics

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Lantek

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Manoshevitz Elec. Sales

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Semicontronic

India . 67,232 parts In-Stock

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Corphita

USA . 1,176 parts In-Stock

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Ampacity Inc.

Singapore . 68,985 parts In-Stock

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Modulus Dynamics

Lithuania . 2,343 parts In-Stock

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Corohmni

South Africa . 183 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Argo Parts USA

USA . 1,561 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Benley Electronics

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Continental Prestige Electronics

USA . 1,645 parts In-Stock

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Parana Technologies

USA . 129 parts In-Stock

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DigiPath Technology Company

USA . 785 parts In-Stock

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ChromeModa Solutions

Germany . 1,167 parts In-Stock

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IDEA Electronic Components Group

UK . 492 parts In-Stock

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Perfect Parts

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Computer Components Inc. - USA

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Overview

Experience unparalleled quality and reliability with the SN74LVC1G04DCKR logic gate by industry leader Texas Instruments. Designed for a wide range of applications, this compact and efficient component offers fast propagation delays and low power consumption. With a durable plastic/epoxy package and nickel/palladium/gold terminals, this logic gate ensures optimal performance in automotive-grade environments. Trust Texas Instruments to deliver cutting-edge technology that brings value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to breakage, making the product robust and long-lasting.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast signal processing, making the product efficient for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and efficient supply voltage, ensuring compatibility with various systems.

Load Capacitance (CL): 50 pF

The low load capacitance improves signal integrity and performance, making the product suitable for precise applications.

Power Supplies (V): 3.3

Consistent power supply ensures stable operation and reliable performance.

No. of Terminals: 5

Having a limited number of terminals simplifies wiring and connections, reducing the chance of errors during setup.

Maximum I (ol): 32 Amp

High maximum output current capability makes the product suitable for demanding applications with heavy loads.

Propagation Delay (tpd): 7.5 ns

Still a low propagation delay ensures efficient signal processing even under slightly higher supply conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures the product can function effectively in both extreme cold and hot environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, making the product suitable for use in vehicles where reliability and durability are crucial.

Technology: CMOS

Utilizes CMOS technology, which offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form is ideal for surface mounting, providing secure connections and enhancing the product's reliability.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for compact design and efficient use of space, making the product suitable for small and dense circuit designs.

Technical Specifications

Logic Gates SN74LVC1G04DCKR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G04DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-618-8804, 5962016188804

NIIN

016188804

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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