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SN74LVC1G11DBVRE4

Texas Instruments

SN74LVC1G11DBVRE4 by Texas Instruments

SN74LVC1G11DBVRE4 by Texas Instruments is a logic gate with 3 inputs, 4.9 ns propagation delay, and 17.2 ns tpd. It operates at a nominal voltage of 3.3V and is suitable for automotive applications due to its low profile package style and wide temperature range from -40°C to 125°C.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,472 parts In-Stock

1+ parts

$0.400

100+ parts

$0.214

1k+ parts

$0.180

10k+ parts

$0.150

7,472

$0.400

$0.214

$0.180

$0.150

Distributors (In-Stock)

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Chip Stock

USA . 80,080 parts In-Stock

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Vyrian

USA . 7,813 parts In-Stock

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7,813

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Digiode

USA . 3,952 parts In-Stock

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Connector Distribution Corp

USA . 2,321 parts In-Stock

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2,321

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Right Parts Inc.

USA . 2,321 parts In-Stock

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2,321

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,677 parts In-Stock

1+ parts

$0.100

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2,677

$0.100

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Semicontronic

India . 2,281 parts In-Stock

1+ parts

$0.100

100+ parts

$0.098

1k+ parts

$0.097

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-

2,281

$0.100

$0.098

$0.097

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Parana Technologies

USA . 325 parts In-Stock

1+ parts

$15.281

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$15.676

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325

$15.281

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$15.676

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DigiPath Technology Company

USA . 392 parts In-Stock

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$16.827

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392

$16.827

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IDEA Electronic Components Group

UK . 133 parts In-Stock

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$17.170

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$16.312

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$15.453

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133

$17.170

$16.312

$15.453

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ChromeModa Solutions

Germany . 9 parts In-Stock

1+ parts

$17.170

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$14.079

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9

$17.170

$14.079

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Advanced Electronics

New Zealand . 42 parts In-Stock

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$30.016

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$28.515

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$28.515

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$30.016

$28.515

$28.515

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Corohmni

South Africa . 661 parts In-Stock

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$30.051

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Continental Prestige Electronics

USA . 6,978 parts In-Stock

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Perfect Parts

USA . 5,580 parts In-Stock

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Robosynatics

Brazil . 3,000 parts In-Stock

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Lucentia Tech

USA . 3,000 parts In-Stock

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$1.709

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$1.709

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$1.709

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$1.709

Corphita

USA . 2,847 parts In-Stock

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Argo Parts USA

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Microchip USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Modulus Dynamics

Lithuania . 91 parts In-Stock

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Overview

Elevate your projects with the SN74LVC1G11DBVRE4 by Texas Instruments, a high-quality logic gate designed to deliver unparalleled performance. With Texas Instruments' reputation for excellence in technology and innovation, this versatile component is perfect for a wide range of applications. From automotive to industrial settings, this logic gate offers fast propagation delay, low power consumption, and 3-state output characteristics. Trust in Texas Instruments to provide you with reliable solutions that bring value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This lightweight material makes the product durable and cost-effective.

Propagation Delay At Nominal Supply

4.9 ns - Low propagation delay ensures fast and efficient operation.

Surface Mount

YES - Easy to integrate into circuit boards, saving space and reducing assembly time.

No. of Inputs

3 - Provides flexibility for complex logic operations.

Package Shape

RECTANGULAR - Allows for easy placement and alignment on a PCB.

Nominal Supply Voltage / Vsup (V)

3.3 - Compatible with standard power sources, ensuring universal usability.

Load Capacitance (CL)

50 pF - Can drive a variety of loads without overloading the circuit.

Power Supplies (V)

3.3 - Energy-efficient and suitable for low-power applications.

No. of Terminals

6 - Provides multiple connection points for versatile circuit design.

Package Style (Meter)

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - Compact design saves space in crowded PCB layouts.

Maximum I (ol)

32 Amp - Can handle high current output without overheating or damage.

Propagation Delay (tpd)

17.2 ns - Fast response time ensures quick signal processing.

Maximum Operating Temperature

125 °C - Can operate in high temperature environments such as automotive applications.

Output Characteristics

3-STATE - Allows for high impedance outputs, reducing power consumption in certain applications.

Minimum Operating Temperature

40 °C - Can withstand extreme cold temperatures, ideal for outdoor or industrial use.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides excellent corrosion resistance for long-term reliability.

Terminal Position

DUAL - Offers flexibility in PCB layout and connectivity options.

Maximum Seated Height

1.45 mm - Low profile design fits in tight spaces or slim devices.

Width

1.6 mm - Compact width allows for high-density circuit design.

Minimum Supply Voltage (Vsup)

1.65 V - Can operate at low voltages for energy-efficient applications.

Peak Reflow Temperature °C

260 - Can withstand high-temperature reflow soldering processes during assembly.

Length

2.9 mm - Compact length for space-saving PCB layout.

Temperature Grade

AUTOMOTIVE - Designed to meet stringent automotive industry standards for reliability and performance.

Technology

CMOS - Utilizes low-power CMOS technology for efficient operation and minimal power consumption.

Terminal Form

GULL WING - Easy to solder for quick and reliable connections.

Packing Method

TR - Tape and reel packaging for easy handling and automated assembly.

Terminal Pitch

0.95 mm - Fine pitch terminals for precise connections in compact designs.

Maximum Supply Voltage (Vsup)

5.5 V - Can handle higher supply voltages for versatile applications.

Maximum Power Supply Current (ICC)

0.01 mA - Low power consumption for energy-efficient operation.

Technical Specifications

Logic Gates SN74LVC1G11DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

17.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G11DBVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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