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SN74LVC2G17DCKTE4

Texas Instruments

SN74LVC2G17DCKTE4 by Texas Instruments

SN74LVC2G17DCKTE4 by Texas Instruments is a logic gate with 2 functions, 5.4 ns propagation delay at 3.3V, and 50 pF load capacitance. It is used in automotive applications due to its CMOS technology, Schmitt trigger feature, and small outline package style.

Median Price

$0.849

Lifecycle Status

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7

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1k+

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Mouser Electronics

USA . 705 parts In-Stock

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$1.340

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$0.812

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$0.665

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$0.631

705

$1.340

$0.812

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$0.631

Arrow

USA . 500 parts In-Stock

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$0.849

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$0.772

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$0.849

$0.772

Verical

USA . 500 parts In-Stock

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$0.849

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$0.772

500

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$0.849

$0.772

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Digiode

USA . 727 parts In-Stock

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$1.311

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Chip Stock

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Vyrian

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Ampacity Inc.

Singapore . 635 parts In-Stock

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$1.170

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635

$1.170

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Semicontronic

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$1.210

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$1.180

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$1.174

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Corphita

USA . 4,315 parts In-Stock

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$1.242

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AZTECH Wire

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Parana Technologies

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$16.268

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$1,510.759

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$14.641

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929

$16.268

$1,510.759

$14.641

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Corohmni

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$16.407

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DigiPath Technology Company

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$17.913

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$17.365

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$16.451

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Advanced Electronics

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$23.124

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$21.967

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$21.967

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Continental Prestige Electronics

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Microchip USA

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$0.012

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Lucentia Tech

USA . 2,000 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74LVC2G17DCKTE4 by Texas Instruments, a top-quality logic gate that guarantees precision and reliability. Manufactured by the trusted brand Texas Instruments, this component is perfect for various applications in automotive systems and consumer electronics. With a fast propagation delay and low power consumption, this logic gate offers unmatched performance while ensuring efficient operation. Trust Texas Instruments for superior quality and enhance your designs with the SN74LVC2G17DCKTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 5.4 ns

With a fast propagation delay, this product ensures quick signal processing.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on PCBs.

No. of Functions: 2

This product offers dual functions in one package, increasing efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V, this product is compatible with common power sources.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product minimizes signal distortion and enhances performance.

Power Supplies (V): 3.3

This product operates at a power supply voltage of 3.3V, ensuring stable performance.

No. of Terminals: 6

With 6 terminals, this product offers flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package make this product suitable for compact electronic devices.

Maximum I (ol): 32 Amp

With a maximum output current of 32A, this product can drive heavy loads.

Propagation Delay (tpd): 9.3 ns

The low propagation delay of 9.3ns ensures fast signal transmission in circuits.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this product is suitable for high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures reliable and corrosion-resistant connections.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in PCB layout.

Maximum Seated Height: 1.1 mm

The compact seated height of 1.1mm saves space in electronic assemblies.

Width: 1.25 mm

The narrow width of 1.25mm allows for high-density PCB designs.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a minimum supply voltage of 1.65V, this product is energy-efficient.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand reflow soldering processes.

Length: 2 mm

The compact length of 2mm minimizes PCB footprint.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for temperature performance.

Schmitt Trigger: YES

Featuring a Schmitt trigger, this product provides hysteresis for noise immunity in signal processing.

Technology: CMOS

Built using CMOS technology, this product offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and reliable connections.

Packing Method: TR

This product is packed in tape and reel (TR) for convenient storage and automated assembly.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product is suitable for fine-pitch PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5V, this product is versatile in various applications.

Maximum Power Supply Current (ICC): 0.01 mA

Drawing a maximum power supply current of 0.01mA, this product is energy-efficient.

Technical Specifications

Logic Gates SN74LVC2G17DCKTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC2G17DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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