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SN74LVC1G17DRLR

Texas Instruments

SN74LVC1G17DRLR by Texas Instruments

SN74LVC1G17DRLR by Texas Instruments is a CMOS logic gate with 5.5 ns propagation delay at 3.3V, suitable for automotive applications. It features a Schmitt Trigger, operates b/w -40 to 125 °C, and has a small outline package with 0.6 mm seated height.

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Texas Instruments

USA . 158,095 parts In-Stock

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DigiKey

USA . 1 parts In-Stock

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Newark

USA . 3,325 parts In-Stock

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Arrow

USA . 2,945 parts In-Stock

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Farnell

UK . 2,875 parts In-Stock

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Element14

Singapore . 2,875 parts In-Stock

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Chip1Stop

Japan . 2,415 parts In-Stock

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RS (Exports)

UK . 760 parts In-Stock

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Verical

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

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Chip Stock

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Vyrian

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Holdelec - ElecDif-Pro

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Next Level Components, LLC

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Sensible Micro Corp

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Cogito LLC

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Inventory MP

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Bristol Electronics

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NexGen Digital

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Semicontronic

India . 21,908 parts In-Stock

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$0.089

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$0.087

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$0.086

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Ampacity Inc.

Singapore . 21,848 parts In-Stock

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Argo Parts USA

USA . 2,648 parts In-Stock

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Corphita

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Component Stockers USA

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Corohmni

South Africa . 676 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,025 parts In-Stock

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$26.288

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ChromeModa Solutions

Germany . 4,662 parts In-Stock

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IDEA Electronic Components Group

UK . 2,376 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Perfect Parts

USA . 63,827 parts In-Stock

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iodParts Technologies Inc.

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Continental Prestige Electronics

USA . 2,095 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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S.R.D Solutions

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Lucentia Tech

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Overview

Experience the innovation and reliability of Texas Instruments with the SN74LVC1G17DRLR Logic Gates. Designed with precision and quality in mind, this product offers a wide range of applications for your electronic projects. With a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C, this compact and efficient logic gate ensures optimal performance. Whether you're working on automotive electronics or consumer devices, the SN74LVC1G17DRLR provides the value and benefits you need to bring your designs to life. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for various applications.

Propagation Delay at Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy installation and space saving, making it convenient for compact designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and space utilization, making it a practical choice for tight spaces.

Nominal Supply Voltage / Vsup: 3.3 V

Operates at a common supply voltage, ensuring compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable for driving loads with minimal delay, making it versatile for different load requirements.

Power Supplies (V): 3.3

Compatible with common power supplies, ensuring ease of integration into existing systems.

No. of Terminals: 5

Compact design with a low number of terminals simplifies installation and reduces complexity in circuit design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact and slim design saves space and allows for dense circuit layouts, making it suitable for compact devices.

Maximum I (ol): 24 Amp

Can handle high output currents, making it suitable for driving heavy loads.

Propagation Delay (tpd): 11 ns

Low propagation delay ensures fast signal processing, suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, ensuring reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and ease of connection.

Maximum Seated Height: 0.6 mm

Low profile design saves space and allows for compact device designs.

Width: 1.2 mm

Compact width allows for efficient use of PCB space and easy integration into circuit layouts.

Minimum Supply Voltage (Vsup): 1.65 V

Wide operating voltage range allows for flexibility in power supply selection.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes, ensuring robustness during assembly.

Length: 1.6 mm

Compact length allows for efficient use of PCB space and easy integration into circuit layouts.

Temperature Grade: AUTOMOTIVE

Automotive-grade construction ensures reliability in harsh automotive environments.

Schmitt Trigger: YES

Includes Schmitt trigger for noise immunity and signal conditioning, ensuring reliable operation in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: FLAT

Flat terminal form provides easy soldering and reliable connections.

Packing Method: TR

Tape and reel packaging method for convenient handling and automated assembly processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range allows for compatibility with a variety of power sources.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption ensures energy efficiency and minimal heat dissipation.

Technical Specifications

Logic Gates SN74LVC1G17DRLR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

SN74LVC1G17DRLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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