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SN74LVC1G57DCKR

Texas Instruments

SN74LVC1G57DCKR by Texas Instruments

SN74LVC1G57DCKR by Texas Instruments is a CMOS logic gate with 3 inputs, operating at 1.8V to 5.5V. It features a propagation delay of 16.4ns and can handle a load capacitance of 50pF, making it suitable for automotive applications requiring fast response times in compact designs. With a small outline package style and dual terminal position, this Schmitt Trigger gate is ideal for space-constrained environments where high-speed signal processing is essential.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 52,707 parts In-Stock

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Mouser Electronics

USA . 17,748 parts In-Stock

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DigiKey

USA . 12,406 parts In-Stock

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Chip1Stop

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Rochester

USA . 1,224 parts In-Stock

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Verical

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Digiode

USA . 2,705 parts In-Stock

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Nova Conductors

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Maritex

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TME

Poland . 2,054 parts In-Stock

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Forefront Electronics and Design

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Chip Stock

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DigiKey Marketplace

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J & M Industries LLC

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Speed Components Ltd

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Cyclops Electronics Ltd

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Manoshevitz Elec. Sales

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Semicontronic

India . 24,211 parts In-Stock

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Ampacity Inc.

Singapore . 24,006 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

USA . 2,941 parts In-Stock

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Corohmni

South Africa . 138 parts In-Stock

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Parana Technologies

USA . 862 parts In-Stock

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DigiPath Technology Company

USA . 1,630 parts In-Stock

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ChromeModa Solutions

Germany . 2,350 parts In-Stock

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

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Advanced Electronics

New Zealand . 62 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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Infinite Electronics LLP (Excess)

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Netroflash

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

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Speed Components Ltd (Excess)

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Overview

Upgrade your electronics with the SN74LVC1G57DCKR by Texas Instruments, a high-quality Logic Gate perfect for a variety of applications. Designed with precision and reliability in mind, this product offers seamless integration and exceptional performance. With its compact design and advanced technology, it provides unmatched value and benefits to customers looking for efficient solutions. Trust Texas Instruments for top-notch products that bring innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and lightweight, ideal for portable or compact applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Inputs: 3

With three inputs, this logic gate offers versatility and flexibility in creating complex logic functions for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures compatibility with standard PCB layouts, making integration into existing designs straightforward.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this logic gate energy-efficient and suitable for battery-operated devices or low-power applications.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for reliable performance in high-speed applications, ensuring smooth signal transmission.

Power Supplies (V): 3.3

Operating at a standard 3.3V power supply, this logic gate is compatible with a wide range of electronic systems and components.

No. of Terminals: 6

With six terminals, this logic gate offers easy connectivity and integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this logic gate space-saving and suitable for compact designs.

Maximum I (ol): 32 Amp

With a maximum output current of 32A, this logic gate can handle high power loads, making it suitable for demanding applications.

Technical Specifications

Logic Gates SN74LVC1G57DCKR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G57DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-625-2289, 5962016252289

NIIN

016252289

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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