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SN74LVC1G57DCKRG4

Texas Instruments

SN74LVC1G57DCKRG4 by Texas Instruments

SN74LVC1G57DCKRG4 by Texas Instruments is a CMOS logic gate with 3 inputs, 16.4 ns propagation delay, and 32 Amp max I (ol). It operates at temperatures from -40 to 125 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for automotive applications due to its Schmitt Trigger feature and small form factor package design.

Median Price

$0.314

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 283,647 parts In-Stock

1+ parts

$0.238

100+ parts

$0.162

1k+ parts

$0.083

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283,647

$0.238

$0.162

$0.083

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Mouser Electronics

USA . 282,730 parts In-Stock

1+ parts

$0.390

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$0.206

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$0.177

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$0.145

282,730

$0.390

$0.206

$0.177

$0.145

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.121

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100

$0.121

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Digiode

USA . 1,633 parts In-Stock

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$0.226

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1,633

$0.226

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Vyrian

USA . 285,554 parts In-Stock

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285,554

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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Semtec, LLC

USA . 9,000 parts In-Stock

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Sensible Micro Corp

USA . 1,617 parts In-Stock

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Euro-Tech

UK . 1,303 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,364 parts In-Stock

1+ parts

$0.121

100+ parts

-

1k+ parts

-

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$0.119

6,364

$0.121

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-

$0.119

Argo Parts USA

USA . 2,789 parts In-Stock

1+ parts

$0.121

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$0.117

2,789

$0.121

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$0.117

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.121

100+ parts

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$0.115

10k+ parts

$0.113

2,000

$0.121

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$0.115

$0.113

Corohmni

South Africa . 33 parts In-Stock

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$0.121

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33

$0.121

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Modulus Dynamics

Lithuania . 500 parts In-Stock

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$0.134

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$0.133

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$0.129

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500

$0.134

$0.133

$0.129

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Ampacity Inc.

Singapore . 285,607 parts In-Stock

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$0.202

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Semicontronic

India . 285,592 parts In-Stock

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$0.202

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$0.197

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$0.196

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Corphita

USA . 3,514 parts In-Stock

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$0.214

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$0.214

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$11.733

100+ parts

$10.677

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$9.621

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60

$11.733

$10.677

$9.621

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Parana Technologies

USA . 2,052 parts In-Stock

1+ parts

$15.804

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$16.159

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2,052

$15.804

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DigiPath Technology Company

USA . 456 parts In-Stock

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$17.402

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$16.010

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456

$17.402

$16.010

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IDEA Electronic Components Group

UK . 1,454 parts In-Stock

1+ parts

$17.757

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$16.869

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$15.981

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1,454

$17.757

$16.869

$15.981

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ChromeModa Solutions

Germany . 718 parts In-Stock

1+ parts

$17.757

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$14.561

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$17.757

$14.561

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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Microchip USA

USA . 1,255 parts In-Stock

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Robosynatics

Brazil . 450 parts In-Stock

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Lucentia Tech

USA . 450 parts In-Stock

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$13.881

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$13.881

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$13.881

450

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$13.881

$13.881

$13.881

Overview

Experience superior performance and reliability with the SN74LVC1G57DCKRG4 by Texas Instruments, a trusted leader in semiconductor technology. This compact logic gate is perfect for a wide range of applications, offering seamless integration and efficient operation. With its advanced features and high-quality construction, this product delivers unmatched value and benefits to customers seeking top-notch electronic components. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Surface Mount: YES

Easy to install and saves space on the circuit board.

No. of Inputs: 3

Allows for more complex logic operations to be performed.

Nominal Supply Voltage / Vsup (V): 1.8

Works efficiently with a low supply voltage, reducing power consumption.

Propagation Delay (tpd): 16.4 ns

Ensures fast switching speeds for time-critical applications.

Schmitt Trigger: YES

Helps eliminate noise and provide hysteresis for cleaner signal transitions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Maximum Operating Temperature: 125 °C

Suitable for operation in high temperature environments such as automotive applications.

Technical Specifications

Logic Gates SN74LVC1G57DCKRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G57DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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