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JM38510/33001B2A

Texas Instruments

JM38510/33001B2A by Texas Instruments

JM38510/33001B2A by Texas Instruments is a TTL logic gate with 4 functions, 2 inputs, and 7ns propagation delay at 5V. Suitable for military applications, it operates b/w -55 to 125°C with a max power supply current of 10.2mA.

Median Price

$15.290

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Arrow

USA . 22 parts In-Stock

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$7.926

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Rochester

USA . 113 parts In-Stock

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$15.290

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$13.680

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$12.870

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$12.870

DigiKey

USA . 113 parts In-Stock

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$20.110

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Verical

USA . 113 parts In-Stock

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$16.087

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$16.087

Chip1Stop

Japan . 55 parts In-Stock

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$13.301

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Digiode

USA . 4,694 parts In-Stock

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$2.008

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Nova Conductors

Japan . 91 parts In-Stock

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$12.872

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Vyrian

USA . 7,147 parts In-Stock

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Electronic Expediters

USA . 1,564 parts In-Stock

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Anansix

USA . 718 parts In-Stock

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Zilex Electronics Inc.

Canada . 194 parts In-Stock

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DigiKey Marketplace

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Resion

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Odi Ramu Company

Canada . 18 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 14 parts In-Stock

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PC Components Company LLC

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Microfarads

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Bristol Electronics

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Electronics Depot

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Ampacity Inc.

Singapore . 44 parts In-Stock

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$1.800

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$1.800

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Corphita

USA . 3,034 parts In-Stock

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$1.903

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$1.903

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Semicontronic

India . 60 parts In-Stock

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$3.910

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$3.812

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$3.793

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$3.910

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$3.793

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AZTECH Wire

Italy . 429 parts In-Stock

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$5.254

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Continental Prestige Electronics

USA . 1,241 parts In-Stock

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$12.007

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Netroflash

USA . 100 parts In-Stock

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$12.872

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Corohmni

South Africa . 87 parts In-Stock

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Parana Technologies

USA . 2,020 parts In-Stock

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$26.352

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DigiPath Technology Company

USA . 2,115 parts In-Stock

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$28.349

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ChromeModa Solutions

Germany . 1,838 parts In-Stock

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IDEA Electronic Components Group

UK . 169 parts In-Stock

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$27.482

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$34.384

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$31.289

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$28.195

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QUARKTWIN TECHNOLOGY LTD

USA . 21,807 parts In-Stock

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Microchip USA

USA . 11,775 parts In-Stock

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Argo Parts USA

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Overview

Enhance your electronic projects with the top-quality JM38510/33001B2A logic gates by Texas Instruments. As a trusted manufacturer, TI ensures reliability and durability in every product. Ideal for military-grade applications, these logic gates offer fast propagation delays and low power consumption, making them perfect for high-performance systems. Upgrade your designs with the superior value and unmatched benefits of Texas Instruments' JM38510/33001B2A logic gates today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 7 ns

The fast propagation delay of 7 ns ensures quick signal processing, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this logic gate can be easily integrated into various electronic systems, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this logic gate compatible with a wide range of electronic circuits and devices.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and versatility in circuit design, making this logic gate flexible in various applications.

Technology: TTL

Using TTL technology ensures compatibility with other TTL components, making it easy to integrate into existing systems or designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environmental conditions, suitable for military or industrial applications.

Technical Specifications

Logic Gates JM38510/33001B2A attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

10.2 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

JM38510/33001B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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