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JM38510/08101BCA

Texas Instruments

JM38510/08101BCA by Texas Instruments

JM38510/08101BCA by Texas Instruments is a MILITARY-grade TTL Logic Gates IC with 2 functions, 4 inputs, and 7.5 ns propagation delay at 5V. It operates b/w -55 to 125 °C and has a max power supply current of 44 mA. Ideal for applications requiring high-speed logic operations in harsh environments.

Median Price

$26.772

Lifecycle Status

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31

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Arrow

USA . 3 parts In-Stock

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Chip1Stop

Japan . 56 parts In-Stock

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Avnet

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Verical

USA . 48 parts In-Stock

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$40.263

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$36.025

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$33.913

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Rochester

USA . 33 parts In-Stock

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DigiKey

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Digiode

USA . 1,547 parts In-Stock

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Freelance Electronics

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Nova Conductors

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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North Shore Components

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Conversion2

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PC Components Company LLC

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Inland Empire Components Inc.

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Odi Ramu Company

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ComSIT Distribution GmbH

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Electronics Depot

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Mil-Aero Solutions, Inc.

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LWI Electronics Inc

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A2Z Electronics, Inc.

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Elcom Components

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Manoshevitz Elec. Sales

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Ampacity Inc.

Singapore . 36 parts In-Stock

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Semicontronic

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Corphita

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AZTECH Wire

Italy . 725 parts In-Stock

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Continental Prestige Electronics

USA . 4,972 parts In-Stock

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$25.915

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$25.397

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Corohmni

South Africa . 44 parts In-Stock

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Parana Technologies

USA . 881 parts In-Stock

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$29.289

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DigiPath Technology Company

USA . 444 parts In-Stock

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$32.251

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ChromeModa Solutions

Germany . 2,322 parts In-Stock

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$32.909

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$26.985

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IDEA Electronic Components Group

UK . 1,842 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$33.143

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$29.865

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Microchip USA

USA . 2,392 parts In-Stock

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$65.070

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$63.940

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$63.370

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$62.800

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Authorized Procurement Solutions

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Argo Parts USA

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Perfect Parts

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Overview

Unleash the power of Texas Instruments with the JM38510/08101BCA logic gates! Crafted with precision and expertise, this top-of-the-line product offers unparalleled quality and reliability. From military-grade screening to fast propagation delay, this versatile component is perfect for a wide range of applications. Elevate your projects with the exceptional value and performance that only Texas Instruments can provide. Experience the difference today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast response time, making this product suitable for high-speed applications.

No. of Inputs: 4

Having 4 inputs allows for more complex logic operations to be performed, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes integration with existing systems easy and convenient.

Temperature Grade: MILITARY

Military-grade components are designed to withstand harsh environments, ensuring durability and reliability.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making it ideal for a wide range of applications.

Technical Specifications

Logic Gates JM38510/08101BCA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IOL = 60MA @ VOL = 0.5V; IOH = 3MA @ VOH = 2.5V; LG-MAX

Family:

S

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.94 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

40 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

44 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/08101BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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