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SN74AHC1G14DBVRE4

Texas Instruments

SN74AHC1G14DBVRE4 by Texas Instruments

SN74AHC1G14DBVRE4 by Texas Instruments is a logic gate with 1 input and 1 function. It has a propagation delay of 12 ns and operates at a nominal voltage of 3.3V. This device is commonly used in automotive applications due to its small size and low power consumption.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,372 parts In-Stock

1+ parts

$0.460

100+ parts

$0.249

1k+ parts

$0.209

10k+ parts

$0.192

9,372

$0.460

$0.249

$0.209

$0.192

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$0.150

100+ parts

-

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84

$0.150

-

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Digiode

USA . 2,401 parts In-Stock

1+ parts

$0.276

100+ parts

-

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2,401

$0.276

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Chip Stock

USA . 67,680 parts In-Stock

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67,680

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Vyrian

USA . 8,820 parts In-Stock

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8,820

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

$0.141

10k+ parts

-

100

$0.147

-

$0.141

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Corohmni

South Africa . 76 parts In-Stock

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$0.150

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76

$0.150

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Continental Prestige Electronics

USA . 4,421 parts In-Stock

1+ parts

$0.150

100+ parts

-

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$0.147

4,421

$0.150

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$0.147

Argo Parts USA

USA . 4,354 parts In-Stock

1+ parts

$0.150

100+ parts

-

1k+ parts

-

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$0.146

4,354

$0.150

-

-

$0.146

Modulus Dynamics

Lithuania . 18 parts In-Stock

1+ parts

$0.167

100+ parts

$0.165

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$0.160

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-

18

$0.167

$0.165

$0.160

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Semicontronic

India . 9,077 parts In-Stock

1+ parts

$0.246

100+ parts

$0.240

1k+ parts

$0.239

10k+ parts

-

9,077

$0.246

$0.240

$0.239

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Ampacity Inc.

Singapore . 8,972 parts In-Stock

1+ parts

$0.246

100+ parts

-

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8,972

$0.246

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Corphita

USA . 143 parts In-Stock

1+ parts

$0.261

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143

$0.261

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Microchip USA

USA . 3,028 parts In-Stock

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$0.869

100+ parts

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3,028

$0.869

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$24.466

100+ parts

$22.264

1k+ parts

$20.062

10k+ parts

-

5,000

$24.466

$22.264

$20.062

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Parana Technologies

USA . 1,393 parts In-Stock

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$29.821

100+ parts

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$63.652

10k+ parts

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1,393

$29.821

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$63.652

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DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

$32.837

100+ parts

$30.210

1k+ parts

-

10k+ parts

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1,680

$32.837

$30.210

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ChromeModa Solutions

Germany . 6,525 parts In-Stock

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$33.507

100+ parts

$27.476

1k+ parts

-

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6,525

$33.507

$27.476

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IDEA Electronic Components Group

UK . 1,791 parts In-Stock

1+ parts

$33.507

100+ parts

$31.832

1k+ parts

$30.156

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1,791

$33.507

$31.832

$30.156

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Perfect Parts

USA . 30,109 parts In-Stock

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30,109

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.048

1k+ parts

$3.048

10k+ parts

$3.048

100

-

$3.048

$3.048

$3.048

Overview

Looking for a high-quality logic gate that delivers exceptional performance? Look no further than the SN74AHC1G14DBVRE4 by Texas Instruments. With its advanced technology and reliable manufacturing, this product offers numerous advantages for various applications. Whether you're working in automotive or other industries, this small outline, low-profile logic gate is the perfect solution. Its 3-STATE output characteristics, Schmitt trigger, and wide operating temperature range ensure optimal functionality in any environment. Experience the value, benefits, and advantages this product brings to your projects. Upgrade to the SN74AHC1G14DBVRE4 today and see the difference it makes!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

– The use of plastic/epoxy material for the package body ensures durability and protection, making it suitable for various environments.

Propagation Delay At Nominal Supply: 12 ns

– With a low propagation delay, this logic gate provides fast response times, enhancing the efficiency and performance of electronic circuits.

Surface Mount: YES

– The surface mount capability offers easy installation and integration onto circuit boards, saving valuable production time and effort.

No. of Functions: 1

– This logic gate provides a single function, simplifying circuit design and reducing complexity.

No. of Inputs: 1

– With a single input, this logic gate is ideal for basic circuits that require straightforward functionality.

Package Shape: RECTANGULAR

– The rectangular package shape allows for efficient space utilization on circuit boards, enabling compact and streamlined designs.

Nominal Supply Voltage / Vsup (V): 3.3

– The nominal supply voltage of 3.3 volts ensures compatibility with a wide range of electronic systems, offering versatility in applications.

Load Capacitance (CL): 50 pF

– The 50 pF load capacitance ensures stable and reliable signal transmission, preventing signal degradation and noise interference.

Power Supplies (V): 2/5.5

– With a wide range of power supply options, ranging from 2 to 5.5 volts, this logic gate can be used in diverse electronic systems.

No. of Terminals: 5

– The logic gate's 5 terminals provide the necessary connections for seamless integration into circuits while ensuring reliable electrical connections.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

– The small outline, low profile, and shrink pitch package style facilitate space-constrained designs, making this logic gate an excellent choice for compact electronic devices.

Maximum I (ol): 8 Amp

– With a maximum output current of 8 Amps, this logic gate can handle high-power applications efficiently and reliably.

Propagation Delay (tpd): 18.5 ns

– The propagation delay of 18.5 ns ensures minimal delay in signal propagation, contributing to high-speed and responsive circuit operation.

Maximum Operating Temperature: 125 °C

– This logic gate can withstand high operating temperatures up to 125°C, making it suitable for demanding environments.

Output Characteristics: 3-STATE

– The 3-STATE output characteristic allows for the tri-state output, facilitating bus sharing and maximizing circuit flexibility.

Minimum Operating Temperature: -40 °C

– The logic gate operates reliably even in extremely low temperatures, down to -40°C, making it suitable for various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

– The nickel/palladium/gold terminal finish provides excellent corrosion resistance, ensuring long-term reliability and durability.

Terminal Position: DUAL

– The dual terminal position enhances connectivity options and provides design flexibility, allowing for easy integration into different circuit layouts.

Maximum Seated Height: 1.45 mm

– The compact maximum seated height of 1.45 mm enables the use of this logic gate in space-constrained designs, optimizing the efficiency of electronic systems.

Width: 1.6 mm

– The logic gate's width of 1.6 mm contributes to its compact form factor, enabling efficient utilization of available space on circuit boards.

Minimum Supply Voltage (Vsup): 2 V

– With a minimum supply voltage requirement of 2 volts, this logic gate can operate with lower power sources, enhancing versatility in low-power applications.

Peak Reflow Temperature °C: 260

– The logic gate's peak reflow temperature of 260°C ensures proper soldering during manufacturing, achieving reliable connections and robustness.

Length: 2.9 mm

– The logic gate's length of 2.9 mm helps with compact designs and efficient layout organization, making it suitable for space-limited applications.

Temperature Grade: AUTOMOTIVE

– The automotive temperature grade indicates that this logic gate meets the stringent requirements for automotive electronic systems, ensuring reliable performance in automotive applications.

Schmitt Trigger: YES

– The presence of a Schmitt trigger in this logic gate helps mitigate noise interference and provides additional noise immunity, enhancing signal integrity and reliability.

Technology: CMOS

– This logic gate utilizes CMOS technology, offering low power consumption, high noise tolerance, and excellent compatibility with other CMOS integrated circuits.

Terminal Form: GULL WING

– The gull wing terminal form simplifies soldering and enhances mechanical stability, ensuring secure connections and ease of assembly.

Packing Method: TR

– The TR packing method provides a tape and reel packaging, enabling automated assembly processes, reducing handling time, and facilitating efficient production.

Terminal Pitch: 0.95 mm

– With a terminal pitch of 0.95 mm, this logic gate supports precise and compact circuit designs, ensuring efficient use of available space on circuit boards.

Moisture Sensitivity Level (MSL): 1

– The moisture sensitivity level of 1 indicates that this logic gate has a high level of moisture resistance, ensuring reliability and longevity of operation.

Maximum Supply Voltage (Vsup): 5.5 V

– The logic gate can tolerate a maximum supply voltage of 5.5 volts, allowing for compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 0.01 mA

– With a maximum power supply current of only 0.01 mA, this logic gate offers low power consumption, making it suitable for energy-efficient applications.

Technical Specifications

Logic Gates SN74AHC1G14DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G14DBVRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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