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SN74AHC1G04DBVRG4

Texas Instruments

SN74AHC1G04DBVRG4 by Texas Instruments

SN74AHC1G04DBVRG4 by Texas Instruments is a CMOS logic gate with 8.5 ns propagation delay at 3.3V, suitable for automotive applications. It has a max operating temperature of 125°C and can handle load capacitance of 50 pF. This small outline package with dual terminals is surface mountable and has a low profile design.

Median Price

$0.650

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Mouser Electronics

USA . 2,054 parts In-Stock

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$0.650

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$0.357

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$0.303

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$0.279

2,054

$0.650

$0.357

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$0.279

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DF Sales Co.

USA . 2,689 parts In-Stock

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$0.130

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DF Sales Co.

USA . 2,689 parts In-Stock

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Nova Conductors

Japan . 40 parts In-Stock

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$0.168

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Digiode

USA . 3,682 parts In-Stock

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Chip Stock

USA . 156,710 parts In-Stock

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Cyclops Electronics Ltd

UK . 11,575 parts In-Stock

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Vyrian

USA . 3,187 parts In-Stock

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Prism Electronics

USA . 2,375 parts In-Stock

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QIE Inc.

USA . 1,884 parts In-Stock

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Bristol Electronics

USA . 1,625 parts In-Stock

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$0.113

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$0.068

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Microfarads

USA . 1,568 parts In-Stock

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Semi Source

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Argo Parts USA

USA . 4,476 parts In-Stock

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$0.167

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$0.162

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Continental Prestige Electronics

USA . 1,500 parts In-Stock

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$0.167

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Netroflash

USA . 1,000 parts In-Stock

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$0.168

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Ampacity Inc.

Singapore . 3,021 parts In-Stock

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$0.289

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Semicontronic

India . 2,822 parts In-Stock

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$0.282

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$0.280

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Corphita

USA . 382 parts In-Stock

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Parana Technologies

USA . 122 parts In-Stock

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$7.156

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$7.665

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DigiPath Technology Company

USA . 1,664 parts In-Stock

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$7.879

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ChromeModa Solutions

Germany . 4,968 parts In-Stock

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$8.040

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$6.593

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IDEA Electronic Components Group

UK . 2,190 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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Overview

Elevate your electronic projects with the SN74AHC1G04DBVRG4 by Texas Instruments, a top-tier manufacturer known for quality and innovation in the Logic Gates category. This versatile component offers fast propagation delay at a nominal supply voltage of 3.3V, making it ideal for applications requiring precision and efficiency. With a compact package shape and surface mount design, this product is perfect for space-constrained projects where performance is key. Trust Texas Instruments to deliver high-quality components that provide value, reliability, and advanced functionality to meet all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gate, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay ensures fast processing of signals, making the logic gate efficient for time-critical operations.

Surface Mount: YES

Surface mount package allows for easy and secure mounting on circuit boards, simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level of 3.3V, making it compatible with many common electronic systems and devices.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the input and output characteristics of the logic gate, ensuring reliable performance.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages from 2V to 5.5V, offering flexibility in various operating conditions.

No. of Terminals: 5

Compact design with a low number of terminals makes it easy to integrate and connect within electronic circuits.

Maximum I (ol): 8 Amp

High output current capability allows the logic gate to drive external components or loads with ease.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the logic gate can withstand extreme environmental conditions without any performance degradation.

Minimum Operating Temperature: -40 °C

Can operate efficiently in low temperature environments, providing reliable performance in a wide range of conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish ensures excellent conductivity and reliability in signal transmission.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Logic Gates SN74AHC1G04DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G04DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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