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MC14093BDG

Onsemi

MC14093BDG by Onsemi

MC14093BDG by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 3-18V, with a propagation delay of 250ns. Suitable for military-grade applications, it comes in a small outline package with matte tin finish and Schmitt trigger functionality.

Median Price

$0.269

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

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Adafruit Industries

USA . 50 parts In-Stock

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Arrow

USA . 105,002 parts In-Stock

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Mouser Electronics

USA . 4,759 parts In-Stock

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Farnell

UK . 533 parts In-Stock

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Element14

Singapore . 533 parts In-Stock

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Newark

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Verical

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Rochester

USA . 11,605 parts In-Stock

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Future Electronics

Canada . 6,990 parts In-Stock

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DigiKey

USA . 3,429 parts In-Stock

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Master Electronics

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Chip1Stop

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Digiode

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Nova Conductors

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TME

Poland . 564 parts In-Stock

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Maritex

Poland . 7 parts In-Stock

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Bristol Electronics

USA . 1,815 parts In-Stock

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Flip Electronics

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Chip Stock

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IBS Electronics

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Vyrian

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NAC Semi

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ACDS - Activité Composants Distribution Service

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PC Components Company LLC

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LIBRA Elektronik GmbH

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Prism Electronics

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Classic Components Corporation

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Semicontronic

India . 5,085 parts In-Stock

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Ampacity Inc.

Singapore . 6,394 parts In-Stock

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Corphita

USA . 538 parts In-Stock

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Corohmni

South Africa . 327 parts In-Stock

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Argo Parts USA

USA . 1,128 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Modulus Dynamics

Lithuania . 800 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Continental Prestige Electronics

USA . 987 parts In-Stock

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Benley Electronics

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Aztec Data Supply Inc.

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Perfect Parts

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Kepictronics

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TANS Electronics

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Problanco Electronics

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Lixinc

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Kulean Microsystems

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Eastek

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Robosynatics

Brazil . 2,067 parts In-Stock

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Lucentia Tech

USA . 2,067 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,100 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

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Overview

Unlock the power of advanced logic gates with the MC14093BDG by Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this product offers customers unparalleled value and performance. Experience faster propagation delays, enhanced functionality, and seamless integration with the MC14093BDG. Stay ahead of the competition with Onsemi's innovative solutions.

Feature Benefit Bullets

Propagation Delay: 250 ns

Low propagation delay ensures fast response time, making it suitable for applications requiring quick signal processing.

No. of Functions: 4

Having multiple functions in one package increases efficiency and saves space in circuit designs.

Nominal Supply Voltage: 5V

Operates at a common supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

Operates reliably in extreme cold conditions, making it versatile for various environments.

Schmitt Trigger: YES

Schmitt trigger feature helps in noise immunity and signal conditioning, ensuring accurate signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Logic Gates MC14093BDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC14093BDG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-641-2340, 5962016412340

NIIN

016412340

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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