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MC14093BCPG

Onsemi

MC14093BCPG by Onsemi

MC14093BCPG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and Schmitt Trigger. It operates at -55 to 125 °C with 250 ns propagation delay at 5V. Widely used in military applications due to its MILITARY grade and through-hole terminal form.

Median Price

$0.640

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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$0.280

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Chip Stock

USA . 34,202 parts In-Stock

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Vyrian

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Digiode

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Cogito LLC

Ukraine . 400 parts In-Stock

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Cyclops Electronics Ltd

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Connector Distribution Corp

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Right Parts Inc.

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Bristol Electronics

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Manotoh

Italy . 90 parts In-Stock

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ComSIT Distribution GmbH

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Pegasus Components GmbH

Germany . 50 parts In-Stock

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Component Sense

UK . 25 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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A&K Electronics

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Aranea Global

USA . 1,000 parts In-Stock

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$0.274

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$0.263

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Corohmni

South Africa . 478 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 478 parts In-Stock

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$9.329

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Aztec Data Supply Inc.

USA . 4,485 parts In-Stock

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$16.370

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$23.884

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$22.689

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Semicontronic

India . 1,251 parts In-Stock

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$24.000

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$23.400

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$23.280

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Ampacity Inc.

Singapore . 699 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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Perfect Parts

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Kepictronics

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Argo Parts USA

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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A-Z Elektronik GmbH

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Corphita

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Problanco Electronics

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Continental Prestige Electronics

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UHIMA Technologies

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Microchip USA

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Overview

Renowned for its exceptional quality and reliability, the MC14093BCPG by Onsemi is a top-of-the-line logic gate that offers unparalleled performance. With a package body material of plastic/epoxy and a maximum supply voltage of 18V, this versatile product is ideal for a wide range of applications. Whether you're in need of robust logic gates for military-grade projects or high-speed digital systems, the MC14093BCPG delivers superior functionality with a propagation delay of just 250ns. Trust Onsemi to provide cutting-edge technology that exceeds expectations and enhances your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the logic gates, making them suitable for a variety of environments.

Propagation Delay At Nominal Supply: 250 ns

The fast propagation delay ensures quick processing of signals, making this product ideal for high-speed applications.

No. of Functions: 4

With four functions in one package, this product offers versatility and efficiency in circuit design.

No. of Inputs: 2

Having two inputs allows for more complex logical operations to be performed, making this product suitable for advanced logic applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate these logic gates into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes these logic gates compatible with a wide range of systems and components.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal power consumption and efficient operation of the logic gates.

Power Supplies (V): 5/15

Supporting both 5V and 15V power supplies, this product offers flexibility in system design and compatibility with different voltage levels.

No. of Terminals: 14

With 14 terminals, these logic gates provide multiple connection points for interfacing with other components in a circuit.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies the layout of circuits using these logic gates.

Technical Specifications

Logic Gates MC14093BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC14093BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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