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SN74LVC2G07DCKTE4

Texas Instruments

SN74LVC2G07DCKTE4 by Texas Instruments

SN74LVC2G07DCKTE4 by Texas Instruments is a logic gate with 3.7ns propagation delay, 50pF load capacitance, and 1.65V min supply voltage. It is used in industrial applications requiring open-drain output characteristics and operates within a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,080 parts In-Stock

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Digiode

USA . 1,665 parts In-Stock

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1,665

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Corohmni

South Africa . 3 parts In-Stock

1+ parts

$12.208

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3

$12.208

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AZTECH Wire

Italy . 412 parts In-Stock

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$15.599

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412

$15.599

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Parana Technologies

USA . 120 parts In-Stock

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$17.551

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$17.745

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$17.551

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$17.745

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DigiPath Technology Company

USA . 1,620 parts In-Stock

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$19.326

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$17.780

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$19.326

$17.780

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ChromeModa Solutions

Germany . 5,468 parts In-Stock

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$19.720

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$16.170

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$19.720

$16.170

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IDEA Electronic Components Group

UK . 742 parts In-Stock

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$19.720

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$18.734

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$17.748

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742

$19.720

$18.734

$17.748

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Semicontronic

India . 1,134 parts In-Stock

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$28.000

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$27.300

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$27.160

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Ampacity Inc.

Singapore . 377 parts In-Stock

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$30.000

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Advanced Electronics

New Zealand . 57 parts In-Stock

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$32.245

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$30.633

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One Stop Electronics

USA . 1,337 parts In-Stock

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$64.000

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Argo Parts USA

USA . 3,627 parts In-Stock

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Corphita

USA . 2,490 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your projects with the SN74LVC2G07DCKTE4 by Texas Instruments, a high-quality logic gate that delivers reliable performance and precision engineering. With a reputation for excellence, Texas Instruments ensures top-notch design and functionality in every product. Ideal for a wide range of applications, this logic gate offers unmatched value, efficiency, and versatility. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the SN74LVC2G07DCKTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 3.7 ns

With a fast propagation delay of 3.7 ns, this product ensures quick response times in logic operations.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

No. of Functions: 2

This product offers two functions in one compact package, maximizing efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a nominal supply voltage of 3.3V, suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can drive capacitive loads effectively.

Power Supplies (V): 3.3

Designed to operate on a 3.3V power supply, ensuring compatibility with standard voltage levels.

No. of Terminals: 6

Six terminals provide ample connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package offers space-saving benefits in densely populated circuits.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this product can drive high-powered loads with ease.

Propagation Delay (tpd): 8.6 ns

The low propagation delay of 8.6 ns ensures minimal delay in signal transmission for quick and efficient operation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, making it suitable for industrial environments.

Output Characteristics: OPEN-DRAIN

The open-drain output allows for flexibility in connecting to other circuit components.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures down to -40°C, making it suitable for a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold ensures reliable and long-lasting connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and connection options.

Maximum Seated Height: 1.1 mm

The low profile of 1.1 mm allows for compact and space-efficient circuit designs.

Width: 1.25 mm

With a width of 1.25 mm, this product is ideal for applications with limited space.

Minimum Supply Voltage (Vsup): 1.65 V

Can operate at a minimum supply voltage of 1.65V, allowing for versatility in voltage requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring robustness in manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, making it suitable for soldering processes.

Length: 2 mm

The length of 2 mm offers a compact footprint for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability in demanding environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable solder connections.

Packing Method: TR

Packed in tape and reel for easy handling and automated assembly processes.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise and stable connections on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle a maximum supply voltage of 5.5V, providing a wide operating range for various applications.

Technical Specifications

Logic Gates SN74LVC2G07DCKTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC2G07DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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