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SN74LVC1G08DCK

Texas Instruments

SN74LVC1G08DCK by Texas Instruments

SN74LVC1G08DCK by Texas Instruments is a CMOS logic gate with 2 inputs, 1 function, and 8ns propagation delay. It operates in industrial temperature range (-40 to 85°C) with supply voltage from 1.65V to 5.5V. This small outline package is ideal for compact electronic applications requiring fast signal processing.

Median Price

$1.000

Lifecycle Status

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13

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1k+

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Nova Conductors

Japan . 98 parts In-Stock

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Vyrian

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Martec Srl

Italy . 3,000 parts In-Stock

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Digiode

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Florida Circuit

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Cyclops Electronics Ltd

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Bristol Electronics

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Flex Direct, LLC

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Bas Electronics GmbH & Co. KG

Germany . 143 parts In-Stock

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HZD GmbH

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Prism Electronics

USA . 18 parts In-Stock

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LWI Electronics Inc

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Aranea Global

USA . 1,000 parts In-Stock

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$0.980

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$0.941

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$0.980

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Semicontronic

India . 1,097 parts In-Stock

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$6.000

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$5.850

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$5.820

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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Parana Technologies

USA . 2,219 parts In-Stock

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AZTECH Wire

Italy . 626 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 1,962 parts In-Stock

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IDEA Electronic Components Group

UK . 729 parts In-Stock

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$19.864

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Corohmni

South Africa . 358 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Overview

Elevate your electronic projects with the SN74LVC1G08DCK by Texas Instruments, a high-quality logic gate that offers unmatched reliability and performance. Designed for industrial-grade applications, this small outline, thin profile package is perfect for space-constrained designs. With a fast propagation delay of just 8ns, this logic gate ensures quick response times for your circuits. Trust in Texas Instruments' reputation for excellence and upgrade your projects today with the SN74LVC1G08DCK.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards.

No. of Functions: 1

With one function, this logic gate simplifies circuit design and integration.

No. of Inputs: 2

Having two inputs provides flexibility in logic operations.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage of 1.8V makes this product suitable for low power applications.

No. of Terminals: 5

The small number of terminals simplifies the connection process.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers space-saving benefits and ease of integration.

Propagation Delay (tpd): 8 ns

The low propagation delay of 8ns ensures fast and efficient logic operations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for use in extreme conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting options.

Maximum Seated Height: 1.1 mm

The low maximum seated height is beneficial for compact designs.

Width: 1.25 mm

The narrow width allows for efficient use of space on a circuit board.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V enhances compatibility with various systems.

Length: 2 mm

The compact length of 2mm saves space in the overall design.

Temperature Grade: INDUSTRIAL

This industrial-grade product is suitable for robust applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering during assembly.

Terminal Pitch: 0.65 mm

The small terminal pitch enhances the density of connections on a circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this product is suitable for a variety of applications.

Technical Specifications

Logic Gates SN74LVC1G08DCK attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G08DCK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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