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SN74AHC1G08DCKR

Texas Instruments

SN74AHC1G08DCKR by Texas Instruments

SN74AHC1G08DCKR by Texas Instruments is a logic gate with 2 inputs and a propagation delay of 14.5 ns. It operates at a nominal voltage of 3.3V and has a load capacitance of 50 pF. This compact, surface-mount package is commonly used in military-grade applications due to its Schmitt trigger technology and wide temperature range (-55°C to 125°C).

Median Price

$0.057

Lifecycle Status

Suppliers In-Stock

60

In-Stock Inventory

1k+

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Texas Instruments

USA . 623,056 parts In-Stock

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DigiKey

USA . 86,031 parts In-Stock

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$0.100

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$0.047

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$0.038

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$0.100

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Mouser Electronics

USA . 1,869 parts In-Stock

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$0.100

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$0.048

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$0.039

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$0.034

1,869

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$0.034

Newark

USA . 8,146 parts In-Stock

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$0.103

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Arrow

USA . 21,000 parts In-Stock

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Element14

Singapore . 8,086 parts In-Stock

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Verical

USA . 5,610 parts In-Stock

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Rochester

USA . 3,185 parts In-Stock

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Farnell

UK . 1,685 parts In-Stock

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RS (Exports)

UK . 330 parts In-Stock

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Chip1Stop

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Digiode

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TME

Poland . 13,328 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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Bristol Electronics

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Forefront Electronics and Design

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Component Electronics Inc.

Canada . 14,016 parts In-Stock

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Chip Stock

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Connector Distribution Corp

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ECAB

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Atlantic Semiconductor

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Micros

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Elcom Components

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Connect4Technologies Inc.

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Semtec, LLC

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Partservice

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Micros sp.j. W. Kędra i J. Lic

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ACDS - Activité Composants Distribution Service

France . 1,396 parts In-Stock

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Electronics Depot

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Quantum Digital Technology

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Microfarads

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Rebound Electronics

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Ampacity Inc.

Singapore . 69,397 parts In-Stock

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Semicontronic

India . 69,071 parts In-Stock

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Corphita

USA . 4,867 parts In-Stock

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Argo Parts USA

USA . 1,959 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 1,416 parts In-Stock

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Corohmni

South Africa . 1,157 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Continental Prestige Electronics

USA . 20 parts In-Stock

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Microchip USA

USA . 6,023 parts In-Stock

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Parana Technologies

USA . 1,154 parts In-Stock

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DigiPath Technology Company

USA . 911 parts In-Stock

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

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ChromeModa Solutions

Germany . 1,050 parts In-Stock

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Overview

Experience superior quality and reliability with the SN74AHC1G08DCKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures that this logic gate provides outstanding performance and durability. With its compact size and surface mount capability, this versatile device can be easily integrated into various applications. Whether you need to amplify signals or control digital circuits, the SN74AHC1G08DCKR delivers exceptional value by offering fast propagation delay and a wide voltage range. Trust Texas Instruments to provide you with the best-in-class solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material makes this logic gate lightweight and durable, perfect for various electronic applications.

Propagation Delay At Nominal Supply

14.5 ns - With a fast propagation delay, this logic gate ensures efficient signal processing, enabling quick response times in digital circuits.

Surface Mount

YES - The surface mount feature allows for easy installation and integration of this logic gate onto circuit boards, enhancing overall system compactness and ease of assembly.

No. of Inputs

2 - Having two inputs offers flexibility in designing logic circuits, providing options for various input configurations and expanded functionality.

Package Shape

RECTANGULAR - The rectangular package shape enables space-saving placement on circuit boards, making it suitable for high-density applications.

Nominal Supply Voltage / Vsup (V)

3.3 - Operating at a nominal supply voltage of 3.3V, this logic gate is compatible with standard voltage systems, making it widely usable across different electronic devices.

Load Capacitance (CL)

50 pF - With a load capacitance of 50 pF, this logic gate can efficiently handle capacitive loads, ensuring reliable signal transmission and reducing potential signal distortions.

Power Supplies (V)

2/5.5 - Supporting power supplies from 2V to 5.5V, this logic gate offers a wide range of operating voltages, making it adaptable to diverse power requirements.

No. of Terminals

5 - Having five terminals facilitates convenient connection to external circuits, enabling seamless integration and compatibility with other electronic components.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style enhances the space efficiency and thermal dissipation of this logic gate, making it suitable for compact electronic designs.

Maximum I (ol)

8 Amp - With a maximum output current of 8 Amp, this logic gate can effectively drive high-current loads, ensuring robust signal transmission and compatibility with power-hungry components.

Propagation Delay (tpd)

14 ns - This short propagation delay of 14 ns ensures fast signal processing, minimizing data latency and enhancing the overall performance of digital circuits.

Maximum Operating Temperature

125 °C - With a high maximum operating temperature of 125°C, this logic gate can function reliably even in demanding environmental conditions, ensuring consistent performance and longevity.

Output Characteristics

3-STATE - The 3-STATE output characteristics allow for a tri-state output, providing greater flexibility in circuit design and facilitating efficient bus sharing.

Minimum Operating Temperature

55 °C - This logic gate can operate in extreme low-temperature environments with a minimum operating temperature of -55°C, making it suitable for a wide range of applications.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of nickel/palladium/gold terminal finish enhances the contact reliability and corrosion resistance of this logic gate, ensuring long-lasting functionality and improved electrical performance.

Terminal Position

DUAL - The dual terminal position provides flexibility in wiring configurations, making it easier to integrate this logic gate into various circuit layouts.

Maximum Seated Height

1.1 mm - With a low maximum seated height of 1.1mm, this logic gate allows for compact and streamlined PCB designs, enabling space-saving and efficient utilization of circuit board real estate.

Width

1.25 mm - The compact width of 1.25mm ensures a small footprint, enabling easy integration of this logic gate into space-constrained electronic systems.

Minimum Supply Voltage (Vsup)

2 V - Operating at a minimum supply voltage of 2V, this logic gate can function in low-power applications, conserving energy and extending battery life.

Peak Reflow Temperature °C

260 - The ability to withstand a peak reflow temperature of 260°C ensures this logic gate's reliable soldering during assembly processes, offering robust mechanical and thermal performance.

Length

2 mm - With a compact length of 2mm, this logic gate allows for efficient utilization of circuit board space, contributing to space-saving design and enhanced system integration.

Temperature Grade

MILITARY - This logic gate is designed to meet military-grade specifications, ensuring high reliability and performance in rugged or harsh environments.

Schmitt Trigger

YES - The inclusion of a Schmitt trigger in this logic gate provides hysteresis functionality, making it less susceptible to electrical noise and ensuring stable and accurate signal processing.

Technology

CMOS - Utilizing CMOS technology, this logic gate offers a low power consumption, high noise immunity, and broad operating voltage range, making it an ideal choice for power-efficient and versatile electronic systems.

Terminal Form

GULL WING - The gull-wing terminal form simplifies the soldering process, ensuring secure and reliable electrical connections, making it easier to integrate this logic gate into PCB manufacturing processes.

Packing Method

TR, 7 INCH - The tape and reel packaging method with a 7-inch reel simplifies component handling, allowing for automated pick-and-place processes during assembly, increasing productivity and reducing assembly time.

Terminal Pitch

0.65 mm - The narrow terminal pitch of 0.65mm enables high-density board assembly, facilitating the creation of compact electronic systems and efficient utilization of PCB space.

Maximum Supply Voltage (Vsup)

5.5 V - With a maximum supply voltage of 5.5V, this logic gate can handle higher voltage power supplies, ensuring compatibility with a wide range of electrical systems.

Maximum Power Supply Current (ICC)

0.01 mA - Consuming a low power supply current of 0.01mA, this logic gate offers energy efficiency, conserving power and reducing operating costs.

Technical Specifications

Logic Gates SN74AHC1G08DCKR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74AHC1G08DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-534-3150, 5962015343150

NIIN

015343150

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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