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NC7WZ14P6X-L22347

Onsemi

NC7WZ14P6X-L22347 by Onsemi

The Onsemi NC7WZ14P6X-L22347 is a CMOS logic gate with Schmitt Trigger technology. It has a propagation delay of 12.3 ns and operates at a supply voltage range of 1.65V to 5.5V. Ideal for applications requiring fast signal processing in compact designs, such as consumer electronics and IoT devices.

Median Price

$0.072

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Mouser Electronics

USA . 20,285 parts In-Stock

1+ parts

$0.450

100+ parts

$0.144

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$0.125

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$0.124

20,285

$0.450

$0.144

$0.125

$0.124

Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$32.521

100+ parts

$30.895

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$30.895

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500

$32.521

$30.895

$30.895

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Verical

USA . 22,000 parts In-Stock

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$0.067

22,000

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$0.067

Rochester

USA . 22,000 parts In-Stock

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$0.072

1k+ parts

$0.060

10k+ parts

$0.053

22,000

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$0.072

$0.060

$0.053

Avnet

USA . 18,000 parts In-Stock

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$0.050

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$0.050

Distributors (In-Stock)

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Digiode

USA . 1,946 parts In-Stock

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$0.056

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1,946

$0.056

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Nova Conductors

Japan . 500 parts In-Stock

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$0.104

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500

$0.104

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Flip Electronics

USA . 144,000 parts In-Stock

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Chip Stock

USA . 131,271 parts In-Stock

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Martec Srl

Italy . 21,363 parts In-Stock

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Bristol Electronics

USA . 18,990 parts In-Stock

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Vyrian

USA . 10,100 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,000 parts In-Stock

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Sensible Micro Corp

USA . 1,989 parts In-Stock

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1,989

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ComSIT Distribution GmbH

Germany . 1,005 parts In-Stock

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1,005

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ComSIT USA

USA . 1,005 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 13,196 parts In-Stock

1+ parts

$0.050

100+ parts

$0.049

1k+ parts

$0.048

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13,196

$0.050

$0.049

$0.048

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Ampacity Inc.

Singapore . 10,741 parts In-Stock

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$0.050

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$0.050

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Corohmni

South Africa . 262 parts In-Stock

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$0.051

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262

$0.051

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Corphita

USA . 1,573 parts In-Stock

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$0.053

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1,573

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Aranea Global

USA . 500 parts In-Stock

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$0.102

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$0.098

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500

$0.102

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$0.098

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Argo Parts USA

USA . 4,890 parts In-Stock

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$0.104

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$0.101

4,890

$0.104

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$0.101

Continental Prestige Electronics

USA . 2,237 parts In-Stock

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$0.104

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$0.102

2,237

$0.104

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$0.102

Modulus Dynamics

Lithuania . 15 parts In-Stock

1+ parts

$0.115

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$0.114

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$0.111

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15

$0.115

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Microchip USA

USA . 9,200 parts In-Stock

1+ parts

$3.120

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$3.120

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$3.120

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$3.120

9,200

$3.120

$3.120

$3.120

$3.120

Aztec Data Supply Inc.

USA . 10,226 parts In-Stock

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$29.288

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$29.288

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$32.521

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$30.895

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$30.895

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$32.521

$30.895

$30.895

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RC Electronics

USA . 60,000 parts In-Stock

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Eastek

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Lixinc

USA . 12,285 parts In-Stock

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Futuretech Components

Singapore . 8,980 parts In-Stock

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TANS Electronics

Latvia . 5,704 parts In-Stock

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Kulean Microsystems

USA . 4,887 parts In-Stock

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SupplyDigital Components

Austria . 4,368 parts In-Stock

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Problanco Electronics

Mexico . 2,571 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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$11.454

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$11.454

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$11.454

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$11.454

Lucentia Tech

USA . 2,000 parts In-Stock

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$11.454

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$11.454

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$11.454

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$11.454

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$11.454

UHIMA Technologies

Türkiye . 984 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of seamless logic gates with the NC7WZ14P6X-L22347 by Onsemi. Crafted with precision and expertise, this small outline, thin profile chip offers lightning-fast propagation delay and a wide operating temperature range, making it ideal for a variety of applications. Whether you're designing consumer electronics or industrial machinery, this Schmitt trigger-equipped CMOS technology marvel delivers unmatched performance and reliability. Elevate your projects with the quality and innovation that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 12.3 ns

The low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in one component helps in reducing the overall circuit complexity and cost.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement reduces power consumption and makes the product energy efficient.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures compatibility with a wide range of external components, enhancing flexibility in circuit design.

No. of Terminals: 6

The number of terminals provides sufficient connectivity options for interfacing with other devices in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB, allowing for denser circuit layouts.

Maximum I (ol): 32 Amp

The high maximum output current rating ensures the product can drive heavy loads without overheating or performance degradation.

Propagation Delay (tpd): 14.7 ns

Although slightly higher than the nominal delay, the propagation delay is still within acceptable limits for most applications.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the product to function reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in cold environments without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and ensures reliable electrical connections for extended product lifespan.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and allows for easier routing of interconnections.

Maximum Seated Height: 1.1 mm

The low seated height minimizes the overall profile of the product, making it suitable for compact electronic devices.

Width: 1.25 mm

The narrow width of the product saves space on the PCB and enables efficient use of board real estate.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement ensures the product can operate reliably even with fluctuating power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and assembly of the product during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without damage.

Length: 2 mm

The compact length of the product allows for efficient use of space on the PCB, especially in space-constrained designs.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger helps in reducing noise and improving signal integrity in the circuit, enhancing overall performance.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering onto the PCB, ensuring secure and reliable connections.

Packing Method: TR

The specified packing method ensures convenient handling and storage of the product during distribution and assembly processes.

Terminal Pitch: 0.65 mm

The small terminal pitch enables fine-pitch mounting, allowing for high-density integration on the PCB and compact circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage rating provides flexibility in power supply options and ensures compatibility with a wide range of systems.

Maximum Power Supply Current (ICC): 100 mA

The specified maximum power supply current allows for safe operation within the defined limits, preventing overheating and damage to the product.

Technical Specifications

Logic Gates NC7WZ14P6X-L22347 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

12.3 ns

Propagation Delay (tpd):

14.7 ns

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NC7WZ14P6X-L22347 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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