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SN74LVC1G00DBVRE4

Texas Instruments

SN74LVC1G00DBVRE4 by Texas Instruments

SN74LVC1G00DBVRE4 by Texas Instruments is a logic gate with 2 inputs and a propagation delay of 4.7 ns. It operates at a nominal voltage of 3.3V and is suitable for automotive applications due to its temperature grade.

Median Price

$0.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,687 parts In-Stock

1+ parts

$0.420

100+ parts

$0.221

1k+ parts

$0.195

10k+ parts

$0.145

1,687

$0.420

$0.221

$0.195

$0.145

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Nova Conductors

Japan . 200 parts In-Stock

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$0.155

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200

$0.155

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Digiode

USA . 2,075 parts In-Stock

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$0.399

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2,075

$0.399

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Vyrian

USA . 6,477 parts In-Stock

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Semtec, LLC

USA . 2,682 parts In-Stock

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2,682

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Distributors (Availability)

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Corohmni

South Africa . 988 parts In-Stock

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$0.155

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988

$0.155

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Argo Parts USA

USA . 4,958 parts In-Stock

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$0.155

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$0.150

4,958

$0.155

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$0.150

Continental Prestige Electronics

USA . 3,576 parts In-Stock

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$0.155

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$0.152

3,576

$0.155

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$0.152

Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$0.160

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$0.152

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$0.152

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650

$0.160

$0.152

$0.152

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Ampacity Inc.

Singapore . 6,343 parts In-Stock

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$0.357

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$0.357

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Semicontronic

India . 6,082 parts In-Stock

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$0.357

100+ parts

$0.348

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$0.346

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6,082

$0.357

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$0.346

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Corphita

USA . 2,811 parts In-Stock

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$0.378

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2,811

$0.378

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Parana Technologies

USA . 355 parts In-Stock

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$20.212

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$20.186

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355

$20.212

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DigiPath Technology Company

USA . 1,263 parts In-Stock

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$22.256

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$20.475

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1,263

$22.256

$20.475

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ChromeModa Solutions

Germany . 4,659 parts In-Stock

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$22.710

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$18.622

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4,659

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$18.622

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IDEA Electronic Components Group

UK . 77 parts In-Stock

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$22.710

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$21.574

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$20.439

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77

$22.710

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$20.439

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Microchip USA

USA . 1,991 parts In-Stock

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Overview

Discover the power of the SN74LVC1G00DBVRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. The SN74LVC1G00DBVRE4 belongs to the Logic Gates category, making it an essential component for various digital applications. With its compact design and low profile package, this product offers convenience and flexibility. Boasting a fast propagation delay of just 4.7 ns, it delivers lightning-fast performance. Whether you're working on automotive electronics or other cutting-edge projects, the SN74LVC1G00DBVRE4 is your go-to solution. Experience the value and benefits it brings to your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this logic gate durable and resistant to external influences, ensuring its longevity and reliability.

Propagation Delay At Nominal Supply: 4.7 ns

With a low propagation delay of 4.7 ns at a nominal supply voltage, this logic gate enables fast and efficient signal processing, making it suitable for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy integration and installation of this logic gate onto circuit boards, reducing assembly time and making it a convenient choice for manufacturers.

No. of Inputs: 2

With two input ports, this logic gate provides flexibility and versatility in processing and manipulating electronic signals, expanding its application range.

Package Shape: RECTANGULAR

The rectangular package shape of this logic gate allows for efficient utilization of space on circuit boards, optimizing layout designs and improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this logic gate offers compatibility with a wide range of electronic systems, making it a versatile component for various applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable performance and reduces signal distortions, making this logic gate suitable for high-speed data transmission and digital circuit applications.

Power Supplies (V): 3.3

With a power supply voltage of 3.3V, this logic gate promotes energy efficiency, helping to minimize power consumption and extend the lifespan of electronic devices.

No. of Terminals: 5

Having five terminals allows for easy connectivity and integration with other electronic components, simplifying circuit design and enhancing overall system functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style provide space-saving advantages without compromising performance, making this logic gate suitable for compact and portable electronic devices.

Maximum I (ol): 32 Amp

The maximum output current of 32 Amp ensures the capability to deliver high-power outputs, making this logic gate ideal for demanding applications that require robust signal drives.

Propagation Delay (tpd): 9 ns

The propagation delay of 9 ns indicates fast signal propagation within the logic gate, enabling quick response times and efficient signal processing in electronic systems.

Maximum Operating Temperature: 125 °C

Designed to operate at a maximum temperature of 125°C, this logic gate exhibits excellent thermal stability, ensuring reliable performance even under extreme operating conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate remains functional in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides superior corrosion resistance, ensuring long-term reliability and preventing signal degradation over time.

Terminal Position: DUAL

The dual terminal position facilitates easy installation and connection, enhancing convenience during circuit assembly and maintenance.

Maximum Seated Height: 1.45 mm

With a maximum seated height of 1.45 mm, this logic gate offers a low-profile design, making it suitable for applications with limited vertical space constraints.

Width: 1.6 mm

The width of 1.6 mm ensures a compact form factor, optimizing circuit board layout and allowing for dense integration of electronic components.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a minimum supply voltage of 1.65V, this logic gate enables energy-efficient operation while ensuring reliable performance in low-power applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures the compatibility of this logic gate with standard reflow soldering processes, simplifying manufacturing and assembly processes.

Length: 2.9 mm

With a length of 2.9 mm, this logic gate offers a compact size, allowing for efficient utilization of space on circuit boards and ensuring easy integration into electronic systems.

Temperature Grade: AUTOMOTIVE

The temperature grade of automotive indicates that this logic gate is rated for use in automotive applications, making it suitable for automotive electronics and ensuring reliability under challenging temperature conditions.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form allows for secure soldering connections, ensuring reliable electrical contact and simplifying the assembly process in circuit board manufacturing.

Packing Method: TR

The TR (Tape & Reel) packing method simplifies product handling and promotes automation during assembly, making this logic gate suitable for high-volume production environments.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95 mm, this logic gate supports high-density packaging, facilitating miniaturization and enabling the efficient use of limited board space.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5V, this logic gate offers flexibility in various electronic systems, providing compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 0.01 mA

The maximum power supply current of 0.01 mA ensures low power consumption, making this logic gate energy-efficient and suitable for battery-powered applications.

Technical Specifications

Logic Gates SN74LVC1G00DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G00DBVRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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