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NL17SZ07DFT2G

Onsemi

NL17SZ07DFT2G by Onsemi

NL17SZ07DFT2G by Onsemi is a logic gate with 1 input and an open-drain output. It operates at a nominal voltage of 1.8V and has a max operating temperature of 125°C. This small outline, thin profile package is suitable for military-grade applications.

Median Price

$0.042

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USA . 22,258 parts In-Stock

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DigiKey

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Verical

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Master Electronics

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Arrow

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Chip1Stop

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Avnet

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Rochester

USA . 3,200 parts In-Stock

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Digiode

USA . 1,036 parts In-Stock

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TME

Poland . 2,362 parts In-Stock

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Nova Conductors

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Chip Stock

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NAC Semi

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IBS Electronics

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Micros

Poland . 2,958 parts In-Stock

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Inventory MP

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Partservice

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Micros sp.j. W. Kędra i J. Lic

Poland . 2,458 parts In-Stock

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Speed Components Ltd

Israel . 1,680 parts In-Stock

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Semicontronic

India . 92,168 parts In-Stock

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Ampacity Inc.

Singapore . 92,131 parts In-Stock

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Component Stockers USA

USA . 652,396 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Vigor

Singapore . 820 parts In-Stock

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Microchip USA

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New Zealand . 2,000 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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UHIMA Technologies

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Discover the NL17SZ07DFT2G by Onsemi, a high-quality logic gate that delivers exceptional performance and reliability. As a trusted manufacturer, Onsemi ensures top-notch craftsmanship and cutting-edge technology in every product. This logic gate offers countless advantages in various applications, thanks to its compact design and versatile features. Experience the value of seamless integration, enhanced functionality, and superior efficiency with the NL17SZ07DFT2G. Unlock new possibilities and streamline your projects with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and resistance to damage, making it a reliable choice.

Surface Mount: YES

With surface mount capability, this product allows for easy and efficient installation onto circuit boards, enhancing convenience and saving space.

No. of Functions: 1

Featuring one function, this logic gate simplifies circuit design and integration, streamlining the overall system.

No. of Inputs: 1

With a single input, this logic gate offers straightforward operation, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape of this product facilitates easy positioning and installation onto circuit boards, ensuring compatibility with standard design layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V, this logic gate provides energy-efficient performance while minimizing power consumption.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate efficiently handles input signals, maintaining signal integrity and preventing data loss.

Power Supplies (V): 3.3

Designed for use with a power supply voltage of 3.3V, this logic gate is compatible with common power sources and ensures reliable operation.

No. of Terminals: 5

Featuring five terminals, this logic gate offers a sufficient number of connection points, enabling easy integration within a circuit system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product allow for compact circuit design and space optimization.

Maximum I (ol): 32 Amp

With a maximum output current of 32 Amp, this logic gate can handle high current loads, providing robust and reliable performance.

Propagation Delay (tpd): 12 ns

The propagation delay of 12 nanoseconds ensures fast and efficient signal transmission, facilitating quick response times in applications.

Maximum Operating Temperature: 125 °C

This logic gate can operate at a maximum temperature of 125°C, making it suitable for demanding environments and ensuring reliability under high-temperature conditions.

Output Characteristics: OPEN-DRAIN

Featuring open-drain output characteristics, this logic gate provides versatility and compatibility with various signal levels, enhancing flexibility in system design.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this logic gate is suitable for use in extreme cold conditions, ensuring reliable operation in harsh environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish of this product ensures excellent contact reliability and longevity, enhancing overall performance and reducing potential signal degradation.

Terminal Position: DUAL

With dual terminal positions, this logic gate offers flexibility in circuit board layout and facilitates efficient connection arrangements.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this logic gate boasts a low-profile design, promoting space-saving characteristics and enabling compact system designs.

Width: 1.25 mm

With a width of 1.25 mm, this logic gate is compact and space-efficient, allowing for efficient circuit integration and optimized design layouts.

Minimum Supply Voltage (Vsup): 1.65 V

This logic gate can operate at a minimum supply voltage of 1.65V, providing flexibility and compatibility with low-voltage systems.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand peak reflow temperatures for a maximum duration of 30 seconds, this logic gate offers robust solder joint reliability during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate ensures proper solder reflow and secure component attachment during assembly processes.

Length: 2 mm

Measuring only 2 mm in length, this logic gate is compact and space-saving, enabling efficient circuit board design and integration.

Temperature Grade: MILITARY

This logic gate is built to meet military-grade standards, ensuring high-quality performance, durability, and reliability in demanding and critical applications.

Technology: CMOS

This logic gate utilizes complementary metal-oxide-semiconductor (CMOS) technology, providing low power consumption, high speed, and excellent noise immunity, making it an ideal choice for power-efficient systems.

Terminal Form: GULL WING

With gull wing terminal form, this logic gate allows for easy and secure soldering, ensuring reliable electrical connections and simplifying assembly processes.

Packing Method: TR

Packaged in tape and reel format (TR), this logic gate offers convenient handling, storage, and automated manufacturing, improving efficiency and reducing assembly time.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate allows for precise and compact connection arrangements, enhancing circuit density and enabling intricate designs.

Moisture Sensitivity Level (MSL): 1

Featuring a moisture sensitivity level of 1, this logic gate is resistant to moisture-related issues during storage and assembly, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this logic gate offers compatibility with a wide range of power sources, providing flexibility in system design.

Maximum Power Supply Current (ICC): 100 mA

With a maximum power supply current of 100 mA, this logic gate delivers sufficient power to drive connected components, ensuring stable and reliable operation.

Technical Specifications

Logic Gates NL17SZ07DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SZ07DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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