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SN74LVC2G14DCKRE4

Texas Instruments

SN74LVC2G14DCKRE4 by Texas Instruments

SN74LVC2G14DCKRE4 by Texas Instruments is a logic gate with 2 functions and 1 input. It has a propagation delay of 6 ns and operates at a nominal voltage of 1.8V. This device is commonly used in automotive applications due to its small size and Schmitt trigger technology.

Median Price

$0.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$0.650

100+ parts

$0.361

1k+ parts

$0.309

10k+ parts

$0.288

500

$0.650

$0.361

$0.309

$0.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

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500

$0.348

-

-

-

Digiode

USA . 224 parts In-Stock

1+ parts

$0.560

100+ parts

-

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-

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224

$0.560

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Chip Stock

USA . 103,920 parts In-Stock

1+ parts

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103,920

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Vyrian

USA . 22,805 parts In-Stock

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22,805

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,426 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

$0.338

3,426

$0.348

-

-

$0.338

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

$0.331

10k+ parts

$0.324

2,000

$0.348

-

$0.331

$0.324

Continental Prestige Electronics

USA . 904 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

$0.341

904

$0.348

-

-

$0.341

Corohmni

South Africa . 46 parts In-Stock

1+ parts

$0.348

100+ parts

-

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46

$0.348

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.358

100+ parts

$0.341

1k+ parts

$0.341

10k+ parts

-

450

$0.358

$0.341

$0.341

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Modulus Dynamics

Lithuania . 15 parts In-Stock

1+ parts

$0.386

100+ parts

$0.382

1k+ parts

$0.371

10k+ parts

-

15

$0.386

$0.382

$0.371

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Ampacity Inc.

Singapore . 22,744 parts In-Stock

1+ parts

$0.500

100+ parts

-

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22,744

$0.500

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Corphita

USA . 3,507 parts In-Stock

1+ parts

$0.531

100+ parts

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3,507

$0.531

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Semicontronic

India . 23,005 parts In-Stock

1+ parts

$0.910

100+ parts

$0.887

1k+ parts

$0.883

10k+ parts

-

23,005

$0.910

$0.887

$0.883

-

Parana Technologies

USA . 921 parts In-Stock

1+ parts

$16.727

100+ parts

-

1k+ parts

$16.978

10k+ parts

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921

$16.727

-

$16.978

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DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

$18.418

100+ parts

$16.945

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-

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1,177

$18.418

$16.945

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ChromeModa Solutions

Germany . 3,494 parts In-Stock

1+ parts

$18.794

100+ parts

$15.411

1k+ parts

-

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3,494

$18.794

$15.411

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IDEA Electronic Components Group

UK . 1,225 parts In-Stock

1+ parts

$18.794

100+ parts

$17.854

1k+ parts

$16.915

10k+ parts

-

1,225

$18.794

$17.854

$16.915

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Microchip USA

USA . 1,138 parts In-Stock

1+ parts

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1,138

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Robosynatics

Brazil . 10 parts In-Stock

1+ parts

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$85.595

1k+ parts

$85.595

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$85.595

10

-

$85.595

$85.595

$85.595

Lucentia Tech

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$85.595

1k+ parts

$85.595

10k+ parts

$85.595

10

-

$85.595

$85.595

$85.595

Overview

Discover the SN74LVC2G14DCKRE4 by Texas Instruments, a high-quality logic gate that offers incredible value and benefits for customers. With its advanced CMOS technology and automotive-grade temperature grade, this compact rectangular package delivers fast propagation delay and reliable performance. Whether you're designing automotive applications or working on other projects that require precise and efficient logic gates, the SN74LVC2G14DCKRE4 is your go-to solution. Trust in Texas Instruments' expertise and choose this product for seamless integration, exceptional quality, and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This Logic Gate is designed with a durable plastic/epoxy material, ensuring long-lasting performance and resistance to external elements.

Propagation Delay At Nominal Supply: 6 ns

With a low propagation delay, this Logic Gate offers fast signal processing, thereby enhancing the overall efficiency of the system.

Surface Mount: YES

Being surface mountable, this Logic Gate provides easy installation and space-saving advantages, making it suitable for compact electronic applications.

No. of Functions: 2

With two functions in a single package, this Logic Gate offers increased versatility and functionality, reducing the need for additional components.

No. of Inputs: 1

With one input, this Logic Gate simplifies circuit designs and reduces complexity, making it more user-friendly for various applications.

Package Shape: RECTANGULAR

Designed in a rectangular shape, this Logic Gate allows for easy integration into circuit layouts, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 1.8

With a low nominal supply voltage requirement, this Logic Gate contributes to reduced power consumption and increased energy efficiency.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures compatibility with a wide range of devices and circuits, promoting seamless signal transmission.

Power Supplies (V): 3.3

Operating with a power supply voltage of 3.3V, this Logic Gate aligns with commonly used voltage levels, facilitating integration into various systems.

No. of Terminals: 6

This Logic Gate features six terminals, enabling convenient connections and compatibility with standard electronic interfaces.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this Logic Gate enable space-saving installation and efficient circuit board layouts.

Maximum I (ol): 32 Amp

With a high maximum output current of 32 Amps, this Logic Gate can drive circuits with higher loads, ensuring reliable operation in demanding applications.

Propagation Delay (tpd): 9.5 ns

The propagation delay of 9.5 ns ensures quick response times, enabling fast data processing and enhancing system performance.

Maximum Operating Temperature: 125 °C

Designed for high-temperature environments, this Logic Gate maintains optimal functionality and reliability up to a maximum operating temperature of 125°C.

Output Characteristics: 3-STATE

Featuring 3-STATE output characteristics, this Logic Gate allows for high impedance control, enabling multiple devices to share a common bus efficiently.

Minimum Operating Temperature: -40 °C

This Logic Gate can operate reliably even in extremely cold environments, with a minimum operating temperature of -40°C.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: DUAL

With dual terminal positions, this Logic Gate offers flexibility in circuit board designs, allowing for different PCB layouts and component orientations.

Maximum Seated Height: 1.1 mm

The maximum seated height of 1.1 mm ensures compatibility with low-profile applications, optimizing space utilization in compact designs.

Width: 1.25 mm

With a narrow width of 1.25 mm, this Logic Gate saves valuable board space, allowing for more efficient placement of other components.

Minimum Supply Voltage (Vsup): 1.65 V

Operating with a minimum supply voltage of 1.65V, this Logic Gate operates reliably in low voltage conditions, expanding its range of potential applications.

Maximum Time At Peak Reflow Temperature (s): 30

This Logic Gate can withstand peak reflow temperatures for up to 30 seconds, ensuring its durability during the soldering process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this Logic Gate can withstand high-temperature soldering processes, ensuring proper solder joint formation.

Length: 2 mm

The compact length of 2 mm allows for efficient space utilization and easy accommodation in various circuit layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this Logic Gate meets specific temperature requirements and ensures reliable operation under automotive environmental conditions.

Schmitt Trigger: YES

Featuring a Schmitt Trigger, this Logic Gate provides improved noise immunity and hysteresis, enhancing the stability and reliability of input signal processing.

Technology: CMOS

Built using CMOS technology, this Logic Gate offers low power consumption, high noise immunity, and compatibility with various logic families, making it suitable for a wide range of applications.

Terminal Form: GULL WING

With a gull wing terminal form, this Logic Gate allows for easy surface mounting and soldering, simplifying the manufacturing process.

Packing Method: TR

This Logic Gate is packed using Tape and Reel packaging, providing convenient handling, storage, and automated assembly in manufacturing processes.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm enables easy integration with standard surface mount technologies and supports precise component placement.

Moisture Sensitivity Level (MSL): 1

With an MSL of 1, this Logic Gate has a low moisture sensitivity rating, ensuring reliable performance and long shelf life.

Maximum Supply Voltage (Vsup): 5.5 V

Operating with a maximum supply voltage of 5.5V, this Logic Gate can handle higher voltage levels, ensuring compatibility in various systems.

Maximum Power Supply Current (ICC): 0.01 mA

The maximum power supply current of 0.01 mA ensures minimal power consumption, making this Logic Gate energy-efficient and suitable for low-power applications.

Technical Specifications

Logic Gates SN74LVC2G14DCKRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC2G14DCKRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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