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NL17SZ06DFT2G

Onsemi

NL17SZ06DFT2G by Onsemi

NL17SZ06DFT2G by Onsemi is a CMOS Logic Gate with 6ns Propagation Delay at 3.3V, suitable for military applications. It features a max I (ol) of 24A and operates b/w -55 to 125°C temperature range. This surface-mount device has a small outline package with dual terminals and matte tin finish.

Median Price

$0.034

Lifecycle Status

Suppliers In-Stock

22

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1k+

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Rochester

USA . 3,000 parts In-Stock

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$0.034

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$0.032

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$0.029

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3,000

$0.034

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DigiKey

USA . 15,846 parts In-Stock

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$0.100

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$0.035

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$0.028

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$0.024

15,846

$0.100

$0.035

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$0.024

Mouser Electronics

USA . 12,178 parts In-Stock

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$0.035

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Avnet

USA . 66,000 parts In-Stock

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Arrow

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Verical

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Distributors (In-Stock)

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Digiode

USA . 2,159 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

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NAC Semi

USA . 114,000 parts In-Stock

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Flip Electronics

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Cyclops Electronics Ltd

UK . 8,432 parts In-Stock

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Bristol Electronics

USA . 6,548 parts In-Stock

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$0.118

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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Dan-Mar Components

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Vyrian

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Sensible Micro Corp

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Semi Source

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Prism Electronics

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Component Sense

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Microfarads

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PC Components Company LLC

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,526 parts In-Stock

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Semicontronic

India . 5,153 parts In-Stock

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Corphita

USA . 2,314 parts In-Stock

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Corohmni

South Africa . 248 parts In-Stock

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Continental Prestige Electronics

USA . 6,338 parts In-Stock

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Argo Parts USA

USA . 403 parts In-Stock

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403

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Netroflash

USA . 100 parts In-Stock

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Vigor

Singapore . 444 parts In-Stock

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Aztec Data Supply Inc.

USA . 212 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

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Kepictronics

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TANS Electronics

Latvia . 7,769 parts In-Stock

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Kulean Microsystems

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Computer Components Inc. - USA

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SupplyDigital Components

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A-Z Elektronik GmbH

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GreenTree Electronics

Israel . 2,606 parts In-Stock

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Problanco Electronics

Mexico . 2,307 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 710 parts In-Stock

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UHIMA Technologies

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Lixinc

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Microchip USA

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Overview

Discover the NL17SZ06DFT2G by Onsemi, a high-quality logic gate that offers precision and reliability for your electronic projects. Manufactured by Onsemi, a trusted name in the industry, this logic gate is perfect for applications requiring fast propagation delay and low power consumption. With a wide operating temperature range and compact design, the NL17SZ06DFT2G is versatile and efficient. Upgrade your electronics with this innovative component and experience superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 6 ns

Fast propagation delay allows for quick processing of signals, making it suitable for high-speed applications.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.3

Operates efficiently at a low supply voltage, reducing power consumption and heat generation.

Load Capacitance (CL): 50 pF

Designed to work effectively with a typical load capacitance, ensuring compatibility with standard circuits.

Power Supplies (V): 3.3

Compatible with common power supply voltages, making it versatile for a variety of applications.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for flexibility in configuring the product for different signal requirements.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for operation in industrial or harsh environments.

Minimum Operating Temperature: -55 °C

Operates reliably in extreme cold conditions, expanding its range of potential applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-powered devices and noise-sensitive applications.

Technical Specifications

Logic Gates NL17SZ06DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SZ06DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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