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MC74VHC1G08DFT1G

Onsemi

MC74VHC1G08DFT1G by Onsemi

MC74VHC1G08DFT1G by Onsemi is a logic gate with 2 inputs, 11 ns propagation delay, and 3-STATE output. Operating at -55 to 125 °C, it has a supply voltage range of 2-5.5 V and load capacitance of 50 pF. Ideal for applications requiring fast signal processing in compact spaces.

Median Price

$0.026

Lifecycle Status

Suppliers In-Stock

33

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1k+

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Newark

USA . 1,297 parts In-Stock

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Adafruit Industries

USA . 60 parts In-Stock

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Arrow

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EBV Elektronik

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DigiKey

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Rochester

USA . 8,000 parts In-Stock

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Farnell

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Element14

Singapore . 1,897 parts In-Stock

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Digiode

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Component Electronics Inc.

Canada . 2,374 parts In-Stock

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Nova Conductors

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Chip Stock

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NAC Semi

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Vyrian

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Semi Source

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Connector Distribution Corp

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Florida Circuit

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Bristol Electronics

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PC Components Company LLC

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Ampacity Inc.

Singapore . 10,918 parts In-Stock

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Corphita

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Corohmni

South Africa . 243 parts In-Stock

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Semicontronic

India . 15,578 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

USA . 833 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,263 parts In-Stock

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Component Stockers USA

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Perfect Parts

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Microchip USA

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Speed Components Ltd (Excess)

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iodParts Technologies Inc.

India . 3,021 parts In-Stock

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SupplyDigital Components

Austria . 2,934 parts In-Stock

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Alle Elektronik GmbH

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A-Z Elektronik GmbH

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Netroflash

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

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Lucentia Tech

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Glotronic Ltd.

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Overview

Enhance your electronic projects with the MC74VHC1G08DFT1G logic gate by Onsemi! With top-notch quality and reliability from a trusted manufacturer, this logic gate is perfect for a wide range of applications. Its efficient design and fast propagation delay make it ideal for quick response times in your circuits. Whether you're a hobbyist or a professional, this compact and versatile component offers exceptional value and performance. Upgrade your projects today with the MC74VHC1G08DFT1G and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 11 ns

The low propagation delay ensures fast processing speed and efficient operation of the logic gates.

Surface Mount: YES

Being surface-mountable makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, compatible with many electronic systems and circuits.

Output Characteristics: 3-STATE

The 3-state output allows the logic gate to have a high impedance state, which is useful for bus systems and multiplexing.

Technical Specifications

Logic Gates MC74VHC1G08DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

MC74VHC1G08DFT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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