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SN74LVC1G02DBVRG4

Texas Instruments

SN74LVC1G02DBVRG4 by Texas Instruments

SN74LVC1G02DBVRG4 by Texas Instruments is a logic gate with 2 inputs, 3.3V nominal voltage, and 8ns propagation delay. It is used in automotive applications due to its small outline package and low power consumption of 0.01mA at max supply voltage of 5.5V.

Median Price

$0.201

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13

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1k+

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Texas Instruments

USA . 657,197 parts In-Stock

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$0.201

100+ parts

$0.137

1k+ parts

$0.070

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657,197

$0.201

$0.137

$0.070

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Mouser Electronics

USA . 3,921 parts In-Stock

1+ parts

$0.360

100+ parts

$0.191

1k+ parts

$0.161

10k+ parts

$0.132

3,921

$0.360

$0.191

$0.161

$0.132

Rochester

USA . 19,000 parts In-Stock

1+ parts

-

100+ parts

$0.172

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$0.142

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$0.127

19,000

-

$0.172

$0.142

$0.127

DigiKey

USA . 19,000 parts In-Stock

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$0.210

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$0.210

Verical

USA . 15,000 parts In-Stock

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$0.159

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$0.159

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Digiode

USA . 3,972 parts In-Stock

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$0.092

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3,972

$0.092

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Nova Conductors

Japan . 10 parts In-Stock

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$0.106

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10

$0.106

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Vyrian

USA . 143,852 parts In-Stock

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Chip Stock

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DigiKey Marketplace

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$0.100

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Sensible Micro Corp

USA . 761 parts In-Stock

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ComSIT Distribution GmbH

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India . 143,726 parts In-Stock

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$0.082

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$0.080

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143,726

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$0.080

$0.080

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Ampacity Inc.

Singapore . 143,370 parts In-Stock

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$0.082

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Corphita

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$0.087

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Continental Prestige Electronics

USA . 6,938 parts In-Stock

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$0.106

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$0.104

6,938

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$0.104

Argo Parts USA

USA . 1,144 parts In-Stock

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$0.106

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$0.103

1,144

$0.106

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$0.103

Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$18.281

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$16.636

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$14.990

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5,000

$18.281

$16.636

$14.990

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Parana Technologies

USA . 2,055 parts In-Stock

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$20.895

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$21.085

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2,055

$20.895

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$21.085

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DigiPath Technology Company

USA . 1,068 parts In-Stock

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$23.007

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$23.007

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IDEA Electronic Components Group

UK . 2,186 parts In-Stock

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$23.477

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$22.303

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$21.129

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South Africa . 652 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74LVC1G02DBVRG4 logic gate. Designed with precision and expertise, this small outline, low-profile package offers a fast propagation delay of just 4.5ns, making it ideal for automotive applications where speed is crucial. With a wide temperature range and high operating voltage, this logic gate provides exceptional performance and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the SN74LVC1G02DBVRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and helps protect the internal components of the logic gate, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast signal processing, making this logic gate suitable for applications where speed is critical.

Surface Mount: YES

Being surface mountable makes this logic gate easy to integrate into electronic circuits, saving space and facilitating automated assembly processes.

No. of Inputs: 2

With two inputs, this logic gate can perform basic logic functions efficiently, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V makes integration with other components simpler and more compatible in many electronic systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stability and performance in driving connected components without undue signal degradation.

Power Supplies (V): 3.3

Matching the power supply voltage of 3.3V ensures optimal performance and compatibility with other components in the system.

No. of Terminals: 5

Having five terminals allows for easy connection and integration of the logic gate into electronic circuits, providing flexibility in system design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low-profile package style saves space on the circuit board and enables dense packing of components for efficient design layouts.

Maximum I (ol): 32 Amp

With a high maximum output current capability of 32A, this logic gate can drive demanding loads effectively, increasing its versatility in various applications.

Propagation Delay (tpd): 8 ns

Although slightly higher than the nominal value, the propagation delay of 8ns is still fast enough for many applications, providing a good balance between speed and reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance of 125°C ensures reliable operation even in demanding environments or under heavy load conditions.

Output Characteristics: 3-STATE

The 3-state output feature allows the logic gate to actively drive the output high, drive it low, or enter a high-impedance state, providing versatility in system design and control.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in cold environments, making this logic gate suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Ni/Pd/Au provides excellent conductivity, corrosion resistance, and solderability for reliable connections and long-term performance.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in mounting and connection options, allowing for easy integration into various circuit layouts and configurations.

Maximum Seated Height: 1.45 mm

The low maximum seated height helps in compact design layouts and allows for efficient use of board space in electronic systems.

Width: 1.6 mm

The compact width dimension of 1.6mm enables space-saving integration of this logic gate into circuit designs without compromising performance.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V allows for operation in low-power applications and extends the range of compatible systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures robust soldering processes during assembly, maintaining the integrity of connections for reliable performance.

Length: 2.9 mm

The compact length dimension of 2.9mm contributes to space-efficient circuit board designs and facilitates compact electronic system layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this logic gate meets stringent temperature requirements and ensures reliable performance in automotive environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making this logic gate energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form provides secure mounting and reliable connections during soldering, enhancing the durability and performance of this logic gate.

Packing Method: TR

The tape and reel packing method (TR) facilitates automated assembly processes, saving time and effort during production and ensuring consistent product quality.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm enables close spacing of terminals on the package, allowing for compact designs and efficient use of board space.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this logic gate can operate in systems with higher voltage requirements, offering flexibility and compatibility with various power sources.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current of 0.01mA indicates energy-efficient operation, making this logic gate suitable for low-power applications and extending battery life in portable devices.

Technical Specifications

Logic Gates SN74LVC1G02DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G02DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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