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MC74VHC1G04DFT1G

Onsemi

MC74VHC1G04DFT1G by Onsemi

MC74VHC1G04DFT1G by Onsemi is a CMOS logic gate with 5 terminals, operating at -55 to 125 °C. It has a propagation delay of 14.5 ns and can handle a load capacitance of 50 pF. Ideal for military applications due to its small size, low power consumption (50 mA), and wide supply voltage range (2-5.5 V).

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Mouser Electronics

USA . 33,963 parts In-Stock

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Newark

USA . 1,158 parts In-Stock

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Adafruit Industries

USA . 650 parts In-Stock

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Arrow

USA . 33,000 parts In-Stock

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Verical

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Chip1Stop

Japan . 13,780 parts In-Stock

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Avnet

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Farnell

UK . 2,873 parts In-Stock

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Element14

Singapore . 1,378 parts In-Stock

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Digiode

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Nova Conductors

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Flip Electronics

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Chip Stock

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NAC Semi

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Sensible Micro Corp

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Whistler Technology

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Dan-Mar Components

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Holdelec - ElecDif-Pro

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Contempo Components LLC

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Connector Distribution Corp

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Right Parts Inc.

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Ampacity Inc.

Singapore . 20,321 parts In-Stock

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Semicontronic

India . 19,821 parts In-Stock

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Corohmni

South Africa . 264 parts In-Stock

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Corphita

USA . 2,217 parts In-Stock

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Advanced Electronics

New Zealand . 650 parts In-Stock

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Argo Parts USA

USA . 3,962 parts In-Stock

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Continental Prestige Electronics

USA . 1,814 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Microchip USA

USA . 433 parts In-Stock

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Aztec Data Supply Inc.

USA . 127 parts In-Stock

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Kepictronics

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Perfect Parts

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Metaverse IC Inc.

Canada . 81,710 parts In-Stock

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RC Electronics

USA . 57,261 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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CPlus Electronics

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Authorized Procurement Solutions

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Kulean Microsystems

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TANS Electronics

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iodParts Technologies Inc.

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SupplyDigital Components

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A-Z Elektronik GmbH

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Ashlea Components Ltd (Excess)

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Problanco Electronics

Mexico . 492 parts In-Stock

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UHIMA Technologies

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Overview

Elevate your electronic designs with the MC74VHC1G04DFT1G from Onsemi, a leading manufacturer known for top-notch quality and reliability. As a logic gate component, this product offers seamless integration and exceptional performance in various applications. Its compact size, low power consumption, and wide supply voltage range make it a versatile choice for any project. Experience the value of efficient signal processing and precise control with the MC74VHC1G04DFT1G, delivering unparalleled benefits to customers seeking cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V makes it compatible with a wide range of applications.

Propagation Delay (tpd): 14.5 ns

The low propagation delay of 14.5 ns ensures fast signal processing and response times.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates MC74VHC1G04DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74VHC1G04DFT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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