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NLVVHC1G04DFT1G

Onsemi

NLVVHC1G04DFT1G by Onsemi

NLVVHC1G04DFT1G by Onsemi is a CMOS Logic Gate with 5 terminals, operating at -55 to 125 °C. It has a Propagation Delay of 14.5 ns and Max I (ol) of 8 Amp, suitable for military applications due to AEC-Q100 screening level.

Median Price

$0.040

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,965 parts In-Stock

1+ parts

-

100+ parts

$0.041

1k+ parts

$0.034

10k+ parts

$0.030

33,965

-

$0.041

$0.034

$0.030

DigiKey

USA . 33,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.040

33,965

-

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-

$0.040

Verical

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.038

33,000

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-

-

$0.038

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 862 parts In-Stock

1+ parts

$0.032

100+ parts

-

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862

$0.032

-

-

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.101

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750

$0.101

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Vyrian

USA . 28,573 parts In-Stock

1+ parts

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28,573

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Bristol Electronics

USA . 4,684 parts In-Stock

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4,684

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R&J Components

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 28,818 parts In-Stock

1+ parts

$0.029

100+ parts

-

1k+ parts

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28,818

$0.029

-

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Semicontronic

India . 28,758 parts In-Stock

1+ parts

$0.029

100+ parts

$0.028

1k+ parts

$0.028

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-

28,758

$0.029

$0.028

$0.028

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Component Stockers USA

USA . 44,115 parts In-Stock

1+ parts

$0.030

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$0.030

1k+ parts

$0.030

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$0.030

44,115

$0.030

$0.030

$0.030

$0.030

Corphita

USA . 548 parts In-Stock

1+ parts

$0.031

100+ parts

-

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548

$0.031

-

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$0.034

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55

$0.034

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Continental Prestige Electronics

USA . 4,754 parts In-Stock

1+ parts

$0.101

100+ parts

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$0.099

4,754

$0.101

-

-

$0.099

Argo Parts USA

USA . 624 parts In-Stock

1+ parts

$0.101

100+ parts

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$0.098

624

$0.101

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$0.098

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$0.101

100+ parts

$0.096

1k+ parts

$0.091

10k+ parts

$0.090

40

$0.101

$0.096

$0.091

$0.090

Vigor

Singapore . 375 parts In-Stock

1+ parts

$0.130

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375

$0.130

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Aztec Data Supply Inc.

USA . 1,500 parts In-Stock

1+ parts

$19.470

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1,500

$19.470

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Perfect Parts

USA . 11,053 parts In-Stock

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11,053

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TANS Electronics

Latvia . 6,730 parts In-Stock

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6,730

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Kulean Microsystems

USA . 4,970 parts In-Stock

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4,970

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,828 parts In-Stock

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2,828

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UHIMA Technologies

Türkiye . 916 parts In-Stock

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916

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Problanco Electronics

Mexico . 768 parts In-Stock

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Overview

Enhance your electronics projects with the NLVVHC1G04DFT1G by Onsemi, a top-quality logic gate that promises reliable performance and precision. Manufactured by Onsemi, a trusted name in the industry, this logic gate is ideal for a wide range of applications. With its compact design and impressive specifications, this product offers unmatched value and benefits to customers. Upgrade your projects today with the NLVVHC1G04DFT1G and experience the advantages of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the components inside, ensuring a reliable performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard voltage level, making it compatible with various systems and applications.

Load Capacitance (CL): 50 pF

Capable of handling a moderate load capacitance, which is suitable for many circuit designs.

Propagation Delay (tpd): 14.5 ns

Offers fast signal processing speed, enabling quick response times in applications requiring real-time operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments or industrial applications.

Minimum Operating Temperature: -55 °C

Can operate in low temperatures, providing versatility for use in a variety of environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall efficiency and reliability.

Technical Specifications

Logic Gates NLVVHC1G04DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1G04DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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