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NLVVHC1G08DFT1G

Onsemi

NLVVHC1G08DFT1G by Onsemi

NLVVHC1G08DFT1G by Onsemi is a CMOS Logic Gate with 2 inputs, 11ns propagation delay at 5V. Operating in -55 to 125 °C, it has a max power supply current of 50mA and is AEC-Q100 screened for automotive applications.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,880 parts In-Stock

1+ parts

$0.240

100+ parts

$0.191

1k+ parts

$0.140

10k+ parts

-

3,880

$0.240

$0.191

$0.140

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DigiKey

USA . 55,076 parts In-Stock

1+ parts

-

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$0.150

55,076

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$0.150

Rochester

USA . 54,138 parts In-Stock

1+ parts

-

100+ parts

$0.178

1k+ parts

$0.147

10k+ parts

$0.132

54,138

-

$0.178

$0.147

$0.132

Verical

USA . 54,138 parts In-Stock

1+ parts

-

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$0.164

54,138

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$0.164

Chip1Stop

Japan . 345 parts In-Stock

1+ parts

-

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$0.214

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$0.213

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345

-

$0.214

$0.213

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Distributors (In-Stock)

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Digiode

USA . 348 parts In-Stock

1+ parts

$0.139

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348

$0.139

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Vyrian

USA . 1,477 parts In-Stock

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$0.146

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1,477

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ComSIT Distribution GmbH

Germany . 263,296 parts In-Stock

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263,296

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ComSIT USA

USA . 204,000 parts In-Stock

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204,000

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Flip Electronics

USA . 21,000 parts In-Stock

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21,000

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Sensible Micro Corp

USA . 2,309 parts In-Stock

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2,309

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Distributors (Availability)

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Corphita

USA . 1,119 parts In-Stock

1+ parts

$0.131

100+ parts

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1,119

$0.131

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Corohmni

South Africa . 100 parts In-Stock

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$0.146

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100

$0.146

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Component Stockers USA

USA . 54,806 parts In-Stock

1+ parts

$0.150

100+ parts

$0.140

1k+ parts

$0.130

10k+ parts

$0.130

54,806

$0.150

$0.140

$0.130

$0.130

Vigor

Singapore . 322 parts In-Stock

1+ parts

$0.490

100+ parts

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322

$0.490

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Microchip USA

USA . 4,883 parts In-Stock

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$1.121

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4,883

$1.121

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Perfect Parts

USA . 10,646 parts In-Stock

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10,646

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Kulean Microsystems

USA . 7,434 parts In-Stock

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7,434

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iodParts Technologies Inc.

India . 2,995 parts In-Stock

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2,995

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SupplyDigital Components

Austria . 2,805 parts In-Stock

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2,805

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UHIMA Technologies

Türkiye . 737 parts In-Stock

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737

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Problanco Electronics

Mexico . 450 parts In-Stock

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450

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TANS Electronics

Latvia . 26 parts In-Stock

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26

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Overview

Experience the innovation and reliability of Onsemi with the NLVVHC1G08DFT1G logic gate. Built with precision and quality, this product offers fast propagation delay, low power consumption, and versatile applications in various industries. Whether you're designing automotive systems or consumer electronics, this logic gate provides the performance and efficiency you need. Trust in Onsemi's expertise and unlock the potential of your projects with the NLVVHC1G08DFT1G. Elevate your designs with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components, ensuring reliability and longevity of the product.

Propagation Delay At Nominal Supply: 11 ns

The low propagation delay at nominal supply ensures fast response times and efficient operation of the logic gates, making them suitable for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic systems, making these logic gates compatible with a wide range of applications.

Technology: CMOS

The CMOS technology used in these logic gates offers low power consumption and high noise immunity, making them energy-efficient and reliable for various digital applications.

Technical Specifications

Logic Gates NLVVHC1G08DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

NLVVHC1G08DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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