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SN74AHC1G04DBVRE4

Texas Instruments

SN74AHC1G04DBVRE4 by Texas Instruments

SN74AHC1G04DBVRE4 by Texas Instruments is a CMOS logic gate with 8.5 ns propagation delay at 3.3V, suitable for automotive applications. It has a load capacitance of 50 pF and operates within a temperature range of -40 to 125 °C, making it ideal for compact electronic designs requiring fast signal processing.

Median Price

$0.560

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,866 parts In-Stock

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$0.560

100+ parts

$0.299

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$0.254

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$0.198

2,866

$0.560

$0.299

$0.254

$0.198

Distributors (In-Stock)

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Digiode

USA . 3,688 parts In-Stock

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$0.408

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3,688

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Vyrian

USA . 4,732 parts In-Stock

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Speed Components Ltd

Israel . 3,818 parts In-Stock

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QIE Inc.

USA . 1,884 parts In-Stock

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Nova Conductors

Japan . 52 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 161 parts In-Stock

1+ parts

$0.387

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161

$0.387

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Ampacity Inc.

Singapore . 4,338 parts In-Stock

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$0.790

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4,338

$0.790

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Semicontronic

India . 4,258 parts In-Stock

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$0.790

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$0.770

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$0.766

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4,258

$0.790

$0.770

$0.766

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Corohmni

South Africa . 994 parts In-Stock

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$16.934

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994

$16.934

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Advanced Electronics

New Zealand . 84 parts In-Stock

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$21.115

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$21.115

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84

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Parana Technologies

USA . 1,298 parts In-Stock

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$25.616

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$26.227

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DigiPath Technology Company

USA . 1,759 parts In-Stock

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$28.206

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$25.950

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$28.206

$25.950

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ChromeModa Solutions

Germany . 4,649 parts In-Stock

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$28.782

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$23.601

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IDEA Electronic Components Group

UK . 406 parts In-Stock

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$27.343

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$25.904

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406

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Continental Prestige Electronics

USA . 6,903 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Microchip USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the superior quality and reliability of Texas Instruments with the SN74AHC1G04DBVRE4 Logic Gate. This small yet powerful component is perfect for a wide range of applications, offering fast propagation delay and low power consumption. With a package style that is both compact and durable, this logic gate is designed to provide optimal performance in automotive environments. Trust Texas Instruments to deliver cutting-edge technology that meets your needs for efficiency and precision. Elevate your projects with the SN74AHC1G04DBVRE4 Logic Gate today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures longevity and reliability.

Propagation Delay At Nominal Supply: 8.5 ns

With a fast propagation delay, this product is ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for space-efficient utilization on PCBs.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3V makes this product energy-efficient.

Load Capacitance (CL): 50 pF

The moderate load capacitance enables stable performance in various circuit configurations.

Power Supplies (V): 2/5.5

Compatibility with power supplies ranging from 2V to 5.5V offers versatility in different setups.

No. of Terminals: 5

The compact design with 5 terminals allows for simplified system integration.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design with shrink pitch make this product suitable for space-constrained applications.

Maximum I (ol): 8 Amp

With a high maximum output current of 8A, this product can handle demanding loads.

Propagation Delay (tpd): 12 ns

The short propagation delay of 12ns ensures rapid signal processing.

Maximum Operating Temperature: 125 °C

The wide operating temperature range of up to 125°C makes this product suitable for various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable performance in cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout and connection options.

Maximum Seated Height: 1.45 mm

The low maximum seated height allows for compact placement within electronic devices.

Width: 1.6 mm

The slim width of 1.6mm contributes to the overall space-saving design of the product.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V enables operation in energy-sensitive applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly.

Length: 2.9 mm

The length of 2.9mm provides a balanced form factor for easy integration into circuits.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive electronics.

Technology: CMOS

The use of CMOS technology offers high speed, low power consumption, and compatibility with a range of devices.

Terminal Form: GULL WING

The gull-wing terminal form allows for secure and reliable solder connections.

Packing Method: TR

The tape and reel packing method facilitates automated assembly processes.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm enables high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current of 0.01mA results in minimal power consumption in operation.

Technical Specifications

Logic Gates SN74AHC1G04DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G04DBVRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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