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SN74HC132DRE4

Texas Instruments

SN74HC132DRE4 by Texas Instruments

SN74HC132DRE4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 31 ns at 5V, making it suitable for industrial applications requiring fast response times. With a small outline package style and Schmitt trigger technology, it is ideal for surface mount designs in temperature-sensitive environments.

Median Price

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4

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1k+

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Chip Stock

USA . 72,720 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Parana Technologies

USA . 1,401 parts In-Stock

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$10.473

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$10.986

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$10.473

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$10.986

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ChromeModa Solutions

Germany . 5,885 parts In-Stock

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$11.767

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$9.649

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$11.767

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IDEA Electronic Components Group

UK . 725 parts In-Stock

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$11.767

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$11.179

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$10.590

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725

$11.767

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$10.590

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AZTECH Wire

Italy . 231 parts In-Stock

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$15.311

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Ampacity Inc.

Singapore . 522 parts In-Stock

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$18.000

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Corohmni

South Africa . 659 parts In-Stock

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Semicontronic

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$23.400

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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One Stop Electronics

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Microchip USA

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Corphita

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Argo Parts USA

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Perfect Parts

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DigiPath Technology Company

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Overview

Enhance the efficiency and reliability of your electronic circuits with the SN74HC132DRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and performance in their products. This logic gate is perfect for a variety of applications, offering fast propagation delay and low power consumption. With 4 functions and 2 inputs, this small outline package is ideal for industrial use. Trust Texas Instruments to provide you with cutting-edge technology that delivers outstanding results every time. Elevate your projects with the SN74HC132DRE4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and cost-effective.

Propagation Delay At Nominal Supply: 31 ns

With a fast propagation delay, this logic gate ensures efficient signal processing.

Surface Mount: YES

Being surface mountable ensures easy installation and space-saving design.

No. of Functions: 4

This logic gate offers versatility by providing multiple functions in one component.

No. of Inputs: 2

With 2 inputs, this logic gate is suitable for basic logic operations.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various circuit designs.

Nominal Supply Voltage / Vsup: 5V

The 5V supply voltage ensures compatibility with standard operating conditions.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can handle various loads efficiently.

Power Supplies: 2/6V

Compatibility with both 2V and 6V power supplies offers flexibility in different applications.

No. of Terminals: 14

The 14 terminals provide ample connectivity options for complex circuit configurations.

Package Style: SMALL OUTLINE

The small outline package style saves space and allows for compact circuit designs.

Maximum I (ol): 5.2 Amp

With a maximum output current of 5.2 Amp, this logic gate can drive high-power loads.

Propagation Delay (tpd): 156 ns

The propagation delay of 156 ns ensures fast signal processing for time-sensitive applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this logic gate is suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows for reliable performance in cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for versatile PCB mounting options.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm saves space on the PCB.

Width: 3.9 mm

The 3.9 mm width allows for compact placement on the circuit board.

Minimum Supply Voltage: 2V

The minimum supply voltage of 2V ensures compatibility with low-power applications.

Maximum Time At Peak Reflow Temperature: 30s

With a maximum reflow time of 30 seconds, this logic gate can withstand high-temperature soldering processes.

Peak Reflow Temperature: 260 °C

The peak reflow temperature of 260°C ensures reliable soldering of the component.

Length: 8.65 mm

The 8.65 mm length accommodates the necessary circuit connections in a compact space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this logic gate suitable for harsh operating conditions.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger improves noise immunity and signal stability.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form provides secure PCB mounting and excellent mechanical stability.

Packing Method: TR

The TR packing method ensures convenient handling and storage of the component.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy soldering and connection to the PCB.

Maximum Supply Voltage: 6V

With a maximum supply voltage of 6V, this logic gate can handle higher voltage applications.

Maximum Power Supply Current (ICC): 0.02 mA

The low power supply current of 0.02 mA ensures energy efficiency and minimal power consumption.

Technical Specifications

Logic Gates SN74HC132DRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

156 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC132DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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