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NLVVHC1G08DFT2G

Onsemi

NLVVHC1G08DFT2G by Onsemi

NLVVHC1G08DFT2G by Onsemi is a CMOS Logic Gate with 2 inputs, 11 ns propagation delay at 5V. It operates in the temperature range of -55 to 125°C and has a max power supply current of 50mA. Ideal for applications requiring high-speed signal processing in automotive electronics due to AEC-Q100 screening level.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 97,000 parts In-Stock

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$0.210

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$0.210

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$0.200

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97,000

$0.210

$0.210

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EBV Elektronik

Germany . 24,000 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$0.178

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50

$0.178

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Digiode

USA . 1,217 parts In-Stock

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$0.200

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1,217

$0.200

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Component Electronics Inc.

Canada . 1,371 parts In-Stock

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$0.380

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$0.290

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$0.250

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1,371

$0.380

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Flip Electronics

USA . 5,150,876 parts In-Stock

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Vyrian

USA . 6,692 parts In-Stock

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6,692

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Bristol Electronics

USA . 3,030 parts In-Stock

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J2 Sourcing AB

Sweden . 2,342 parts In-Stock

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2,342

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 96,915 parts In-Stock

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$0.178

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$0.178

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Argo Parts USA

USA . 4,928 parts In-Stock

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$0.178

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$0.173

4,928

$0.178

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$0.173

Netroflash

USA . 2,000 parts In-Stock

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$0.178

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-

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$0.169

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$0.166

2,000

$0.178

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$0.169

$0.166

Corphita

USA . 2,181 parts In-Stock

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$0.189

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$0.189

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Corohmni

South Africa . 475 parts In-Stock

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$0.192

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475

$0.192

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Component Stockers USA

USA . 6,439 parts In-Stock

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$0.340

100+ parts

$0.130

1k+ parts

$0.070

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6,439

$0.340

$0.130

$0.070

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Continental Prestige Electronics

USA . 31,655 parts In-Stock

1+ parts

$0.365

100+ parts

$0.182

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$0.113

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31,655

$0.365

$0.182

$0.113

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Semicontronic

India . 60,199 parts In-Stock

1+ parts

$0.389

100+ parts

$0.379

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$0.377

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60,199

$0.389

$0.379

$0.377

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Vigor

Singapore . 876 parts In-Stock

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$0.460

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876

$0.460

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Microchip USA

USA . 3,515 parts In-Stock

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$3.185

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AZTECH Wire

Italy . 185 parts In-Stock

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$8.810

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$8.810

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Aztec Data Supply Inc.

USA . 4,912 parts In-Stock

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$24.860

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Lixinc

USA . 16,380 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,826 parts In-Stock

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TANS Electronics

Latvia . 6,429 parts In-Stock

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Problanco Electronics

Mexico . 3,786 parts In-Stock

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 2,153 parts In-Stock

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UHIMA Technologies

Türkiye . 657 parts In-Stock

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657

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Overview

Experience the superior quality and reliability of Onsemi with the NLVVHC1G08DFT2G Logic Gate. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology that exceeds expectations. This versatile component is ideal for a variety of applications, offering fast propagation delay and a wide operating temperature range. With its compact design and efficient performance, this Logic Gate provides customers with exceptional value and benefits, making it the perfect choice for your next project. Trust Onsemi to deliver innovative solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, making it suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

The low propagation delay ensures fast signal processing, making this logic gate efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easier and more compact PCB design, saving space and simplifying manufacturing processes.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations, allowing for a wider range of functions to be performed.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration into existing systems straightforward and convenient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate can withstand elevated temperatures, improving reliability in harsh environments.

Technology: CMOS

The CMOS technology used in this logic gate offers low power consumption and high noise immunity, making it suitable for battery-operated devices and noise-sensitive applications.

Technical Specifications

Logic Gates NLVVHC1G08DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

NLVVHC1G08DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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