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74LVC1G04GW-G

NXP Semiconductors

74LVC1G04GW-G by NXP Semiconductors

NXP Semiconductors' 74LVC1G04GW-G is a logic gate with 5.5ns propagation delay at 3.3V, suitable for automotive applications. It has a load capacitance of 50pF and can operate b/w -40 to 125°C, making it ideal for compact designs requiring fast signal processing.

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PC Components Company LLC

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Overview

Unlock the power of advanced logic gates with the NXP Semiconductors 74LVC1G04GW-G. Manufactured with precision and expertise, this high-quality product offers fast propagation delays and low power consumption, making it perfect for a wide range of applications. From automotive to industrial use, this logic gate provides reliable performance and efficiency. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs. Elevate your projects with the 74LVC1G04GW-G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 5.5 ns

With a low propagation delay, this logic gate ensures quick signal processing and high-speed operation.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the circuit board.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

Designed to operate at 3.3V, this logic gate is compatible with a wide range of systems and devices.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures minimal interference and optimal performance in signal transmission.

Power Supplies (V): 3.3

This logic gate operates efficiently at 3.3V, making it suitable for various power supply configurations.

No. of Terminals: 5

With 5 terminals, this logic gate offers versatility and flexibility in connection options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product compact and space-efficient.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this logic gate can handle high power loads effectively.

Propagation Delay (tpd): 9.5 ns

The propagation delay of 9.5 ns ensures fast and accurate signal processing, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

Able to withstand temperatures up to 125°C, this logic gate is suitable for high-temperature environments.

Minimum Operating Temperature: -40 °C

Operating reliably even at -40°C, this logic gate is ideal for use in extreme temperature conditions.

Terminal Finish: TIN

The tin terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

With dual terminal positions, this logic gate offers flexibility in circuit board layout and connectivity.

Maximum Seated Height: 1.1 mm

The maximum seated height of 1.1 mm allows for easy integration into compact electronic devices.

Width: 1.25 mm

The width of 1.25 mm makes this logic gate suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.65 V

With a minimum supply voltage of 1.65V, this logic gate can operate efficiently even at low power levels.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures safe and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate can withstand high-temperature soldering processes.

Length: 2.05 mm

The length of 2.05 mm allows for easy placement and alignment on the circuit board.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this logic gate meets stringent temperature and performance requirements.

Technology: CMOS

Built using CMOS technology, this logic gate offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connectivity and ease of soldering during installation.

Packing Method: TR

The TR packing method ensures safe and convenient handling and storage of this logic gate.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate allows for precise and compact connections on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of operating at a maximum supply voltage of 5.5V, this logic gate is versatile and compatible with various power sources.

Technical Specifications

Logic Gates 74LVC1G04GW-G attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G04GW-G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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