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SN74LV1T08DCKRG4

Texas Instruments

SN74LV1T08DCKRG4 by Texas Instruments

SN74LV1T08DCKRG4 by Texas Instruments is a CMOS logic gate with 2 inputs, operating at a supply voltage range of 1.6V to 5.5V. It has a propagation delay of 13ns and can handle a max output current of 8A. This small outline package is ideal for automotive applications due to its wide temperature range and compact design.

Median Price

$0.428

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 12,681 parts In-Stock

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$0.650

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$0.349

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$0.296

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$0.273

12,681

$0.650

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$0.273

Arrow

USA . 6,000 parts In-Stock

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$0.219

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$0.219

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.333

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$0.282

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$0.256

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$0.333

$0.282

$0.256

Verical

USA . 3,000 parts In-Stock

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-

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$0.524

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$0.358

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$0.259

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$0.524

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$0.259

Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

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$0.289

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Chip Stock

USA . 104,040 parts In-Stock

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Semtec, LLC

USA . 8,981 parts In-Stock

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Vyrian

USA . 4,582 parts In-Stock

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Digiode

USA . 3,607 parts In-Stock

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Classic Components Corporation

USA . 3,000 parts In-Stock

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Semicontronic

India . 4,073 parts In-Stock

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$0.144

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$0.140

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$0.140

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Ampacity Inc.

Singapore . 3,678 parts In-Stock

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$0.144

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Continental Prestige Electronics

USA . 3,936 parts In-Stock

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$0.289

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$0.283

3,936

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Netroflash

USA . 2,000 parts In-Stock

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$0.289

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Argo Parts USA

USA . 898 parts In-Stock

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Parana Technologies

USA . 132 parts In-Stock

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$17.421

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$17.624

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ChromeModa Solutions

Germany . 2,131 parts In-Stock

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$19.574

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$16.051

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IDEA Electronic Components Group

UK . 348 parts In-Stock

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$19.574

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$18.595

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Corohmni

South Africa . 255 parts In-Stock

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$24.076

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$25.705

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Technoshack Inc. (Excess)

Canada . 10,160 parts In-Stock

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Lixinc

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Corphita

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Microchip USA

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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Futuretech Components

Singapore . 901 parts In-Stock

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Lucentia Tech

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$12.941

Overview

Experience seamless functionality and reliability with the SN74LV1T08DCKRG4 logic gate by Texas Instruments. Known for their top-notch quality and innovative design, Texas Instruments offers cutting-edge solutions for a wide range of applications. This logic gate, with its small outline and thin profile package, provides fast propagation delays and low power consumption, making it ideal for automotive electronics and other high-performance systems. Trust in Texas Instruments to deliver exceptional value and performance with the SN74LV1T08DCKRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environmental conditions.

No. of Inputs: 2

Allows for simple logic operations, making it versatile for basic circuit designs.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption and compatible with a wide range of devices that operate at 1.8V.

Propagation Delay (tpd): 13 ns

Fast signal propagation for efficient circuit operation in time-sensitive applications.

Maximum Operating Temperature: 125 °C

Designed to withstand high temperatures, making it suitable for automotive and industrial applications.

Technical Specifications

Logic Gates SN74LV1T08DCKRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay (tpd):

13 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LV1T08DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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