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SN74LVC1G17QDBVRQ1

Texas Instruments

SN74LVC1G17QDBVRQ1 by Texas Instruments

SN74LVC1G17QDBVRQ1 by Texas Instruments is a CMOS logic gate with 3-STATE output, 8 ns propagation delay at 3.3V, and Schmitt Trigger feature. Designed for automotive applications, it operates b/w -40 to 125 °C with a load capacitance of 50 pF.

Median Price

$0.201

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 260,573 parts In-Stock

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$0.201

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$0.137

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$0.070

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260,573

$0.201

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Arrow

USA . 2,450 parts In-Stock

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$0.289

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$0.152

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$0.108

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2,450

$0.289

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Mouser Electronics

USA . 33,459 parts In-Stock

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$0.300

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$0.158

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$0.139

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33,459

$0.300

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$0.139

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Verical

USA . 2,450 parts In-Stock

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$0.152

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$0.108

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2,450

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$0.152

$0.108

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Chip1Stop

Japan . 1,156 parts In-Stock

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$0.102

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$0.098

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1,156

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$0.102

$0.098

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Distributors (In-Stock)

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Digiode

USA . 4,037 parts In-Stock

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$0.102

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Nova Conductors

Japan . 100 parts In-Stock

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$0.159

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100

$0.159

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Component Electronics Inc.

Canada . 3,362 parts In-Stock

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$0.310

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$0.230

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$0.200

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3,362

$0.310

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Maritex

Poland . 5 parts In-Stock

1+ parts

$0.397

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$0.202

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$0.164

5

$0.397

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$0.164

Vyrian

USA . 60,706 parts In-Stock

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Chip Stock

USA . 39,500 parts In-Stock

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Semtec, LLC

USA . 32,512 parts In-Stock

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Sensible Micro Corp

USA . 11,162 parts In-Stock

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Connector Distribution Corp

USA . 3,140 parts In-Stock

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Right Parts Inc.

USA . 3,140 parts In-Stock

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ABC Electronics Ltd.

UK . 2,930 parts In-Stock

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Rebound Electronics

UK . 2,853 parts In-Stock

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Bristol Electronics

USA . 2,593 parts In-Stock

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Cyclops Electronics Ltd

UK . 870 parts In-Stock

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Atlantic Semiconductor

USA . 360 parts In-Stock

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Prism Electronics

USA . 57 parts In-Stock

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NexGen Digital

USA . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 60,546 parts In-Stock

1+ parts

$0.087

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60,546

$0.087

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Corphita

USA . 2,647 parts In-Stock

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$0.096

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Argo Parts USA

USA . 3,679 parts In-Stock

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$0.158

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$0.154

3,679

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Continental Prestige Electronics

USA . 2,692 parts In-Stock

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$0.158

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$0.155

2,692

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Modulus Dynamics

Lithuania . 43 parts In-Stock

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$0.176

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$0.174

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$0.169

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43

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Semicontronic

India . 60,843 parts In-Stock

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Parana Technologies

USA . 1,391 parts In-Stock

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$10.898

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$11.370

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DigiPath Technology Company

USA . 2,377 parts In-Stock

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

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$12.245

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$11.633

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$11.020

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2,033

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ChromeModa Solutions

Germany . 237 parts In-Stock

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$12.245

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$10.041

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$16.069

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$15.266

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$16.069

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Corohmni

South Africa . 428 parts In-Stock

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$18.243

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428

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Lixinc

USA . 7,329 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Robosynatics

Brazil . 3,000 parts In-Stock

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Lucentia Tech

USA . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,715 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,428 parts In-Stock

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Overview

Elevate your electronic designs with the SN74LVC1G17QDBVRQ1 by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge technology. As a logic gate device, this product boasts a fast propagation delay, 3-STATE output characteristics, and automotive-grade temperature tolerance, making it ideal for a wide range of applications. With its small outline and low profile package style, along with shrink pitch design, this component offers exceptional performance in a compact form factor. Trust Texas Instruments to provide quality components that deliver value, efficiency, and reliability to meet your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 8 ns

With a low propagation delay, this logic gate ensures fast response times, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient use of space on the PCB, allowing for compact designs and efficient layout.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of systems and saving the need for additional voltage conversion circuitry.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this logic gate can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gate energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates SN74LVC1G17QDBVRQ1 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G17QDBVRQ1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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