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74HC00DB,118

NXP Semiconductors

74HC00DB,118 by NXP Semiconductors

NXP Semiconductors' 74HC00DB,118 is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 2-6V, with a propagation delay of 27ns. Ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

$0.327

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Adafruit Industries

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Farnell

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Rochester

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$0.459

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$0.381

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$0.340

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Verical

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$0.476

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Chip1Stop

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Digiode

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Nova Conductors

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Chip Stock

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Vyrian

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Anansix

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VNN

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Semicontronic

India . 46,739 parts In-Stock

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Ampacity Inc.

Singapore . 46,734 parts In-Stock

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Corphita

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Component Stockers USA

USA . 128,876 parts In-Stock

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$0.170

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128,876

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$0.160

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$0.140

Argo Parts USA

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Netroflash

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$0.180

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$0.176

Corohmni

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AZTECH Wire

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Advanced Electronics

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Microchip USA

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$1.040

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Perfect Parts

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GreenTree Electronics

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Supply Digital

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Overview

Unlock the power of seamless logic gates with the 74HC00DB,118 by NXP Semiconductors. Known for their top-quality manufacturing, NXP Semiconductors delivers unmatched reliability and performance in every product. Ideal for a wide range of applications, this logic gate offers fast propagation delay and low power consumption. With a compact design and high-speed operation, the 74HC00DB,118 provides exceptional value and efficiency to customers looking for superior electronic components. Elevate your projects with this versatile and reliable logic gate today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gate, making it a reliable choice.

Propagation Delay At Nominal Supply: 27 ns

With a fast propagation delay, this logic gate ensures efficient signal processing, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

This logic gate offers multiple functions in a single component, reducing the need for additional components and simplifying circuit design.

No. of Inputs: 2

With two input channels, this logic gate can process multiple signals simultaneously, increasing its versatility in various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, optimizing space on the circuit board.

Nominal Supply Voltage: 5V

Operating at a standard voltage of 5V, this logic gate is compatible with a wide range of electronic devices.

Load Capacitance: 50 pF

The load capacitance value ensures stable performance and signal integrity, making this logic gate suitable for sensitive applications.

Power Supplies: 2/6V

This logic gate can be powered by multiple supply voltages, offering flexibility in system design and compatibility with various power sources.

No. of Terminals: 14

The 14 terminals provide ample connectivity options, allowing for easy integration into complex circuits.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design of the package save space on the circuit board and improve overall system efficiency.

Maximum I (ol): 4 Amp

With a high maximum output current, this logic gate can drive demanding loads, making it suitable for power-intensive applications.

Propagation Delay (tpd): 135 ns

The propagation delay of 135 ns ensures fast signal processing, making this logic gate ideal for time-critical applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this logic gate is suitable for harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate can withstand extreme cold temperatures, making it suitable for outdoor use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides corrosion resistance and ensures reliable electrical connections, enhancing the longevity of the logic gate.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, providing ease of installation in various orientations.

Maximum Seated Height: 2 mm

The low maximum seated height of 2 mm enables compact PCB design, optimizing space constraints in electronic systems.

Width: 5.3 mm

The width of 5.3 mm allows for a slim profile, making this logic gate suitable for applications with limited space.

Minimum Supply Voltage: 2V

Operating at a minimum supply voltage of 2V, this logic gate can function in low-power scenarios, conserving energy.

Maximum Time At Peak Reflow Temperature: 30s

With a maximum reflow time of 30 seconds, this logic gate offers robust soldering properties, ensuring secure attachment during assembly.

Peak Reflow Temperature: 260C

The peak reflow temperature of 260°C enables reliable soldering, improving the overall durability of the logic gate.

Length: 6.2 mm

The length of 6.2 mm offers a compact footprint, allowing for efficient use of space on the circuit board.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this logic gate meets industry standards for reliability and performance in harsh operating conditions.

Technology: CMOS

Using CMOS technology, this logic gate offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment and easy soldering, ensuring a reliable connection in electronic circuits.

Packing Method: TR

The Tape and Reel (TR) packing method facilitates automated assembly processes, improving efficiency and reducing production costs.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate offers precise and secure connections, enhancing signal integrity in the circuit.

Moisture Sensitivity Level: 1

With a low moisture sensitivity level of 1, this logic gate can withstand humid environments, ensuring long-term reliability.

Maximum Supply Voltage: 6V

Operating at a maximum supply voltage of 6V, this logic gate can handle higher voltage inputs, making it suitable for a wide range of applications.

Technical Specifications

Logic Gates 74HC00DB,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74HC00DB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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