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SN74AHC1G14DBVRG4

Texas Instruments

SN74AHC1G14DBVRG4 by Texas Instruments

SN74AHC1G14DBVRG4 by Texas Instruments is a logic gate with 1 input and 1 function. It has a propagation delay of 12 ns and operates at a nominal voltage of 3.3V. This device is commonly used in automotive applications due to its small size and low power consumption.

Median Price

$0.346

Lifecycle Status

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10

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1k+

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Texas Instruments

USA . 350,158 parts In-Stock

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$0.232

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Mouser Electronics

USA . 4,654 parts In-Stock

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$0.460

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$0.249

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$0.209

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$0.192

4,654

$0.460

$0.249

$0.209

$0.192

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Nova Conductors

Japan . 500 parts In-Stock

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$0.155

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$0.155

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Digiode

USA . 807 parts In-Stock

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$0.220

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807

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Vyrian

USA . 117,890 parts In-Stock

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Chip Stock

USA . 69,800 parts In-Stock

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QIE Inc.

USA . 2,722 parts In-Stock

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Bristol Electronics

USA . 2,326 parts In-Stock

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Semi Source

USA . 1,983 parts In-Stock

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SPM Sales

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Continental Prestige Electronics

USA . 2,819 parts In-Stock

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$0.146

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$0.143

2,819

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Argo Parts USA

USA . 2,409 parts In-Stock

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Corohmni

South Africa . 568 parts In-Stock

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568

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$0.150

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$0.143

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Netroflash

USA . 500 parts In-Stock

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$0.155

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$0.147

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$0.144

Modulus Dynamics

Lithuania . 15 parts In-Stock

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$0.162

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$0.160

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$0.155

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15

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Ampacity Inc.

Singapore . 118,113 parts In-Stock

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$0.197

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Semicontronic

India . 118,077 parts In-Stock

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$0.197

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$0.192

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$0.191

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Corphita

USA . 1,790 parts In-Stock

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$0.209

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Parana Technologies

USA . 1,740 parts In-Stock

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$10.118

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$939.648

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$9.107

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DigiPath Technology Company

USA . 1,373 parts In-Stock

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$11.142

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IDEA Electronic Components Group

UK . 2,359 parts In-Stock

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$11.369

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$10.801

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$10.232

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2,359

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ChromeModa Solutions

Germany . 1,631 parts In-Stock

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$11.369

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$9.323

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Perfect Parts

USA . 14,496 parts In-Stock

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Microchip USA

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Robosynatics

Brazil . 1,311 parts In-Stock

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Lucentia Tech

USA . 1,311 parts In-Stock

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Overview

Discover the SN74AHC1G14DBVRG4 by Texas Instruments, a high-quality logic gate that guarantees top-notch performance. Texas Instruments, a renowned manufacturer in the industry, offers reliability and excellence in every product. Logic gates play a crucial role in various applications, and this particular model stands out with its compact design and exceptional functionality. With a nominal supply voltage of 3.3V and a propagation delay of 12ns, it delivers fast and efficient results. Its small outline, low profile package shape enhances versatility, making it suitable for automotive use as well. Experience the value and benefits this product brings, from its 3-STATE output characteristics to its Schmitt Trigger technology. Trust Texas Instruments for your logic gate needs and unlock a new level of performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers durability and protection for the logic gate, making it suitable for various applications.

Propagation Delay At Nominal Supply: 12 ns

With a low propagation delay, this logic gate can perform fast switching operations, ensuring efficient data processing.

Surface Mount: YES

Being surface mountable, this logic gate can be easily integrated into circuit boards, saving space and simplifying assembly.

No. of Functions: 1

This logic gate provides a single function, making it ideal for straightforward logic operations in electronic circuits.

No. of Inputs: 1

With one input, this logic gate is perfect for applications requiring simple logic operations.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard circuit board designs, enabling easy integration into various systems.

Nominal Supply Voltage / Vsup (V): 3.3

The logic gate operates efficiently at a nominal supply voltage of 3.3V, providing reliable performance in compatible electronic devices.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can effectively drive connected devices without compromising signal integrity.

Power Supplies (V): 2/5.5

This logic gate operates within a wide power supply range, allowing versatility and compatibility across different systems.

No. of Terminals: 5

With five terminals, this logic gate offers multiple connection options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style ensures space-efficient integration and compatibility with modern electronic systems.

Maximum I (ol): 8 Amp

This logic gate can handle a maximum output current of 8 Amps, making it suitable for driving larger loads or power-hungry devices.

Propagation Delay (tpd): 18.5 ns

Despite a slightly longer propagation delay, this logic gate still provides reliable and efficient switching operations for most applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this logic gate can withstand high-temperature environments, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the logic gate to have three different output states, providing flexibility in controlling bus lines or multiplexing applications.

Minimum Operating Temperature: -40 °C

This logic gate can operate in extremely low-temperature conditions, enabling its use in various environments and applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish with nickel, palladium, and gold ensures good conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Equipped with dual terminal positions, this logic gate offers flexibility in circuit board layout and connectivity options.

Maximum Seated Height: 1.45 mm

The compact maximum seated height of 1.45 mm allows for space-saving integration in compact electronic devices.

Width: 1.6 mm

With a narrow width of 1.6 mm, this logic gate can fit into tight spaces, making it suitable for miniaturized electronic designs.

Minimum Supply Voltage (Vsup): 2 V

This logic gate can operate at a minimum supply voltage of 2V, ensuring compatibility with low-power applications and energy-efficient systems.

Peak Reflow Temperature °C: 260

The logic gate can withstand peak reflow temperatures of up to 260°C, suitable for various soldering processes and ensuring reliable connections.

Length: 2.9 mm

The logic gate's compact length of 2.9 mm allows for seamless integration into space-constrained electronic circuits.

Temperature Grade: AUTOMOTIVE

Designed with an automotive temperature grade, this logic gate can withstand harsh operating conditions, making it ideal for automotive applications.

Schmitt Trigger: YES

With a built-in Schmitt trigger, this logic gate provides hysteresis and noise immunity, ensuring reliable operation in environments with signal variation or interference.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable electrical connections, ensuring a robust and efficient integration process.

Packing Method: TR

The TR packing method ensures safe and organized shipping, protecting the logic gates during transportation and storage.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95 mm, this logic gate enables precise and reliable connections, reducing the chances of short circuits or signal interference.

Moisture Sensitivity Level (MSL): 1

This logic gate has a moisture sensitivity level of 1, indicating that it has unlimited floor life and is suitable for both leaded and leadless reflow soldering processes.

Maximum Supply Voltage (Vsup): 5.5 V

This logic gate can handle a maximum supply voltage of 5.5V, providing compatibility with various power supply systems.

Maximum Power Supply Current (ICC): 0.01 mA

With a maximum power supply current of 0.01 mA, this logic gate offers energy-efficient operation, reducing power consumption in electronic devices.

Technical Specifications

Logic Gates SN74AHC1G14DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G14DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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