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HEF40106BTT,112

NXP Semiconductors

HEF40106BTT,112 by NXP Semiconductors

HEF40106BTT,112 by NXP Semiconductors is a CMOS logic gate with 6 functions. It operates at a supply voltage of 5V and has a propagation delay of 180ns. This Schmitt Trigger IC is ideal for automotive applications due to its wide temperature range and small form factor.

Median Price

$0.191

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 51,360 parts In-Stock

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$0.216

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$0.179

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$0.160

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$0.160

Verical

USA . 49,728 parts In-Stock

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$0.188

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$0.188

Arrow

USA . 39 parts In-Stock

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$0.147

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$0.141

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39

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$0.141

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Chip1Stop

Japan . 39 parts In-Stock

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$0.194

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$0.194

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Digiode

USA . 643 parts In-Stock

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$0.168

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Nova Conductors

Japan . 150 parts In-Stock

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Chip Stock

USA . 162,000 parts In-Stock

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DigiKey Marketplace

USA . 8,188 parts In-Stock

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$0.180

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Vyrian

USA . 3,124 parts In-Stock

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Anansix

USA . 2,726 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 21,792 parts In-Stock

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$0.125

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$0.122

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$0.121

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21,792

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Corphita

USA . 2,107 parts In-Stock

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$0.159

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Continental Prestige Electronics

USA . 3,338 parts In-Stock

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$0.167

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$0.164

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Argo Parts USA

USA . 1,820 parts In-Stock

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$0.167

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$0.162

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$0.162

Netroflash

USA . 100 parts In-Stock

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$0.180

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AZTECH Wire

Italy . 3,171 parts In-Stock

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Modulus Dynamics

Lithuania . 450 parts In-Stock

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$0.199

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$0.197

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$0.191

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Ampacity Inc.

Singapore . 21,566 parts In-Stock

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$0.272

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$0.272

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$9.239

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$8.777

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$8.777

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$9.239

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$8.777

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Aztec Data Supply Inc.

USA . 1,630 parts In-Stock

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$24.590

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Corohmni

South Africa . 591 parts In-Stock

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$28.418

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Perfect Parts

USA . 59,875 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

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Supply Digital

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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$0.519

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Microchip USA

USA . 282 parts In-Stock

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Overview

Looking for top-notch logic gates for your next project? Look no further than the HEF40106BTT,112 by NXP Semiconductors. With a reputation for excellence in semiconductor manufacturing, NXP delivers reliability and quality you can trust. This versatile product offers 6 functions in a compact package, making it ideal for a wide range of applications. From automotive to industrial settings, this logic gate provides fast propagation delay and a wide operating temperature range, ensuring optimal performance in any environment. Upgrade your projects with the HEF40106BTT,112 and experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 180 ns

The low propagation delay allows for fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology makes installation and assembly easier, saving time and effort in the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V allows for compatibility with a wide range of systems and devices.

No. of Terminals: 14

The high number of terminals enables versatile connectivity options for various circuit configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the logic gates can function reliably in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates HEF40106BTT,112 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

180 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

HEF40106BTT,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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