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SN74LVC1G08DCKJ

Texas Instruments

SN74LVC1G08DCKJ by Texas Instruments

SN74LVC1G08DCKJ by Texas Instruments is a logic gate with 2 inputs, 4.5 ns propagation delay at 3.3V supply, and 50 pF load capacitance. It is used in industrial applications, operates b/w -40 to 85°C, and has a small outline package with dual terminal position for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 939,670 parts In-Stock

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Vyrian

USA . 6,699 parts In-Stock

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Digiode

USA . 4,284 parts In-Stock

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Nova Conductors

Japan . 67 parts In-Stock

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Ampacity Inc.

Singapore . 883 parts In-Stock

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$3.000

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883

$3.000

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Corohmni

South Africa . 630 parts In-Stock

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$12.560

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630

$12.560

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AZTECH Wire

Italy . 605 parts In-Stock

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$14.280

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Parana Technologies

USA . 331 parts In-Stock

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$24.170

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$24.824

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$24.170

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$24.831

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$23.590

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$23.590

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$24.831

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DigiPath Technology Company

USA . 1,710 parts In-Stock

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$26.614

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$24.485

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ChromeModa Solutions

Germany . 4,849 parts In-Stock

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$27.157

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$22.269

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IDEA Electronic Components Group

UK . 253 parts In-Stock

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$25.799

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$24.441

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Semicontronic

India . 170 parts In-Stock

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$32.000

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$31.200

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$31.040

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One Stop Electronics

USA . 655 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Microchip USA

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Bastille Electronics

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Overview

Elevate your projects with the superior quality and reliability of the SN74LVC1G08DCKJ by Texas Instruments. As a leader in the industry, Texas Instruments ensures that this logic gate delivers exceptional performance and precision. Ideal for a wide range of applications, this product offers fast propagation delay, low power consumption, and a compact design. Experience seamless integration and enhanced functionality with the SN74LVC1G08DCKJ, providing unmatched value and efficiency for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 4.5 ns

With a low propagation delay, this product allows for faster signal processing and improved efficiency.

Surface Mount: YES

Surface mount technology makes installation easier and provides a more compact design for space-saving benefits.

No. of Inputs: 2

Having 2 inputs allows for more complex logic operations to be performed, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage, making it compatible with various systems and easy to integrate.

Load Capacitance (CL): 50 pF

The low load capacitance helps maintain signal integrity and prevents signal distortion.

Power Supplies (V): 3.3

Matches the nominal supply voltage for efficient power management and compatibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch allows for compact placement on a circuit board, saving space.

Maximum I (ol): 24 Amp

Can handle high output currents, ensuring reliable performance under heavy loads.

Propagation Delay (tpd): 8 ns

Despite slightly higher delay than nominal supply, still offers fast signal processing for efficient operation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications with demanding environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, providing versatility in various operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The finish offers excellent conductivity and durability, ensuring reliable connections for optimal performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connection options for different circuit configurations.

Maximum Seated Height: 1.1 mm

Low profile design allows for close stacking of components, optimizing space usage on a circuit board.

Width: 1.25 mm

Compact width allows for efficient placement on a circuit board and saves space in the overall design.

Minimum Supply Voltage (Vsup): 1.65 V

The product can operate at low supply voltage levels, making it suitable for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a defined reflow time, the product can withstand the soldering process without damage or performance degradation.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes, ensuring product reliability.

Length: 2 mm

Compact length allows for efficient placement on a circuit board and saves space in the overall design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance under tough conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide secure solder connections and ease of installation, ensuring reliable performance.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact placement on a circuit board, saving space and providing flexibility in design.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher supply voltages, providing flexibility in power supply options and compatibility with different systems.

Technical Specifications

Logic Gates SN74LVC1G08DCKJ attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G08DCKJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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