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SN74AHC08PWR

Texas Instruments

SN74AHC08PWR by Texas Instruments

SN74AHC08PWR by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 9 ns at 3.3V, suitable for automotive applications due to its wide operating temperature range of -40 to 125°C. This surface-mount device comes in a small outline package with dual terminals and nickel/palladium/gold finish.

Median Price

$0.286

Lifecycle Status

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29

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Texas Instruments

USA . 89,330 parts In-Stock

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Chip1Stop

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DigiKey

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Mouser Electronics

USA . 455 parts In-Stock

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Verical

USA . 53,749 parts In-Stock

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Arrow

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Digiode

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Nova Conductors

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Chip Stock

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Vyrian

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Bristol Electronics

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Prism Electronics

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ABC Electronics Ltd.

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A2Z Electronics, Inc.

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SPM Sales

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Ashlea Components Ltd

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Elcom Components

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Zilex Electronics Inc.

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Connector Distribution Corp

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Inventory MP

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Electronic Expediters

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QIE Inc.

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Component Sense

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Ampacity Inc.

Singapore . 35,570 parts In-Stock

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Semicontronic

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Continental Prestige Electronics

USA . 6,473 parts In-Stock

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Argo Parts USA

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Corphita

USA . 4,357 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,438 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,035 parts In-Stock

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Corohmni

South Africa . 554 parts In-Stock

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IDEA Electronic Components Group

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ChromeModa Solutions

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Perfect Parts

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Lixinc

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SN74AHC08PWR Logic Gates. Crafted with precision and expertise by a renowned manufacturer, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, these logic gates provide fast and efficient performance, making them a valuable asset for any project. Experience the benefits of high-speed operation, low power consumption, and compact design, all in one versatile package. Elevate your projects to the next level with the SN74AHC08PWR Logic Gates from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the components inside.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay helps in fast and efficient signal processing.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying assembly.

No. of Functions: 4

Multiple functions in one component provide versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of devices.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable and reliable performance in various circuit configurations.

Power Supplies (V): 2/5.5

Supports a range of power supplies, offering flexibility in design and compatibility.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance allows for use in harsh environments or applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in both cold and hot conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Logic Gates SN74AHC08PWR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 5 V NOMINAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.002 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74AHC08PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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