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SN74LVC1G04DBVT

Texas Instruments

SN74LVC1G04DBVT by Texas Instruments

SN74LVC1G04DBVT by Texas Instruments is a CMOS logic gate with 4.2 ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with dual terminals and operates within -40 to 125 °C temperature range. With surface mount capability and low power consumption of 0.01 mA, it is ideal for compact electronic designs requiring fast signal processing.

Median Price

$0.782

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 12 parts In-Stock

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$0.555

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Chip1Stop

Japan . 57 parts In-Stock

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Texas Instruments

USA . 254,181 parts In-Stock

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DigiKey

USA . 1,308 parts In-Stock

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$0.900

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$0.509

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Mouser Electronics

USA . 4,844 parts In-Stock

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$0.970

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$0.537

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$0.459

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$0.427

4,844

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$0.537

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$0.427

RS (Exports)

UK . 260 parts In-Stock

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$0.790

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$0.675

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$0.790

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Element14

Singapore . 164 parts In-Stock

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$0.826

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$0.803

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$0.795

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$0.795

Verical

USA . 31 parts In-Stock

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$0.459

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$0.376

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$0.372

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Distributors (In-Stock)

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Digiode

USA . 311 parts In-Stock

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$0.356

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Nova Conductors

Japan . 10 parts In-Stock

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TME

Poland . 1,198 parts In-Stock

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Chip Stock

USA . 291,860 parts In-Stock

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Vyrian

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Semtec, LLC

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Goldney Electronics S.L.

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Microfarads

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Prism Electronics

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Cyclops Electronics Ltd

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Semi Source

USA . 491 parts In-Stock

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PC Components Company LLC

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Lantek

USA . 250 parts In-Stock

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ComSIT Distribution GmbH

Germany . 250 parts In-Stock

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Rebound Electronics

UK . 200 parts In-Stock

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Bristol Electronics

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J2 Sourcing AB

Sweden . 45 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 39,899 parts In-Stock

1+ parts

$0.319

100+ parts

$0.311

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$0.309

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39,899

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Ampacity Inc.

Singapore . 34,798 parts In-Stock

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Corphita

USA . 626 parts In-Stock

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Argo Parts USA

USA . 4,175 parts In-Stock

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Continental Prestige Electronics

USA . 3,759 parts In-Stock

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$0.544

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Modulus Dynamics

Lithuania . 30 parts In-Stock

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$0.604

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Microchip USA

USA . 4,386 parts In-Stock

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Corohmni

South Africa . 325 parts In-Stock

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Parana Technologies

USA . 2,286 parts In-Stock

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$46.390

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DigiPath Technology Company

USA . 1,822 parts In-Stock

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$28.711

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ChromeModa Solutions

Germany . 6,610 parts In-Stock

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IDEA Electronic Components Group

UK . 1,794 parts In-Stock

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$28.660

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Perfect Parts

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Brazil . 950 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74LVC1G04DBVT logic gate from Texas Instruments. Designed with precision and reliability in mind, this logic gate offers fast propagation delay, low power consumption, and wide operating temperature range, making it ideal for automotive applications. Trust in Texas Instruments' reputation for quality and innovation to bring you the best in logic gate technology. Experience seamless integration and improved performance with the SN74LVC1G04DBVT - the smart choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the regulator suitable for a variety of environments.

Maximum Dropout Voltage: 1.6 V

Low dropout voltage allows for efficient power conversion, minimizing power loss and heat generation.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range ensures reliability and performance in extreme conditions.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high efficiency and low power consumption.

Nominal Output Voltage: 5 V

Stable output voltage ensures consistent performance in powering various electronic devices.

Maximum Output Current: 3 A

High output current capability allows the regulator to power a wide range of devices and components.

Technical Specifications

Logic Gates SN74LVC1G04DBVT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G04DBVT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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