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SN74LV14APWRG4

Texas Instruments

SN74LV14APWRG4 by Texas Instruments

SN74LV14APWRG4 by Texas Instruments is a CMOS logic gate with 6 functions, 27 ns propagation delay, and 18.5 ns nominal supply delay. It operates at temperatures from -40 to 125 °C and is ideal for automotive applications due to its Schmitt Trigger technology and small outline package design.

Median Price

$0.498

Lifecycle Status

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1k+

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Mouser Electronics

USA . 6,852 parts In-Stock

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Nova Conductors

Japan . 55 parts In-Stock

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Digiode

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Chip Stock

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Vyrian

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QIE Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Elcom Components

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Argo Parts USA

USA . 2,573 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 182 parts In-Stock

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Modulus Dynamics

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Semicontronic

India . 4,635 parts In-Stock

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Ampacity Inc.

Singapore . 4,524 parts In-Stock

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Corphita

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Advanced Electronics

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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IDEA Electronic Components Group

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Corohmni

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Lucentia Tech

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74LV14APWRG4 Logic Gates. This innovative product offers customers a versatile solution for a variety of applications, boasting a low propagation delay and high performance. With a small outline package and dual terminal position, this Logic Gate is perfect for automotive use and other demanding environments. Elevate your projects with the exceptional value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and can dissipate heat efficiently, ensuring long-term reliability.

Approvals (V): UL, TUV, EAC

Having multiple safety approvals ensures that the product meets industry standards and is safe to use in various applications.

Trim or Adjustable Output (V): YES

Ability to adjust the output voltage allows for flexible use in different scenarios and applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate into existing systems or designs.

Main Output Efficiency: 94%

High efficiency means less energy loss and reduced operating costs, making the product cost-effective in the long run.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly style enables compact and space-saving designs, ideal for applications with limited space.

Maximum Operating Temperature: 70 °C

High operating temperature range allows the product to operate reliably in various environments and conditions.

Minimum Output Voltage: 22.5 V

Low minimum output voltage ensures compatibility with a wide range of devices and equipment.

Minimum Operating Temperature: -25 °C

Wide operating temperature range enables the product to be used in extreme cold conditions without any performance issues.

Maximum Output Voltage: 28.8 V

High maximum output voltage provides flexibility to power a variety of devices and components.

Other IC type: AC-DC REGULATED POWER SUPPLY MODULE

Regulated power supply module ensures stable and reliable power delivery to connected devices, preventing damage from voltage fluctuations.

Nominal Input Voltage: 100 V

Nominal input voltage of 100V makes it suitable for use in standard power setups.

Maximum Output Current: 40 A

High maximum output current capability allows the product to power demanding loads without issues.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies, offering optimal performance and efficiency.

Protection(s): SHORT CIRCUIT

Short circuit protection safeguards the product and connected devices from damage in case of electrical faults.

Maximum Total Power Output: 960 W

High total power output makes the product suitable for powering multiple devices simultaneously or high-power applications.

Minimum Input Voltage: 85 V

Low minimum input voltage ensures the product can operate efficiently even in areas with unstable power supply.

Nominal Output Voltage: 24 V

Stable nominal output voltage of 24V makes the product compatible with a wide range of devices and appliances.

Maximum Input Voltage: 277 V

High maximum input voltage ensures compatibility with different power sources and setups.

Technical Specifications

Logic Gates SN74LV14APWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

18.5 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV14APWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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