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SN74LVC1G07DCK3

Texas Instruments

SN74LVC1G07DCK3 by Texas Instruments

SN74LVC1G07DCK3 by Texas Instruments is a CMOS logic gate with 5 terminals and open-drain output. It operates at a supply voltage range of 1.65V to 5.5V, with a max power supply current of 0.01mA. With a propagation delay of 8.6ns, it is suitable for automotive applications requiring fast response times in compact spaces.

Median Price

$0.201

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 99,000 parts In-Stock

1+ parts

$0.070

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

-

99,000

$0.070

$0.070

$0.070

-

Texas Instruments

USA . 552,465 parts In-Stock

1+ parts

$0.201

100+ parts

$0.137

1k+ parts

$0.070

10k+ parts

-

552,465

$0.201

$0.137

$0.070

-

Mouser Electronics

USA . 35,039 parts In-Stock

1+ parts

$0.270

100+ parts

$0.139

1k+ parts

$0.116

10k+ parts

$0.092

35,039

$0.270

$0.139

$0.116

$0.092

DigiKey

USA . 49,114 parts In-Stock

1+ parts

-

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-

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49,114

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,408 parts In-Stock

1+ parts

$0.066

100+ parts

-

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-

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1,408

$0.066

-

-

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$0.141

100+ parts

-

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550

$0.141

-

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Chip Stock

USA . 509,490 parts In-Stock

1+ parts

-

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509,490

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Vyrian

USA . 186,736 parts In-Stock

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186,736

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Semtec, LLC

USA . 15,001 parts In-Stock

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15,001

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 186,955 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

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186,955

$0.060

-

-

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Semicontronic

India . 184,916 parts In-Stock

1+ parts

$0.060

100+ parts

$0.058

1k+ parts

$0.058

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-

184,916

$0.060

$0.058

$0.058

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Corphita

USA . 1,169 parts In-Stock

1+ parts

$0.063

100+ parts

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1,169

$0.063

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Corohmni

South Africa . 212 parts In-Stock

1+ parts

$0.141

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212

$0.141

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Argo Parts USA

USA . 4,847 parts In-Stock

1+ parts

$0.141

100+ parts

-

1k+ parts

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$0.137

4,847

$0.141

-

-

$0.137

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.141

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-

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2,000

$0.141

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Continental Prestige Electronics

USA . 1,148 parts In-Stock

1+ parts

$0.141

100+ parts

-

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$0.138

1,148

$0.141

-

-

$0.138

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.145

100+ parts

$0.138

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$0.138

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270

$0.145

$0.138

$0.138

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Microchip USA

USA . 5,366 parts In-Stock

1+ parts

$0.817

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5,366

$0.817

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Parana Technologies

USA . 70 parts In-Stock

1+ parts

$15.935

100+ parts

-

1k+ parts

$16.288

10k+ parts

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70

$15.935

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$16.288

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DigiPath Technology Company

USA . 7 parts In-Stock

1+ parts

$17.546

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7

$17.546

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ChromeModa Solutions

Germany . 3,068 parts In-Stock

1+ parts

$17.904

100+ parts

$14.681

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3,068

$17.904

$14.681

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IDEA Electronic Components Group

UK . 1,366 parts In-Stock

1+ parts

$17.904

100+ parts

$17.009

1k+ parts

$16.114

10k+ parts

-

1,366

$17.904

$17.009

$16.114

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GreenTree Electronics

Israel . 13,515,297 parts In-Stock

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13,515,297

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QUARKTWIN TECHNOLOGY LTD

USA . 9,253 parts In-Stock

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9,253

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Overview

Elevate your electronics project with the SN74LVC1G07DCK3 by Texas Instruments. Crafted with precision and quality materials, this logic gate offers unmatched reliability and performance. From automotive applications to industrial settings, this versatile component ensures seamless operation and efficient signal transmission. Experience the value of Texas Instruments products and unlock a world of possibilities with the SN74LVC1G07DCK3. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and durability, making the product resistant to external factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a commonly used voltage level ensures compatibility with various systems.

Propagation Delay (tpd): 8.6 ns

Low propagation delay allows for fast signal processing and high-speed performance.

Output Characteristics: OPEN-DRAIN

Open-drain output provides flexibility in connecting to different types of components in a circuit.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive environments, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates SN74LVC1G07DCK3 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e6

Length:

2 mm

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay (tpd):

8.6 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G07DCK3 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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