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SN74LVC1G08MDBVREP

Texas Instruments

SN74LVC1G08MDBVREP by Texas Instruments

SN74LVC1G08MDBVREP by Texas Instruments is a CMOS logic gate with 2 inputs, 6.5 ns propagation delay, and 11 ns tpd. It operates at a supply voltage of 1.8V and can handle load capacitance of 50 pF. Ideal for military applications due to its small outline package style and wide temperature range from -55°C to 125°C.

Median Price

$1.403

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 41,372 parts In-Stock

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$1.366

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$1.129

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$0.610

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41,372

$1.366

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$0.610

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Chip1Stop

Japan . 2,433 parts In-Stock

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$1.440

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$1.070

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$0.948

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$0.885

2,433

$1.440

$1.070

$0.948

$0.885

Arrow

USA . 1,156 parts In-Stock

1+ parts

$1.447

100+ parts

$1.088

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$0.958

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1,156

$1.447

$1.088

$0.958

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Mouser Electronics

USA . 7,232 parts In-Stock

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$2.300

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$1.420

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$1.330

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$1.230

7,232

$2.300

$1.420

$1.330

$1.230

Verical

USA . 2,363 parts In-Stock

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$1.357

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$1.275

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DigiKey

USA . 1,319 parts In-Stock

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$1.195

1,319

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Distributors (In-Stock)

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Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$0.908

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-

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46

$0.908

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Digiode

USA . 4,452 parts In-Stock

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$1.054

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4,452

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Chip Stock

USA . 23,500 parts In-Stock

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Vyrian

USA . 11,913 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,260 parts In-Stock

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Component Sense

UK . 1,289 parts In-Stock

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Bristol Electronics

USA . 564 parts In-Stock

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PC Components Company LLC

USA . 549 parts In-Stock

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Contempo Components LLC

USA . 140 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.890

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$0.855

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2,000

$0.890

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$0.855

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Argo Parts USA

USA . 4,203 parts In-Stock

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$0.908

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Continental Prestige Electronics

USA . 336 parts In-Stock

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$0.908

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$0.890

336

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Corphita

USA . 3,974 parts In-Stock

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$0.999

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Semicontronic

India . 11,873 parts In-Stock

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$1.160

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$1.131

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$1.125

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11,873

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Ampacity Inc.

Singapore . 11,712 parts In-Stock

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$1.160

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Corohmni

South Africa . 178 parts In-Stock

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Parana Technologies

USA . 726 parts In-Stock

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DigiPath Technology Company

USA . 2,340 parts In-Stock

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$20.751

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$19.090

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ChromeModa Solutions

Germany . 2,435 parts In-Stock

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$21.174

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IDEA Electronic Components Group

UK . 920 parts In-Stock

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$21.174

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$19.057

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$31.837

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$30.245

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Perfect Parts

USA . 19,589 parts In-Stock

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Lixinc

USA . 9,941 parts In-Stock

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Kepictronics

USA . 2,216 parts In-Stock

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Overview

Elevate your projects with the SN74LVC1G08MDBVREP by Texas Instruments, a top-tier manufacturer known for quality and reliability. This logic gate is a game-changer in its category, offering fast propagation delay and low power consumption. Ideal for a wide range of applications, this versatile component ensures optimal performance and efficiency. Experience the value and benefits of cutting-edge technology with Texas Instruments, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gate, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6.5 ns

Fast propagation delay ensures quick operation and response times in logic operations.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, which can help reduce power consumption and heat generation.

Temperature Grade: MILITARY

Designed to meet stringent military standards for performance and reliability in harsh environments.

Technology: CMOS

Utilizes CMOS technology, which offers low power consumption and high noise immunity for consistent operation.

Maximum Seated Height: 1.45 mm

Low profile design allows for compact and space-saving installations in electronic devices.

Maximum Power Supply Current (ICC): 0.01 mA

Operates with a low power supply current, contributing to energy efficiency and longer battery life in portable devices.

Technical Specifications

Logic Gates SN74LVC1G08MDBVREP attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G08MDBVREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-598-7543, 5962015987543

NIIN

015987543

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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