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SN74HC00D

Texas Instruments

SN74HC00D by Texas Instruments

SN74HC00D by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 23 ns at 5V, making it suitable for industrial applications requiring fast response times. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

$0.786

Lifecycle Status

Suppliers In-Stock

66

In-Stock Inventory

1k+

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Rochester

USA . 100 parts In-Stock

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$0.483

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$0.454

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$0.483

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$0.410

Mouser Electronics

USA . 6,789 parts In-Stock

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$1.090

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$0.711

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$0.496

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$0.427

6,789

$1.090

$0.711

$0.496

$0.427

Adafruit Industries

USA . 2,500 parts In-Stock

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$23.325

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$22.159

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Chip1Stop

Japan . 823 parts In-Stock

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DF Sales Co.

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Freelance Electronics

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Digiode

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Nova Conductors

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EXC GmbH

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TEDSS.com

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Component Electronics Inc.

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TME

Poland . 86 parts In-Stock

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Forefront Electronics and Design

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LIBRA Elektronik GmbH

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Sensible Micro Corp

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MRC Electronics

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Semicontronic

India . 2,263 parts In-Stock

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$0.173

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$0.169

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$0.168

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Corphita

USA . 4,492 parts In-Stock

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Component Stockers USA

USA . 14,951 parts In-Stock

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Continental Prestige Electronics

USA . 3,163 parts In-Stock

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Argo Parts USA

USA . 964 parts In-Stock

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Parana Technologies

USA . 1,080 parts In-Stock

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DigiPath Technology Company

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Germany . 6,910 parts In-Stock

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Overview

Discover the power of precision and reliability with the SN74HC00D logic gate by Texas Instruments. As a leader in semiconductor technology, Texas Instruments delivers top-quality products that excel in performance and durability. Ideal for various applications, this logic gate offers unmatched value and efficiency to customers seeking seamless integration and optimal results. Upgrade your projects with the SN74HC00D and experience enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body makes this product durable and lightweight.

Propagation Delay At Nominal Supply: 23 ns

With a fast propagation delay of 23 ns, this logic gate ensures quick signal processing.

Surface Mount: YES

This surface mount logic gate is easy to install and saves space on a circuit board.

No. of Functions: 4

With 4 functions, this logic gate can perform multiple operations efficiently.

No. of Inputs: 2

Having 2 inputs allows for versatile functionality in different logic gate configurations.

Package Shape: RECTANGULAR

The rectangular package shape makes this logic gate easy to handle and integrate into a circuit design.

Nominal Supply Voltage (Vsup): 5V

With a 5V nominal supply voltage, this logic gate is compatible with standard power sources.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable performance in various circuit configurations.

Power Supplies: 2/6V

Operating on a range of 2-6V power supplies, this logic gate is versatile for different applications.

No. of Terminals: 14

With 14 terminals, this logic gate provides ample connectivity options for complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density circuit designs.

Maximum I (ol): 5.2 Amp

The high maximum output current of 5.2 Amp allows this logic gate to drive heavy loads.

Propagation Delay (tpd): 115 ns

Even with a 115 ns propagation delay, this logic gate offers reliable signal processing speed.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this logic gate can withstand high-temperature environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance in cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position allows for flexible installation options in a circuit layout.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm saves space and enables compact circuit designs.

Width: 3.9 mm

With a width of 3.9 mm, this logic gate is suitable for applications with tight space constraints.

Minimum Supply Voltage (Vsup): 2V

Operating at a minimum supply voltage of 2V, this logic gate is energy-efficient.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures secure soldering during assembly.

Length: 8.65 mm

The length of 8.65 mm provides a compact form factor for integrating this logic gate into circuit layouts.

Temperature Grade: INDUSTRIAL

This logic gate is designed for industrial applications that require robust performance in harsh environments.

Technology: CMOS

Using CMOS technology, this logic gate offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and reliable connections in circuit assemblies.

Packing Method: TUBE

Packaged in a tube, this logic gate is conveniently stored and transported for production use.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise placement and soldering of this logic gate on a PCB.

Maximum Supply Voltage (Vsup): 6V

With a maximum supply voltage of 6V, this logic gate can handle higher power requirements.

Maximum Power Supply Current (ICC): 0.02 mA

The low maximum power supply current of 0.02 mA minimizes energy consumption and heat dissipation.

Technical Specifications

Logic Gates SN74HC00D attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

115 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC00D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-399-5373, 5962013995373

NIIN

013995373

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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