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74LX1G04CTR

STMicroelectronics

74LX1G04CTR by STMicroelectronics

74LX1G04CTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 6.5 ns, operating b/w 1.65V and 5.5V. It features a compact SOIC package and supports military-grade temperatures from -55 °C to 125°C, ideal for high-performance applications. With a load capacitance of 50 pF, it's perfect for space-constrained designs.

Median Price

$0.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Tomark Electronics Ltd

UK . 12,674 parts In-Stock

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$0.190

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$0.190

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Zilex Electronics Inc.

Canada . 21,000 parts In-Stock

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Chip Stock

USA . 15,171 parts In-Stock

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Vyrian

USA . 2,669 parts In-Stock

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2,669

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Digiode

USA . 2,359 parts In-Stock

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2,359

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Anansix

USA . 458 parts In-Stock

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458

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Prism Electronics

USA . 413 parts In-Stock

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413

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Distributors (Availability)

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Microchip USA

USA . 392 parts In-Stock

1+ parts

$1.531

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392

$1.531

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AZTECH Wire

Italy . 37 parts In-Stock

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$14.800

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37

$14.800

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Native Components

USA . 734 parts In-Stock

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$14.840

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734

$14.840

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Northwest PG Solutions

USA . 258 parts In-Stock

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$16.324

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$14.692

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258

$16.324

$14.692

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IDEA Electronic Components Group

UK . 884 parts In-Stock

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$26.517

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$23.865

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884

$26.517

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$23.865

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MKK Technologies

India . 2,039 parts In-Stock

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$49.864

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2,039

$49.864

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DigiPath Technology Company

USA . 2,039 parts In-Stock

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$49.864

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Perfect Parts

USA . 115,028 parts In-Stock

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Assy Fe

Spain . 109,100 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kepictronics

USA . 5,354 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,323 parts In-Stock

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Parana Technologies

USA . 962 parts In-Stock

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$31.705

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Corphita

USA . 448 parts In-Stock

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Overview

Unlock the potential of your designs with the 74LX1G04CTR from STMicroelectronics, a premium CMOS logic gate that delivers unmatched reliability and performance. With its ultra-fast propagation delay and robust thermal capabilities, this versatile component is perfect for a variety of applications, from automotive to industrial systems. Experience the peace of mind that comes with a trusted manufacturer renowned for quality and innovation, ensuring your projects excel in efficiency and longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and ease of integration into various electronic systems.

Propagation Delay At Nominal Supply: 6.5 ns

A low propagation delay ensures faster operation, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts and automated assembly, enhancing production efficiency.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient use of board space, critical for modern compact designs.

Nominal Supply Voltage / Vsup: 1.8 V

This low nominal voltage is energy-efficient, contributing to reduced power consumption in circuits.

Load Capacitance (CL): 50 pF

A low load capacitance improves the speed of circuit operation and minimizes delays in signal transmission.

Power Supplies (V): 3.3 V

Compatible with common power supply voltages, allowing integration into standard electronic systems easily.

No. of Terminals: 5

Five terminals facilitate versatile connection options in circuit designs, making it easier to implement.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on PCBs, essential for space-constrained applications.

Maximum I (ol): 24 Amp

High output current capability allows for driving larger loads, making it suitable for power-related applications.

Propagation Delay (tpd): 11.5 ns

While slightly higher than nominal, it still maintains fast switching, ideal for many digital logic applications.

Maximum Operating Temperature: 125 °C

Wide temperature range ensures reliable operation in harsh and variable environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature expands the application scope to extreme conditions in aerospace and military.

Terminal Finish: Matte Tin (Sn)

Tin coating enhances solderability and protects against oxidation, improving longevity in connections.

Terminal Position: DUAL

Dual terminal position enhances the flexibility of PCB layout and connectivity options.

Maximum Seated Height: 1.1 mm

A low seated height allows for slim profile designs, perfect for compact electronic devices.

Width: 1.25 mm

Narrow width facilitates high-density PCB designs, accommodating advanced electronic components.

Minimum Supply Voltage (Vsup): 1.65 V

This flexibility in supply voltage range allows for interoperability with various digital logic levels.

Maximum Time At Peak Reflow Temperature: 30 s

Extended peak reflow time ensures effective soldering while maintaining component integrity.

Peak Reflow Temperature: 260 °C

High peak reflow temperature compatibility supports modern reflow soldering processes in manufacturing.

Length: 2 mm

Compact length ensures it can fit into tight spaces on PCBs, ideal for miniaturized devices.

Temperature Grade: MILITARY

Military-grade specifications ensure high reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering to the PCB.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for higher density packaging on PCBs, optimized for sophisticated circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The wide range of supply voltage accommodates varying application requirements, enhancing versatility.

Technical Specifications

Logic Gates 74LX1G04CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LX1G04CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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