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74LX1G02STR

STMicroelectronics

74LX1G02STR by STMicroelectronics

74LX1G02STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.2 ns and operates at supply voltages from 1.65V to 5.5V. It features dual inputs and comes in a compact, low-profile package ideal for space-constrained applications. With an industrial temperature grade, it's perfect for reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,241 parts In-Stock

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4,241

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Digiode

USA . 2,951 parts In-Stock

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2,951

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Anansix

USA . 94 parts In-Stock

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94

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Distributors (Availability)

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Native Components

USA . 254 parts In-Stock

1+ parts

$0.056

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-

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-

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$0.054

254

$0.056

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$0.054

AZTECH Wire

Italy . 996 parts In-Stock

1+ parts

$15.340

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-

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996

$15.340

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Corohmni

South Africa . 1 parts In-Stock

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$19.406

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1

$19.406

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Microchip USA

USA . 155 parts In-Stock

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$24.423

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155

$24.423

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

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$25.835

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$23.252

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1,952

$25.835

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$23.252

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$39.145

100+ parts

$35.622

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$32.099

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550

$39.145

$35.622

$32.099

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MKK Technologies

India . 1,284 parts In-Stock

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$48.582

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$48.582

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DigiPath Technology Company

USA . 1,284 parts In-Stock

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$48.582

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$48.582

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Corphita

USA . 2,623 parts In-Stock

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Northwest PG Solutions

USA . 1,326 parts In-Stock

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A-Z Elektronik GmbH

Germany . 975 parts In-Stock

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975

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Parana Technologies

USA . 897 parts In-Stock

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$30.890

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897

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$30.890

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Overview

Elevate your designs with the 74LX1G02STR from STMicroelectronics, a top-tier logic gate renowned for its reliability and speed. Perfect for industrial applications, this compact component delivers exceptional performance in demanding environments, ensuring low power consumption and reduced propagation delay. Trust in ST's legacy of quality to enhance efficiency and innovation in your projects, making it the ideal choice for engineers seeking both value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection from environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 4.2 ns

With a low propagation delay, this logic gate enables faster signal processing, making it ideal for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easier integration into compact electronic designs and automated assembly processes.

No. of Inputs: 2

Having two inputs provides flexibility for implementing logical operations, suitable for a wide range of electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes PCB space utilization, allowing for more efficient circuit designs.

Nominal Supply Voltage / Vsup (V): 1.8

Optimized for low voltage operation, this feature ensures compatibility with low-power systems, enhancing energy efficiency.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures that the logic gate operates well under various loads, maintaining performance stability.

Power Supplies (V): 3.3

The compatibility with a 3.3V power supply allows for seamless integration into modern digital systems, ensuring broad usage.

No. of Terminals: 5

The presence of 5 terminals facilitates easier connection and routing in circuit designs, simplifying the layout process.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, shrink pitch design minimizes space, making it perfect for compact and space-constrained applications.

Maximum I (ol): 24 Amp

A high output current capacity of 24 Amps supports demanding applications, allowing it to drive larger loads effectively.

Propagation Delay (tpd): 12 ns

Although slightly higher than the nominal delay, a propagation delay of 12 ns still supports high-speed operations in most use cases.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability in warm environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows for functionality in harsh, cold conditions, making it suitable for outdoor applications.

Terminal Finish: TIN

Tin terminal finish enhances solderability and provides good corrosion resistance, ensuring dependable circuit connections.

Terminal Position: DUAL

Having a dual terminal position allows for versatile mounting options on PCB, simplifying design considerations.

Maximum Seated Height: 1.45 mm

With a maximum seated height of 1.45 mm, this component maintains a low profile, allowing for high-density assembly on PCBs.

Width: 1.625 mm

A compact width of 1.625 mm enables space-efficient designs, ideal for modern electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

The ability to operate at a minimum supply voltage of 1.65V expands adaptability to various power settings, enhancing design flexibility.

Length: 2.9 mm

At a length of 2.9 mm, this device's compact dimensions contribute to simplified circuit designs and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Designed with an industrial temperature grade, this logic gate is reliable for critical applications under varying temperature conditions.

Technology: CMOS

Utilizing CMOS technology improves power efficiency and allows for higher integration density, making it a valuable choice for modern electronics.

Terminal Form: GULL WING

The gull wing terminal form ensures excellent mechanical stability and ease of soldering, enhancing long-term reliability.

Packing Method: TR

Using a TR packing method ensures protection during shipping and simplifies handling in manufacturing processes.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for compact design layouts and is compatible with a variety of PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage rating of 5.5V provides flexibility to accommodate various power needs in diverse applications.

Technical Specifications

Logic Gates 74LX1G02STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74LX1G02STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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