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74LX1G14CTR

STMicroelectronics

74LX1G14CTR by STMicroelectronics

74LX1G14CTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of just 7.5 ns and operates b/w 1.65V to 5.5V. Its compact design (2mm x 1.25mm) makes it ideal for space-constrained applications. With a max temp of 125 °C, it's suitable for military use.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,125 parts In-Stock

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3,125

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Vyrian

USA . 2,910 parts In-Stock

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2,910

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J2 Sourcing AB

Sweden . 1,192 parts In-Stock

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1,192

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EZ Electronic Parts

Israel . 1,024 parts In-Stock

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Anansix

USA . 782 parts In-Stock

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782

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Distributors (Availability)

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Microchip USA

USA . 336 parts In-Stock

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$2.582

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336

$2.582

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IDEA Electronic Components Group

UK . 1,750 parts In-Stock

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$9.608

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$8.648

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$9.608

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$8.648

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AZTECH Wire

Italy . 260 parts In-Stock

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$13.360

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260

$13.360

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MKK Technologies

India . 1,617 parts In-Stock

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$18.068

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DigiPath Technology Company

USA . 1,617 parts In-Stock

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$18.068

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Component Stockers USA

USA . 798 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Corphita

USA . 4,138 parts In-Stock

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Parana Technologies

USA . 2,148 parts In-Stock

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$11.488

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Assy Fe

Spain . 1,836 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Northwest PG Solutions

USA . 1,483 parts In-Stock

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Native Components

USA . 528 parts In-Stock

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Overview

Unlock unparalleled performance with the 74LX1G14CTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality logic gate combines exceptional speed and reliability, making it ideal for a range of applications from automotive to industrial automation. With its ultra-thin profile and low power consumption, you can achieve greater efficiency without compromising on performance. Choose STMicroelectronics for superior quality that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance in various applications, making it suitable for diverse environments.

Propagation Delay At Nominal Supply: 7.5 ns

A low propagation delay allows for fast signal processing, ideal for high-speed applications.

Surface Mount: YES

Surface mount capability enables compact design and efficient use of PCB space.

Package Shape: RECTANGULAR

The rectangular shape is standard for many circuit designs, making integration straightforward.

Nominal Supply Voltage / Vsup: 1.8 V

A low nominal supply voltage enhances energy efficiency, reducing power consumption and extending battery life.

Load Capacitance (CL): 50 pF

This load capacitance level supports compatibility with various logic levels, making it versatile for different applications.

Power Supplies (V): 3.3 V

Support for a common power supply voltage ensures ease of use in standard digital circuits.

No. of Terminals: 5

A 5-terminal configuration provides essential functionality while remaining compact.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch are ideal for space-constrained applications, ensuring that devices can fit into tight spaces.

Maximum I (ol): 24 Amp

A high output current capability allows the product to drive larger loads effectively, expanding its application potential.

Propagation Delay (tpd): 15.6 ns

This propagation delay indicates reliable operation in timing-critical applications, particularly in data processing.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this product suitable for demanding environments in military and aerospace applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures reliability in extreme conditions, beneficial for outdoor and industrial use.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring longevity in assembly.

Terminal Position: DUAL

Dual terminal positioning offers flexible layout options on PCBs, allowing for better design variety.

Maximum Seated Height: 1.1 mm

A low seated height allows for a slim design, beneficial in low-profile applications.

Width: 1.25 mm

Compact width helps save space on the circuit board while still providing essential functionality.

Minimum Supply Voltage (Vsup): 1.65 V

Flexibility in supply voltage range allows for broader application compatibility and easier integration.

Length: 2 mm

A short length further contributes to space efficiency on PCBs, making it suitable for packed designs.

Temperature Grade: MILITARY

This military-grade specification ensures high reliability and performance in rugged conditions, ideal for defense applications.

Schmitt Trigger: YES

The presence of a Schmitt trigger improves signal integrity by reducing noise susceptibility, essential for unstable environments.

Technology: CMOS

CMOS technology allows for low-power operation and high levels of integration, making it economical and effective in various applications.

Terminal Form: GULL WING

Gull-wing terminals provide ease of automated assembly and increased mechanical stability during soldering.

Packing Method: TR

Taped and reeled packing method facilitates easy handling and automated assembly processes.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for compact designs, making it suitable for high-density applications.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at higher voltages increases versatility for various digital applications.

Technical Specifications

Logic Gates 74LX1G14CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G14CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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