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74LX1G08STR

STMicroelectronics

74LX1G08STR by STMicroelectronics

74LX1G08STR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.2 ns and operates at supply voltages b/w 1.65V to 5.5V. It features dual inputs and is ideal for high-speed applications in compact designs. Its military-grade specs ensure reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

$0.254

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1,425 parts In-Stock

1+ parts

$0.370

100+ parts

$0.389

1k+ parts

$0.367

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-

1,425

$0.370

$0.389

$0.367

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Vyrian

USA . 8,685 parts In-Stock

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8,685

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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3,000

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Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

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$0.138

1k+ parts

$0.083

10k+ parts

$0.055

3,000

-

$0.138

$0.083

$0.055

Dan-Mar Components

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

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Prism Electronics

USA . 2,689 parts In-Stock

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2,689

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PC Components Company LLC

USA . 2,439 parts In-Stock

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2,439

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Digiode

USA . 1,791 parts In-Stock

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1,791

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Anansix

USA . 698 parts In-Stock

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698

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LWI Electronics Inc

India . 90 parts In-Stock

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 124 parts In-Stock

1+ parts

$1.205

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-

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124

$1.205

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Native Components

USA . 674 parts In-Stock

1+ parts

$8.858

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-

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674

$8.858

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Northwest PG Solutions

USA . 131 parts In-Stock

1+ parts

$9.744

100+ parts

$8.769

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131

$9.744

$8.769

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

1+ parts

$12.075

100+ parts

-

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$10.868

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1,182

$12.075

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$10.868

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AZTECH Wire

Italy . 972 parts In-Stock

1+ parts

$14.520

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972

$14.520

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MKK Technologies

India . 535 parts In-Stock

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$22.706

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535

$22.706

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DigiPath Technology Company

USA . 535 parts In-Stock

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$22.706

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535

$22.706

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Perfect Parts

USA . 6,318 parts In-Stock

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6,318

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Kepictronics

USA . 4,371 parts In-Stock

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4,371

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A-Z Elektronik GmbH

Germany . 2,970 parts In-Stock

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2,970

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iodParts Technologies Inc.

India . 2,141 parts In-Stock

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2,141

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Parana Technologies

USA . 2,013 parts In-Stock

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$14.438

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2,013

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$14.438

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Corphita

USA . 1,766 parts In-Stock

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1,766

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Overview

Experience unparalleled performance with the 74LX1G08STR from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact logic gate excels in speed and reliability, catering to diverse applications from consumer electronics to automotive systems. With its low power consumption and robust temperature range, it ensures longevity and efficiency in every design, empowering engineers to innovate without compromise. Trust STMicroelectronics for unmatched excellence and value in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and resistance to environmental stresses, making it suitable for various applications.

Propagation Delay At Nominal Supply: 4.2 ns

A short propagation delay ensures quick signal processing, which is critical for high-speed applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and automated assembly, reducing manufacturing costs.

No. of Inputs: 2

With two inputs, this logic gate can perform basic binary operations, making it versatile for digital circuitry.

Package Shape: RECTANGULAR

The rectangular package shape is standard for many applications, ensuring compatibility with a variety of PCB layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal voltage of 1.8V makes this gate energy-efficient, supporting low-power designs.

Load Capacitance (CL): 50 pF

The moderate load capacitance allows for reliable operation in typical applications, balancing speed and power consumption.

Power Supplies (V): 3.3

Operating with 3.3V power supplies ensures compatibility with a wide range of modern digital circuits.

No. of Terminals: 5

Five terminals provide adequate connectivity for simple logic operations while keeping the footprint compact.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style minimizes space requirements on PCBs, ideal for compact electronic designs.

Maximum I (ol): 24 Amp

The high output current capability allows the gate to drive larger loads, making it suitable for robust applications.

Propagation Delay (tpd): 12 ns

The propagation delay of 12 ns indicates good performance for moderate-speed digital applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature assures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this component can function in extreme cold conditions, enhancing application versatility.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves solderability and reliability of connections over time.

Terminal Position: DUAL

Dual terminal positions enhance layout flexibility, allowing for practical PCB designs.

Maximum Seated Height: 1.45 mm

The low seated height supports compact designs while ensuring proper fit in various enclosures.

Width: 1.625 mm

The compact width facilitates space-saving designs in tight electronic assemblies.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage offers design flexibility and supports low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand peak reflow for up to 30 seconds ensures compatibility with modern soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance makes it suitable for surface mount soldering without damage.

Length: 2.9 mm

The compact length allows for high-density layouts in modern electronics, optimizing PCB real estate.

Temperature Grade: MILITARY

Military-grade specifications indicate exceptional reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an excellent choice for digital circuits.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical support and ease of soldering, enhancing reliability.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes, streamlining production.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for high-density placement on PCBs without sacrificing reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate up to 5.5V makes this logic gate versatile for a range of applications.

Technical Specifications

Logic Gates 74LX1G08STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74LX1G08STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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