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74LX1G08CTR

STMicroelectronics

74LX1G08CTR by STMicroelectronics

74LX1G08CTR from STMicroelectronics is a CMOS logic gate with a fast propagation delay of 4.2 ns and operates at a nominal voltage of 1.8V. It features dual inputs and is ideal for compact, high-speed applications in military environments. Its small outline package ensures efficient space utilization.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Chip Stock

USA . 28,180 parts In-Stock

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Bristol Electronics

USA . 20,300 parts In-Stock

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Dan-Mar Components

USA . 20,300 parts In-Stock

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ComSIT Distribution GmbH

Germany . 14,605 parts In-Stock

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Digiode

USA . 4,649 parts In-Stock

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Vyrian

USA . 3,123 parts In-Stock

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Electronics Depot

USA . 2,842 parts In-Stock

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Anansix

USA . 2,822 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,700 parts In-Stock

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North Shore Components

USA . 250 parts In-Stock

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J2 Sourcing AB

Sweden . 147 parts In-Stock

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Prism Electronics

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Microchip USA

USA . 453 parts In-Stock

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AZTECH Wire

Italy . 339 parts In-Stock

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$16.420

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IDEA Electronic Components Group

UK . 1,086 parts In-Stock

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$27.530

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$24.777

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MKK Technologies

India . 667 parts In-Stock

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$51.769

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DigiPath Technology Company

USA . 667 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Kepictronics

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Parana Technologies

USA . 986 parts In-Stock

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Overview

Unlock the potential of your designs with the 74LX1G08CTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This ultra-reliable logic gate promises swift performance and low power consumption, making it ideal for applications ranging from consumer electronics to industrial automation. With its compact size and robust temperature range, it seamlessly integrates into your projects, ensuring efficiency and durability. Elevate your innovation with ST's proven excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this logic gate reliable in various applications.

Propagation Delay At Nominal Supply: 4.2 ns

A low propagation delay allows for faster signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology provides compactness and ease of integration into modern circuit boards, optimizing space.

No. of Inputs: 2

With two inputs, this logic gate can handle basic binary logic operations, making it versatile for a range of digital applications.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs, facilitating easier layout designs.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage signifies energy efficiency, resulting in reduced power consumption in electronic devices.

Load Capacitance (CL): 50 pF

The moderate load capacitance allows for effective signal transmission while maintaining performance in diverse circuits.

Power Supplies (V): 3.3

Compatible with a wide range of power supplies, ensuring flexibility in various design architectures.

No. of Terminals: 5

Five terminals facilitate straightforward connections, enhancing ease of use in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile design minimizes space usage, perfect for compact electronics and portable devices.

Maximum I (ol): 24 Amp

A high output current capability supports a variety of load conditions, making this component robust for demanding applications.

Propagation Delay (tpd): 12 ns

Even with a slightly higher propagation delay than nominal, it still supports reasonably fast operations for many applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures allows for reliability in extreme environments, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures functionality in various harsh conditions, making this logic gate versatile and trustworthy.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, enhancing longevity in electronic assemblies.

Terminal Position: DUAL

Dual terminal positioning facilitates easier access and mounting options, optimizing circuit board layout.

Maximum Seated Height: 1.1 mm

A low seated height contributes to the overall slim profile design, enabling high-density layouts.

Width: 1.25 mm

A narrow width helps maximize PCB space, allowing for more components in a limited area.

Minimum Supply Voltage (Vsup): 1.65 V

The lower minimum supply voltage promotes energy savings and makes this component suitable for low-power applications.

Length: 2 mm

Short length contributes to compact design choices, ideal for space-constrained applications.

Temperature Grade: MILITARY

Military-grade components ensure high reliability and performance under extreme conditions, ideal for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing performance in digital circuits.

Terminal Form: GULL WING

Gull wing terminal design provides excellent mechanical stability and ease of soldering, improving assembly reliability.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A tight terminal pitch allows for denser component layouts, crucial for modern compact electronic device designs.

Maximum Supply Voltage (Vsup): 5.5 V

A comparatively high maximum supply voltage allows for versatility across various applications and design considerations.

Technical Specifications

Logic Gates 74LX1G08CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G08CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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