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74LX1G04STR

STMicroelectronics

74LX1G04STR by STMicroelectronics

74LX1G04STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 6.5 ns, operating b/w 1.65V and 5.5V. It features a compact low-profile package suitable for surface mounting and supports military-grade temperature ranges (-55 °C to 125°C). Ideal for high-speed digital circuits, it ensures reliable performance in demanding applications.

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 2,950 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

1k+ parts

$2.000

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-

2,950

$3.080

$2.310

$2.000

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ComSIT Distribution GmbH

Germany . 7,396 parts In-Stock

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Freddi Giovanni

Italy . 6,000 parts In-Stock

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Vyrian

USA . 3,871 parts In-Stock

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4 Star Electronics, Inc.

USA . 3,000 parts In-Stock

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3,000

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Bristol Electronics

USA . 2,890 parts In-Stock

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2,890

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Flex Direct, LLC

USA . 2,890 parts In-Stock

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2,890

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Digiode

USA . 1,478 parts In-Stock

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1,478

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Anansix

USA . 1,332 parts In-Stock

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PC Components Company LLC

USA . 1,025 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 130 parts In-Stock

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$3.032

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130

$3.032

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AZTECH Wire

Italy . 745 parts In-Stock

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$17.880

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745

$17.880

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IDEA Electronic Components Group

UK . 1,186 parts In-Stock

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$21.584

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$19.426

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1,186

$21.584

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$19.426

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Native Components

USA . 34 parts In-Stock

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$30.110

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$28.906

34

$30.110

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$28.906

Northwest PG Solutions

USA . 1,537 parts In-Stock

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$33.121

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1,537

$33.121

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MKK Technologies

India . 1,609 parts In-Stock

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$40.588

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1,609

$40.588

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DigiPath Technology Company

USA . 1,609 parts In-Stock

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$40.588

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1,609

$40.588

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Component Stockers USA

USA . 494 parts In-Stock

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$99.990

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494

$99.990

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Parana Technologies

USA . 2,037 parts In-Stock

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$25.807

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2,037

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$25.807

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A-Z Elektronik GmbH

Germany . 1,950 parts In-Stock

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Corphita

USA . 1,627 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Unlock the potential of your designs with the 74LX1G04STR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance logic gate delivers exceptional speed and reliability, ideal for demanding applications in automotive, industrial, and consumer electronics. With its compact design and low power consumption, you'll enjoy improved efficiency without compromising on quality. Elevate your projects and experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6.5 ns

A low propagation delay contributes to faster signal processing, increasing the overall efficiency of electronic circuits.

Surface Mount: YES

Surface mount technology reduces the size of the components, allowing for compact circuit designs and improved manufacturing automation.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating multi-device integration.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage enhances energy efficiency and minimizes power consumption.

Load Capacitance (CL): 50 pF

A manageable load capacitance makes it easier to interface with other components, contributing to better performance.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies, making it versatile for modern electronic applications.

No. of Terminals: 5

Five terminals provide sufficient connectivity while allowing for compactness in design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style ensures a low profile design, which is ideal for space-constrained applications.

Maximum I (ol): 24 Amp

The ability to handle a maximum output current of 24A makes it suitable for high-power applications.

Propagation Delay (tpd): 11.5 ns

A propagation delay of 11.5 ns ensures quick response times, enhancing performance in critical applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this component is reliable and effective for high-temperature environments.

Minimum Operating Temperature: -55 °C

Its ability to function at low temperatures allows it to be used in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning allows for efficient space utilization on the PCB, simplifying circuit design.

Maximum Seated Height: 1.45 mm

A low seated height facilitates better thermal management and compact design.

Width: 1.625 mm

Narrow width enables high-density circuit designs, making it ideal for modern applications.

Minimum Supply Voltage (Vsup): 1.65 V

Support for a minimum supply voltage of 1.65V ensures compatibility with a variety of systems.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds supports compatibility with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature accommodates compatibility with lead-free soldering processes.

Length: 2.9 mm

Compact length is ideal for space-critical applications and enhances layout flexibility.

Temperature Grade: MILITARY

A military-grade temperature classification indicates reliability and robustness in challenging situations.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high speed, making it suitable for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and improves the mechanical strength of connections.

Packing Method: TR

Tape and reel (TR) packing simplifies automated assembly processes and facilitates efficient handling.

Terminal Pitch: 0.95 mm

A 0.95 mm pitch allows for high-density layouts while maintaining enough space for soldering.

Maximum Supply Voltage (Vsup): 5.5 V

Support for up to 5.5V allows for greater flexibility in power supply options, accommodating various applications.

Technical Specifications

Logic Gates 74LX1G04STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74LX1G04STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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