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74LVC1G08GW-G

NXP Semiconductors

74LVC1G08GW-G by NXP Semiconductors

74LVC1G08GW-G by NXP Semiconductors is a logic gate with 2 inputs, 6 ns propagation delay, and 10.5 ns tpd. It operates at a voltage range of 1.65V to 5.5V and is suitable for automotive applications due to its temperature grade. This surface-mount device in a small outline package is ideal for compact electronic designs requiring fast signal processing.

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VNN

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Bristol Electronics

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Flex Direct, LLC

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Prism Electronics

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Aztec Data Supply Inc.

USA . 3,674 parts In-Stock

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AZTECH Wire

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Advanced Electronics

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Semicontronic

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Corohmni

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Lucentia Tech

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Overview

Discover the power of seamless logic operations with the 74LVC1G08GW-G by NXP Semiconductors. Designed for reliability and efficiency, this Logic Gate offers a multitude of applications in various industries. With ultra-fast propagation delay and a compact design, this product guarantees high performance and unmatched precision. Elevate your projects with the trusted quality of NXP Semiconductors and unlock endless possibilities in your designs. Experience the innovation that sets us apart and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing overall weight of the product and provides good insulation for safety.

Propagation Delay At Nominal Supply: 6 ns

Fast propagation delay ensures quick response time for logical operations.

Surface Mount: YES

Allows for easy installation on circuit boards and saves space.

No. of Inputs: 2

Sufficient number of inputs for basic logic operations.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage supply for compatibility with other components.

Load Capacitance (CL): 50 pF

Suitable load capacitance for optimal performance in logic operations.

Power Supplies (V): 3.3

Consistent power supply voltage for stable operation.

No. of Terminals: 5

Simplified connectivity with 5 terminals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design for space-saving and efficient circuit integration.

Maximum I (ol): 24 Amp

Capable of handling high output current for robust performance.

Propagation Delay (tpd): 10.5 ns

Still fast propagation delay ensures quick response time for logical operations.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for various applications.

Minimum Operating Temperature: -40 °C

Wide temperature range for versatile usage in different environments.

Terminal Finish: TIN

Tin finish provides good conductivity and solderability.

Terminal Position: DUAL

Dual terminal position for flexibility in circuit connection.

Maximum Seated Height: 1.1 mm

Low profile design for compact installations.

Width: 1.25 mm

Narrow width for space-saving on PCBs.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage for energy-efficient operation.

Length: 2.05 mm

Compact length for space-saving on PCBs.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability in harsh environments.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mechanical stability.

Packing Method: TR

Tape and reel packaging for convenient handling and storage.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and high density integration.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for higher supply voltage if needed in specific applications.

Technical Specifications

Logic Gates 74LVC1G08GW-G attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1G08GW-G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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